Chang Beom Yong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of TSV formation for advanced packaging
- Patent number 11,854,886
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through-silicon vias in substrates for advanced...
- Patent number 11,404,318
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias using ba...
- Patent number 9,865,524
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer in notc...
- Patent number 9,837,336
- Issue date Dec 5, 2017
- STATS ChipPAC, Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of wafer thinning involving edge tr...
- Patent number 9,728,415
- Issue date Aug 8, 2017
- STATS ChipPAC Pte. Ltd.
- Vinoth Kanna Chockanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming UBM structure on back su...
- Patent number 9,601,462
- Issue date Mar 21, 2017
- STATS ChipPAC Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit through-substrate via system with a buffer layer...
- Patent number 9,281,274
- Issue date Mar 8, 2016
- Stats Chippac Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 9,257,382
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming through-silicon-via with...
- Patent number 9,076,655
- Issue date Jul 7, 2015
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming UBM structure on back su...
- Patent number 8,809,191
- Issue date Aug 19, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer in notc...
- Patent number 8,742,591
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 8,558,389
- Issue date Oct 15, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
- Publication number 20240087958
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
- Publication number 20220328354
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...
- Publication number 20220165621
- Publication date May 26, 2022
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Wafer Thinning Involving Edge Tr...
- Publication number 20150179544
- Publication date Jun 25, 2015
- STATS ChipPAC, Ltd.
- Vinoth Kanna Chockanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias Using Ba...
- Publication number 20140300002
- Publication date Oct 9, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming UBM Structure on Back Su...
- Publication number 20140264851
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer in Notc...
- Publication number 20140225279
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Through-Silicon-Via with...
- Publication number 20140199838
- Publication date Jul 17, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130299998
- Publication date Nov 14, 2013
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer in Notc...
- Publication number 20130161824
- Publication date Jun 27, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130147055
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming UBM Structure on Back Su...
- Publication number 20130147036
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Chang Beom Yong

Person

Patents Grantslast 30 patents

Methods of TSV formation for advanced packaging

Methods of forming through-silicon vias in substrates for advanced...

Semiconductor device and method of forming conductive vias using ba...

Semiconductor device and method of forming insulating layer in notc...

Semiconductor device and method of wafer thinning involving edge tr...

Semiconductor device and method of forming UBM structure on back su...

Integrated circuit through-substrate via system with a buffer layer...

Semiconductor device and method of forming guard ring around conduc...

Semiconductor device and method of forming through-silicon-via with...

Semiconductor device and method of forming UBM structure on back su...

Semiconductor device and method of forming insulating layer in notc...

Semiconductor device and method of forming guard ring around conduc...

Patents Applicationslast 30 patents

METHODS OF TSV FORMATION FOR ADVANCED PACKAGING

METHODS OF TSV FORMATION FOR ADVANCED PACKAGING

METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...

Semiconductor Device and Method of Wafer Thinning Involving Edge Tr...

Semiconductor Device and Method of Forming Conductive Vias Using Ba...

Semiconductor Device and Method of Forming UBM Structure on Back Su...

Semiconductor Device and Method of Forming Insulating Layer in Notc...

Semiconductor Device and Method of Forming Through-Silicon-Via with...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Semiconductor Device and Method of Forming Insulating Layer in Notc...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Semiconductor Device and Method of Forming UBM Structure on Back Su...