Chandrasekhar MANDALAPU

Person

Morrisville, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for joining dissimilar materials in microelectronics
- Patent number 11,664,357
- Issue date May 30, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to Si bonding for simplified handle wafer
- Patent number 10,964,664
- Issue date Mar 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
- Publication number 20230253383
- Publication date Aug 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20210233889
- Publication date Jul 29, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar MANDALAPU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST CMP PROCESSING FOR HYBRID BONDING
- Publication number 20200035641
- Publication date Jan 30, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
- Publication number 20200013765
- Publication date Jan 9, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20190326252
- Publication date Oct 24, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar MANDALAPU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20190096842
- Publication date Mar 28, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS

Chandrasekhar MANDALAPU

Person

Patents Grantslast 30 patents

DBI to SI bonding for simplified handle wafer

Techniques for joining dissimilar materials in microelectronics

Chemical mechanical polishing for hybrid bonding

DBI to Si bonding for simplified handle wafer

Chemical mechanical polishing for hybrid bonding

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

POST CMP PROCESSING FOR HYBRID BONDING

TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING