Chain-Hau Hsu

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for packaging semiconductor device and package structure the...
- Patent number 7,855,424
- Issue date Dec 21, 2010
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 7,829,981
- Issue date Nov 9, 2010
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level chip package process
- Patent number 7,541,218
- Issue date Jun 2, 2009
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing process for optical electronic packing
- Patent number 7,294,559
- Issue date Nov 13, 2007
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package with wire-protection lid
- Patent number 7,154,053
- Issue date Dec 26, 2006
- Advanced Semiconductor Engineering Inc.
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20100013064
- Publication date Jan 21, 2010
- Chain-Hau Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL CHIP PACKAGE PROCESS
- Publication number 20070155054
- Publication date Jul 5, 2007
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging semiconductor device and package structure the...
- Publication number 20070126075
- Publication date Jun 7, 2007
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer dicing process for optical electronic packing
- Publication number 20060286773
- Publication date Dec 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Chain-Hau Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic package with wire-protection lid
- Publication number 20060201708
- Publication date Sep 14, 2006
- Chain-Hau Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY