Chandrasekhar Narayan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Expert-in-the-loop AI for materials discovery
- Patent number 12,135,927
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Petar Ristoski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cognitive horizon surveillance
- Patent number 11,663,273
- Issue date May 30, 2023
- International Business Machines Corporation
- Daniel Gruhl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Damage-free self-limiting through-substrate laser ablation
- Patent number 10,486,268
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Fuad E. Doany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube device
- Patent number 9,640,765
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube device
- Patent number 9,406,888
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES, INC.
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reprogrammable electrical fuse
- Patent number 9,058,887
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Louis C. Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Structure and method for integrated synaptic element
- Patent number 8,829,986
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Lawrence A Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic synapse
- Patent number 8,463,723
- Issue date Jun 11, 2013
- International Business Machines Corporation
- Dharmendra S. Modha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Recording head with tilted orientation
- Patent number 8,416,537
- Issue date Apr 9, 2013
- International Business Machines Corporation
- David Berman
- G11 - INFORMATION STORAGE
Information Patent Grant
Opto-thermal mask including aligned thermal dissipative layer, refl...
- Patent number 7,804,148
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Louis L. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 7,564,118
- Issue date Jul 21, 2009
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seedless wirebond pad plating
- Patent number 7,534,651
- Issue date May 19, 2009
- International Business Machines Corporation
- Chandrasekhar Narayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide polarization beam splitters and method of fabricating a w...
- Patent number 7,486,845
- Issue date Feb 3, 2009
- International Business Machines Corporation
- Charles T. Black
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 7,388,277
- Issue date Jun 17, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide polarization beam splitters and method of fabricating a w...
- Patent number 7,298,935
- Issue date Nov 20, 2007
- International Business Machines Corporation
- Charles T. Black
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reprogrammable electrical fuse
- Patent number 7,298,639
- Issue date Nov 20, 2007
- International Business Machines Corporation
- Louis C. Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Seedless wirebond pad plating
- Patent number 7,115,997
- Issue date Oct 3, 2006
- International Business Machines Corporation
- Chandrasekhar Narayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line level air gaps
- Patent number 7,084,479
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip carrier with integrated passive devices
- Patent number 7,030,481
- Issue date Apr 18, 2006
- Internation Business Machines Corporation
- Michael Patrick Chudzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip carrier with integrated passive devices
- Patent number 6,962,872
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Michael Patrick Chudzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuse structure and method to form the same
- Patent number 6,927,472
- Issue date Aug 9, 2005
- International Business Machines Corporation
- David K. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure and method to form the same
- Patent number 6,924,185
- Issue date Aug 2, 2005
- International Business Machines Corporation
- David K. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 6,856,025
- Issue date Feb 15, 2005
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for reducing thermo-mechanical stress in stack...
- Patent number 6,831,363
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistor structure and method for forming and programming...
- Patent number 6,700,161
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFT LCD active data line repair
- Patent number 6,697,037
- Issue date Feb 24, 2004
- International Business Machines Corporation
- Paul Matthew Alt
- G11 - INFORMATION STORAGE
Information Patent Grant
System for programming fuse structure by electromigration of silici...
- Patent number 6,624,499
- Issue date Sep 23, 2003
- Infineon Technologies AG
- Chandrasekharan Kothandaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 6,599,778
- Issue date Jul 29, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COGNITIVE HORIZON SURVEILLANCE
- Publication number 20210406314
- Publication date Dec 30, 2021
- International Business Machines Corporation
- Daniel Gruhl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXPERT-IN-THE-LOOP AI FOR MATERIALS GENERATION
- Publication number 20210304852
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Petar Ristoski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXPERT-IN-THE-LOOP AI FOR MATERIALS DISCOVERY
- Publication number 20210303762
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Petar Ristoski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DAMAGE-FREE SELF-LIMITING THROUGH-SUBSTRATE LASER ABLATION
- Publication number 20170157712
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Fuad E. Doany
- B32 - LAYERED PRODUCTS
Information Patent Application
CARBON NANOTUBE DEVICE
- Publication number 20160336515
- Publication date Nov 17, 2016
- GLOBALFOUNDRIES INC.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE-FREE SELF-LIMITING THROUGH-SUBSTRATE LASER ABLATION
- Publication number 20160133468
- Publication date May 12, 2016
- International Business Machines Corporation
- Fuad E. Doany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE DEVICE
- Publication number 20150041763
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Lawrence A. Clevenger
- B82 - NANO-TECHNOLOGY
Information Patent Application
RECORDING HEAD WITH TILTED ORIENTATION
- Publication number 20110109998
- Publication date May 12, 2011
- International Business Machines Corporation
- David Berman
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC SYNAPSE
- Publication number 20100223220
- Publication date Sep 2, 2010
- Internaional Business Machines Corporation
- Dharmendra S. Modha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REPROGRAMMABLE ELECTRICAL FUSE
- Publication number 20090109722
- Publication date Apr 30, 2009
- Louis C. Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
- Publication number 20080230891
- Publication date Sep 25, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE POLARIZATION BEAM SPLITTERS AND METHOD OF FABRICATING A W...
- Publication number 20080175527
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Charles T. Black
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAVEGUIDE POLARIZATION BEAM SPLITTERS AND METHOD OF FABRICATING A W...
- Publication number 20070253661
- Publication date Nov 1, 2007
- International Business Machines Corporation
- Charles T. Black
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Opto-thermal annealing mask and method
- Publication number 20070187670
- Publication date Aug 16, 2007
- International Business Machines Corporation
- Louis L. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seedless wirebond pad plating
- Publication number 20070007659
- Publication date Jan 11, 2007
- Chandrasekhar Narayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20060264036
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPROGRAMMABLE ELECTRICAL FUSE
- Publication number 20060249808
- Publication date Nov 9, 2006
- International Business Machines Corporation
- Louis C. Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20050127514
- Publication date Jun 16, 2005
- IBM
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip and wafer integration process using vertical connections
- Publication number 20050121711
- Publication date Jun 9, 2005
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEEDLESS WIREBOND PAD PLATING
- Publication number 20050104217
- Publication date May 19, 2005
- International Business Machines Corporation
- Chandrasekhar Narayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip carrier with integrated passive devices
- Publication number 20050023664
- Publication date Feb 3, 2005
- Michael Patrick Chudzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for reducing thermo-mechanical stress in stack...
- Publication number 20040113278
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip carrier with integrated passive devices
- Publication number 20040108587
- Publication date Jun 10, 2004
- Michael Patrick Chudzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fuse structure and method to form the same
- Publication number 20040070049
- Publication date Apr 15, 2004
- David K. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip and wafer integration process using vertical connections
- Publication number 20030215984
- Publication date Nov 20, 2003
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable resistor structure and method for forming and programming...
- Publication number 20030213998
- Publication date Nov 20, 2003
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PROGRAMMING FUSE STRUCTURE BY ELECTROMIGRATION OF SILICI...
- Publication number 20030160297
- Publication date Aug 28, 2003
- Chandrasekharan Kothandaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
- Publication number 20030111733
- Publication date Jun 19, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS

Chandrasekhar Narayan

Person

Patents Grantslast 30 patents

Expert-in-the-loop AI for materials discovery

Cognitive horizon surveillance

Damage-free self-limiting through-substrate laser ablation

Carbon nanotube device

Carbon nanotube device

Reprogrammable electrical fuse

Structure and method for integrated synaptic element

Electronic synapse

Recording head with tilted orientation

Opto-thermal mask including aligned thermal dissipative layer, refl...

Chip and wafer integration process using vertical connections

Seedless wirebond pad plating

Waveguide polarization beam splitters and method of fabricating a w...

Chip and wafer integration process using vertical connections

Waveguide polarization beam splitters and method of fabricating a w...

Reprogrammable electrical fuse

Seedless wirebond pad plating

Line level air gaps

Copper recess process with application to selective capping and ele...

High density chip carrier with integrated passive devices

Copper recess process with application to selective capping and ele...

High density chip carrier with integrated passive devices

Fuse structure and method to form the same

Fuse structure and method to form the same

Chip and wafer integration process using vertical connections

Structure and method for reducing thermo-mechanical stress in stack...

Variable resistor structure and method for forming and programming...

TFT LCD active data line repair

System for programming fuse structure by electromigration of silici...

Chip and wafer integration process using vertical connections

Patents Applicationslast 30 patents

COGNITIVE HORIZON SURVEILLANCE

EXPERT-IN-THE-LOOP AI FOR MATERIALS GENERATION

EXPERT-IN-THE-LOOP AI FOR MATERIALS DISCOVERY

DAMAGE-FREE SELF-LIMITING THROUGH-SUBSTRATE LASER ABLATION

CARBON NANOTUBE DEVICE

DAMAGE-FREE SELF-LIMITING THROUGH-SUBSTRATE LASER ABLATION

CARBON NANOTUBE DEVICE

RECORDING HEAD WITH TILTED ORIENTATION

ELECTRONIC SYNAPSE

REPROGRAMMABLE ELECTRICAL FUSE

CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS

WAVEGUIDE POLARIZATION BEAM SPLITTERS AND METHOD OF FABRICATING A W...

WAVEGUIDE POLARIZATION BEAM SPLITTERS AND METHOD OF FABRICATING A W...

Opto-thermal annealing mask and method

Seedless wirebond pad plating

Line level air gaps

REPROGRAMMABLE ELECTRICAL FUSE

Copper recess process with application to selective capping and ele...

Line level air gaps

Chip and wafer integration process using vertical connections

SEEDLESS WIREBOND PAD PLATING

High density chip carrier with integrated passive devices

Structure and method for reducing thermo-mechanical stress in stack...

Copper recess process with application to selective capping and ele...

High density chip carrier with integrated passive devices

Fuse structure and method to form the same

Chip and wafer integration process using vertical connections

Variable resistor structure and method for forming and programming...

SYSTEM FOR PROGRAMMING FUSE STRUCTURE BY ELECTROMIGRATION OF SILICI...

CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS