Chan Yoo

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for memory power management and memory devices and systems...
- Patent number 12,112,830
- Issue date Oct 8, 2024
- Eric J. Stave
- G11 - INFORMATION STORAGE
Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 12,062,607
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible reinforcement structure
- Patent number 11,990,350
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers including reinforcement structures and relate...
- Patent number 11,887,920
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 11,868,253
- Issue date Jan 9, 2024
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposers for microelectronic devices
- Patent number 11,824,010
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices, modules and systems having memory devices with vary...
- Patent number 11,789,890
- Issue date Oct 17, 2023
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 11,728,307
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory modules and memory packages including graphene layers for th...
- Patent number 11,721,742
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,658
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 11,664,291
- Issue date May 30, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tubular heat spreaders for memory modules and memory modules incorp...
- Patent number 11,589,480
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stress tuned stiffeners for micro electronics package warpage control
- Patent number 11,581,231
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible reinforcement structure
- Patent number 11,574,820
- Issue date Feb 7, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor device assemblies and systems with imp...
- Patent number 11,557,526
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for memory power management and memory devices and systems...
- Patent number 11,508,422
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- Eric J. Stave
- G11 - INFORMATION STORAGE
Information Patent Grant
Interposer, microelectronic device assembly including same and meth...
- Patent number 11,476,241
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 11,462,472
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interposer structures, microelectronic device assemblies in...
- Patent number 11,444,067
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices, modules and systems having memory devices with vary...
- Patent number 11,416,437
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 11,410,981
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 11,386,004
- Issue date Jul 12, 2022
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 11,309,285
- Issue date Apr 19, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 11,264,332
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,239,206
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20240371755
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE
- Publication number 20240355748
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20240304465
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MASK FAULT FIBER OPTICS SENSOR
- Publication number 20240284590
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20240120283
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES, MODULES AND SYSTEMS HAVING MEMORY DEVICES WITH VARY...
- Publication number 20240111707
- Publication date Apr 4, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20240111673
- Publication date Apr 4, 2024
- Lodestar Licensing Group, LLC
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20240070069
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20230335522
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20230307309
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20230187224
- Publication date Jun 15, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...
- Publication number 20230154823
- Publication date May 18, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MEMORY POWER MANAGEMENT AND MEMORY DEVICES AND SYSTEMS...
- Publication number 20230084286
- Publication date Mar 16, 2023
- Micron Technology, Inc.
- Eric J. Stave
- G11 - INFORMATION STORAGE
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20230025886
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERPOSER STRUCTURES, MICROELECTRONIC DEVICE ASSEMBLIES IN...
- Publication number 20230005904
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphics Processing Unit and High Bandwidth Memory Integration Usin...
- Publication number 20220375917
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20220344295
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20220342814
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICES, MODULES AND SYSTEMS HAVING MEMORY DEVICES WITH VARY...
- Publication number 20220335000
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20220254723
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
- Publication number 20220208736
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
- Publication number 20220149014
- Publication date May 12, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUBULAR HEAT SPREADERS FOR MEMORY MODULES AND MEMORY MODULES INCORP...
- Publication number 20220071061
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Thomas H. Kinsley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20220059508
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20220044998
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...
- Publication number 20210407882
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20210384043
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...
- Publication number 20210367057
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods for memory power management and memory devices and systems...

Low cost three-dimensional stacking semiconductor assemblies

Semiconductor devices with flexible reinforcement structure

Semiconductor device having laterally offset stacked semiconductor...

Redistribution layers including reinforcement structures and relate...

Memory device interface and method

Interposers for microelectronic devices

Semiconductor assemblies including thermal circuits and methods of...

Memory devices, modules and systems having memory devices with vary...

Dual sided fan-out package having low warpage across all temperatures

Semiconductor interconnect structures with conductive elements, and...

Memory modules and memory packages including graphene layers for th...

Semiconductor device

Semiconductor assemblies including vertically integrated circuits a...

Tubular heat spreaders for memory modules and memory modules incorp...

Stress tuned stiffeners for micro electronics package warpage control

Semiconductor devices with flexible reinforcement structure

Substrates for semiconductor device assemblies and systems with imp...

Methods for memory power management and memory devices and systems...

Interposer, microelectronic device assembly including same and meth...

Low cost three-dimensional stacking semiconductor assemblies

Semiconductor device assembly with through-package interconnect and...

Stacked interposer structures, microelectronic device assemblies in...

Memory devices, modules and systems having memory devices with vary...

Microelectronic device assemblies and packages and related methods...

Graphics processing unit and high bandwidth memory integration usin...

Memory device interface and method

Three-dimensional stacking semiconductor assemblies and methods of...

Interposers for microelectronic devices

Dual sided fan-out package having low warpage across all temperatures

Patents Applicationslast 30 patents

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

SOLDER MASK FAULT FIBER OPTICS SENSOR

INTERPOSERS FOR MICROELECTRONIC DEVICES

MEMORY DEVICES, MODULES AND SYSTEMS HAVING MEMORY DEVICES WITH VARY...

MEMORY DEVICE INTERFACE AND METHOD

MEMORY DEVICE INTERFACE AND METHOD

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...

METHODS FOR MEMORY POWER MANAGEMENT AND MEMORY DEVICES AND SYSTEMS...

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

STACKED INTERPOSER STRUCTURES, MICROELECTRONIC DEVICE ASSEMBLIES IN...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

Graphics Processing Unit and High Bandwidth Memory Integration Usin...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

MEMORY DEVICE INTERFACE AND METHOD

MEMORY DEVICES, MODULES AND SYSTEMS HAVING MEMORY DEVICES WITH VARY...

INTERPOSERS FOR MICROELECTRONIC DEVICES

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...

DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES

TUBULAR HEAT SPREADERS FOR MEMORY MODULES AND MEMORY MODULES INCORP...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...