Chandra Mohan JHA

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package wrap-around heat spreader
- Patent number 11,854,932
- Issue date Dec 26, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink cutout and insulating through silicon vias to cut thermal...
- Patent number 11,837,519
- Issue date Dec 5, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture including thermoelectric cooler structures
- Patent number 11,756,856
- Issue date Sep 12, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallization (BSM) on stacked die packages and external s...
- Patent number 11,705,417
- Issue date Jul 18, 2023
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annular silicon-embedded thermoelectric cooling devices for localiz...
- Patent number 11,694,942
- Issue date Jul 4, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D buildup of thermally conductive layers to resolve die height dif...
- Patent number 11,670,561
- Issue date Jun 6, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state thermoelectric cooler in silicon backend layers for fas...
- Patent number 11,664,293
- Issue date May 30, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integrated thermoelectric cooler
- Patent number 11,658,095
- Issue date May 23, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,626,395
- Issue date Apr 11, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bump networks for integrated circuit device assemblies
- Patent number 11,587,843
- Issue date Feb 21, 2023
- Intel Corporation
- Prasad Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular technique for die-level liquid cooling
- Patent number 11,508,645
- Issue date Nov 22, 2022
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a thermoelectric cooler to reduce heat transfer between heat-...
- Patent number 11,462,457
- Issue date Oct 4, 2022
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal assemblies for multi-chip packages
- Patent number 11,456,232
- Issue date Sep 27, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,127,727
- Issue date Sep 21, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing a thermal soluti...
- Patent number 10,607,909
- Issue date Mar 31, 2020
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package with through-mold thermally conductive structur...
- Patent number 10,541,190
- Issue date Jan 21, 2020
- Intel Corporation
- Chandra Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with an integrated heat spreader having in...
- Patent number 10,461,011
- Issue date Oct 29, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interfaces for integrated circuit packages
- Patent number 10,290,561
- Issue date May 14, 2019
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture material and process to improve thermal performance of...
- Patent number 10,121,722
- Issue date Nov 6, 2018
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,865,521
- Issue date Jan 9, 2018
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20250096178
- Publication date Mar 20, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE
- Publication number 20230081139
- Publication date Mar 16, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20220384306
- Publication date Dec 1, 2022
- Intel Corporation
- Weihua Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20210398966
- Publication date Dec 23, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...
- Publication number 20210391244
- Publication date Dec 16, 2021
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING
- Publication number 20210280497
- Publication date Sep 9, 2021
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL...
- Publication number 20210249324
- Publication date Aug 12, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...
- Publication number 20210193547
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WRAP-AROUND HEAT SPREADER
- Publication number 20210193549
- Publication date Jun 24, 2021
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A NOVEL MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING
- Publication number 20210183741
- Publication date Jun 17, 2021
- Intel Corporation
- Chandra M. JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAS...
- Publication number 20210125897
- Publication date Apr 29, 2021
- Intel Corporation
- Krishna Vasanth VALAVALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK
- Publication number 20210118756
- Publication date Apr 22, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL HEAT REMOVAL FOR 3D STACK THERMAL MANAGEMENT
- Publication number 20210104448
- Publication date Apr 8, 2021
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION (BSM) ON STACKED DIE PACKAGES AND EXTERNAL S...
- Publication number 20210104484
- Publication date Apr 8, 2021
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20210028087
- Publication date Jan 28, 2021
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...
- Publication number 20200411408
- Publication date Dec 31, 2020
- Intel Corporation
- Joe Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20200411464
- Publication date Dec 31, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20200388603
- Publication date Dec 10, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATED THERMOELECTRIC COOLER
- Publication number 20200312742
- Publication date Oct 1, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...
- Publication number 20200312741
- Publication date Oct 1, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BUMP NETWORKS FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20200194330
- Publication date Jun 18, 2020
- Intel Corporation
- Prasad Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
- Publication number 20200185300
- Publication date Jun 11, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...
- Publication number 20200176352
- Publication date Jun 4, 2020
- Intel Corporation
- Je-Young CHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...
- Publication number 20200126888
- Publication date Apr 23, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
- Publication number 20200111720
- Publication date Apr 9, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS

Chandra Mohan JHA

Person

Patents Grantslast 30 patents

Microelectronic package with solder array thermal interface materia...

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Thermally enhanced silicon back end layers for improved thermal per...

Vented lids for integrated circuit packages

Package wrap-around heat spreader

Heatsink cutout and insulating through silicon vias to cut thermal...

Package architecture including thermoelectric cooler structures

Microelectronic package with solder array thermal interface materia...

Backside metallization (BSM) on stacked die packages and external s...

Annular silicon-embedded thermoelectric cooling devices for localiz...

3D buildup of thermally conductive layers to resolve die height dif...

Solid state thermoelectric cooler in silicon backend layers for fas...

Bump integrated thermoelectric cooler

Thermal spreading management of 3D stacked integrated circuits

Thermal bump networks for integrated circuit device assemblies

Microelectronic assemblies having a cooling channel

Modular technique for die-level liquid cooling

Effective heat conduction from hotspot to heat spreader through pac...

Using a thermoelectric cooler to reduce heat transfer between heat-...

Thermal assemblies for multi-chip packages

Sloped metal features for cooling hotspots in stacked-die packages

Phase change material in substrate cavity

Die back side structures for warpage control

Thermal spreading management of 3D stacked integrated circuits

Systems, methods, and apparatuses for implementing a thermal soluti...

Stacked die package with through-mold thermally conductive structur...

Microelectronics package with an integrated heat spreader having in...

Thermal interfaces for integrated circuit packages

Architecture material and process to improve thermal performance of...

Copper nanorod-based thermal interface material (TIM)

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE

THERMAL INTERFACE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING

HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL...

3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...

PACKAGE WRAP-AROUND HEAT SPREADER

A NOVEL MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING

SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAS...

HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK

LATERAL HEAT REMOVAL FOR 3D STACK THERMAL MANAGEMENT

BACKSIDE METALLIZATION (BSM) ON STACKED DIE PACKAGES AND EXTERNAL S...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

BUMP INTEGRATED THERMOELECTRIC COOLER

THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

THERMAL BUMP NETWORKS FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...

DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...

ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY

DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION