Chan Lam Cha

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Quad package with conductive clips connected to terminals at upper...
- Patent number 11,217,511
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase half bridge driver package and methods of manufacture
- Patent number 10,396,018
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230197586
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...
- Publication number 20200343205
- Publication date Oct 29, 2020
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Package with Conductive Clips Connected to Terminals at Upper...
- Publication number 20200328140
- Publication date Oct 15, 2020
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
- Publication number 20190164873
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME INCLUDING U-NOTCH
- Publication number 20170011989
- Publication date Jan 12, 2017
- Infineon Technologies AG
- Chip King Tan
- H01 - BASIC ELECTRIC ELEMENTS

Chan Lam Cha

Person

Patents Grantslast 30 patents

Semiconductor package with metal posts from structured leadframe

Lead frame-based semiconductor package

Pressure sensor having a lidless/laminate structure

Quad package with conductive clips connected to terminals at upper...

Semiconductor device with bond pad extensions formed on molded appe...

Multi-phase half bridge driver package and methods of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

Semiconductor Packages and Methods for Manufacturing Thereof

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

Pressure Sensor

Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...

Quad Package with Conductive Clips Connected to Terminals at Upper...

Multi-Phase Half Bridge Driver Package and Methods of Manufacture

LEAD FRAME INCLUDING U-NOTCH