Chang-Chi Lee

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,991,827
- Issue date May 21, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package
- Patent number 11,967,559
- Issue date Apr 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,518
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including thermal dissipation element...
- Patent number 11,127,650
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,541,198
- Issue date Jan 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,134,677
- Issue date Nov 20, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a trench penetrating a main body
- Patent number 10,056,325
- Issue date Aug 21, 2018
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,037,974
- Issue date Jul 31, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 9,917,043
- Issue date Mar 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures, semiconductor device and semiconductor device pack...
- Patent number 9,741,675
- Issue date Aug 22, 2017
- Advanced Semiconductor Engineering, Inc.
- Dao-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,589,840
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated metal pillars and manufacturi...
- Patent number 8,698,307
- Issue date Apr 15, 2014
- Advanced Semiconductor Engineering, Inc.
- Meng-Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method of manufacturing the same
- Patent number 8,035,213
- Issue date Oct 11, 2011
- Advanced Semiconductor Engineering, Inc.
- Chang-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using an active type heat-spreading element
- Patent number 8,022,534
- Issue date Sep 20, 2011
- Advanced Semiconductor Engineering, Inc.
- Tong Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting device for detecting electrical connection between pads o...
- Patent number 7,839,150
- Issue date Nov 23, 2010
- Advanced Semiconductor Engineering, Inc.
- Heng-Lung Su
- G01 - MEASURING TESTING
Information Patent Grant
System and method for testing CMOS image sensor
- Patent number 7,251,576
- Issue date Jul 31, 2007
- Advanced Semiconductor Engineering, Inc.
- Heng-Lung Su
- G01 - MEASURING TESTING
Information Patent Grant
Internet automatic electric data system
- Patent number 7,222,124
- Issue date May 22, 2007
- Advanced Semiconductor Engineering, Inc.
- I-Linag Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal enhanced ball grid array package
- Patent number 6,528,882
- Issue date Mar 4, 2003
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having specific pad distribution
- Patent number 6,403,896
- Issue date Jun 11, 2002
- Advanced Semiconductor Engineering, Inc.
- Shu Jung Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND PACKAGE STRUCTURE
- Publication number 20240155758
- Publication date May 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240130043
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240055365
- Publication date Feb 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20240038679
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240030125
- Publication date Jan 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240030135
- Publication date Jan 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240023239
- Publication date Jan 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240008184
- Publication date Jan 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20230420418
- Publication date Dec 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230268293
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230253302
- Publication date Aug 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230215810
- Publication date Jul 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230207524
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230163077
- Publication date May 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220392871
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...
- Publication number 20210265231
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265273
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190378963
- Publication date Dec 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Ming-Te LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180337130
- Publication date Nov 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180158766
- Publication date Jun 7, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170263589
- Publication date Sep 14, 2017
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170207153
- Publication date Jul 20, 2017
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170133311
- Publication date May 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACK...
- Publication number 20160211235
- Publication date Jul 21, 2016
- Advanced Semiconductor Engineering, Inc.
- Dao-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332957
- Publication date Nov 13, 2014
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED METAL PILLARS AND MANUFACTURI...
- Publication number 20120074532
- Publication date Mar 29, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- MENG-KAI SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING AN ACTIVE TYPE HEAT-SPREADING ELEMENT
- Publication number 20090250806
- Publication date Oct 8, 2009
- Advanced Semiconductor Engineering, Inc.
- Tong Hong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR...
- Publication number 20090230544
- Publication date Sep 17, 2009
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Tong Hong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package structure and method of manufacturing the same
- Publication number 20090102066
- Publication date Apr 23, 2009
- Advanced Semiconductor Engineering, Inc.
- Chang-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Chi Lee

Person

Patents Grantslast 30 patents

Electronic device

Electronic package

Semiconductor package

Semiconductor device package including thermal dissipation element...

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package having a trench penetrating a main body

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Bump structures, semiconductor device and semiconductor device pack...

Semiconductor package and manufacturing method thereof

Semiconductor package with integrated metal pillars and manufacturi...

Chip package structure and method of manufacturing the same

Semiconductor package using an active type heat-spreading element

Detecting device for detecting electrical connection between pads o...

System and method for testing CMOS image sensor

Internet automatic electric data system

Thermal enhanced ball grid array package

Substrate having specific pad distribution

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND PACKAGE STRUCTURE

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICES

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICES

ELECTRONIC DEVICE

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACK...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH INTEGRATED METAL PILLARS AND MANUFACTURI...

SEMICONDUCTOR PACKAGE USING AN ACTIVE TYPE HEAT-SPREADING ELEMENT

HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR...

Chip package structure and method of manufacturing the same