Chang-Sheng TSAO

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking
- Patent number 12,211,727
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,621,186
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,094,575
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,889,097
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Chen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and image sensor
- Patent number 10,868,072
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,569,520
- Issue date Feb 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,155,369
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Isolation structures and methods of forming the same
- Patent number 9,646,870
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form multiple trenches utilizing a grayscale mask
- Patent number 9,012,244
- Issue date Apr 21, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures and methods of forming the same
- Patent number 8,969,997
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng Tsao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Sidewall spacer for semiconductor device and fabrication method the...
- Patent number 7,220,650
- Issue date May 22, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rong-Hui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dismounting device for golf cart wheel
- Patent number 5,529,385
- Issue date Jun 25, 1996
- Chang-Feng Tsao
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20250118587
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20230238268
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20210335646
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20210242043
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20200381283
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20200108592
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20190118522
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20180147825
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND IMAGE SENSOR
- Publication number 20170221940
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20150170957
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Form Multiple Trenches Utilizing a Grayscale Mask
- Publication number 20140134757
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Lin-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20140131829
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing isolation structures in a semiconductor de...
- Publication number 20050277262
- Publication date Dec 15, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng Tsao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Sidewall spacer for semiconductor device and fabrication method the...
- Publication number 20050227446
- Publication date Oct 13, 2005
- Rong-Hui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for implementing poly pre-doping in deep sub-micron process
- Publication number 20050118802
- Publication date Jun 2, 2005
- Chang-Sheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Sheng TSAO

Person

Patents Grantslast 30 patents

Simultaneous bonding approach for high quality wafer stacking

Fully automated wafer debonding system and method thereof

Simultaneous bonding approach for high quality wafer stacking appli...

Simultaneous bonding approach for high quality wafer stacking appli...

Wafer debonding system and method

Semiconductor structure and image sensor

Wafer debonding system and method

Wafer debonding system and method

Isolation structures and methods of forming the same

Method to form multiple trenches utilizing a grayscale mask

Isolation structures and methods of forming the same

Sidewall spacer for semiconductor device and fabrication method the...

Dismounting device for golf cart wheel

Patents Applicationslast 30 patents

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

WAFER DEBONDING SYSTEM AND METHOD

WAFER DEBONDING SYSTEM AND METHOD

WAFER DEBONDING SYSTEM AND METHOD

SEMICONDUCTOR STRUCTURE AND IMAGE SENSOR

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

Method to Form Multiple Trenches Utilizing a Grayscale Mask

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

Method for manufacturing isolation structures in a semiconductor de...

Sidewall spacer for semiconductor device and fabrication method the...

Method for implementing poly pre-doping in deep sub-micron process