Chang-Yueh Chan

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Setting method for a tire detection data transmission system
- Patent number 9,527,351
- Issue date Dec 27, 2016
- Orange Electronic Co., Ltd.
- Chin-Yao Hsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package structure having MEMS element
- Patent number 9,254,994
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating leadframe-based semiconductor package with c...
- Patent number 9,130,064
- Issue date Sep 8, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element
- Patent number 8,866,236
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,716,070
- Issue date May 6, 2014
- Siliconware Precision Industries Co. Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package having MEMS element and fabrication method thereof
- Patent number 8,653,661
- Issue date Feb 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadframe-based semiconductor package
- Patent number 8,618,641
- Issue date Dec 31, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having micro-electromechanical element
- Patent number 8,564,115
- Issue date Oct 22, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
LED package structure and fabrication method thereof
- Patent number 8,471,284
- Issue date Jun 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,420,430
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having micro-electromechanical element and fabric...
- Patent number 8,198,689
- Issue date Jun 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having MEMS element and fabrication method thereof
- Patent number 8,154,115
- Issue date Apr 10, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor-type semiconductor package and fabrication method thereof
- Patent number 7,858,446
- Issue date Dec 28, 2010
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SETTING METHOD FOR A TIRE DETECTION DATA TRANSMISSION SYSTEM
- Publication number 20150328943
- Publication date Nov 19, 2015
- ORANGE ELECTRONIC CO., LTD.
- Chin-Yao HSU
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20150102433
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20140080264
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIRE DETECTION DATA TRANSMISSION SYSTEM AND THE SETTING METHOD THEREOF
- Publication number 20140011455
- Publication date Jan 9, 2014
- Chin-Yao HSU
- B60 - VEHICLES IN GENERAL
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20130203200
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20120286425
- Publication date Nov 15, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20120286308
- Publication date Nov 15, 2012
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT
- Publication number 20120241937
- Publication date Sep 27, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120168777
- Publication date Jul 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND P...
- Publication number 20120127693
- Publication date May 24, 2012
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110177643
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110175179
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRIC...
- Publication number 20110156180
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090166831
- Publication date Jul 2, 2009
- Siliconware Precision Industries Co., Ltd.
- Tse-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor semiconductor device and method for fabricating the same
- Publication number 20090057799
- Publication date Mar 5, 2009
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20090039488
- Publication date Feb 12, 2009
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor-type package and method for fabricating the same
- Publication number 20090039527
- Publication date Feb 12, 2009
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor package and method for fabricating the same
- Publication number 20080303111
- Publication date Dec 11, 2008
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor semiconductor device and manufacturing method thereof
- Publication number 20080296716
- Publication date Dec 4, 2008
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor device having leads and method for fabrica...
- Publication number 20080283982
- Publication date Nov 20, 2008
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor-type semiconductor device and manufacturing method thereof
- Publication number 20080237767
- Publication date Oct 2, 2008
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor-type semiconductor package and method for fabricating the same
- Publication number 20080203511
- Publication date Aug 28, 2008
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor semiconductor device and manufacturing method thereof
- Publication number 20080197438
- Publication date Aug 21, 2008
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor semiconductor package and fabrication
- Publication number 20080185671
- Publication date Aug 7, 2008
- Siliconware Precision Inductries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor-type semiconductor package and fabrication
- Publication number 20080105941
- Publication date May 8, 2008
- Siliconware Precision Industries Co., Ltd.
- Tse-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor-type semiconductor package and fabrication method thereof
- Publication number 20080105942
- Publication date May 8, 2008
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Yueh Chan

Person

Patents Grantslast 30 patents

Setting method for a tire detection data transmission system

Package structure having MEMS element

Method for fabricating leadframe-based semiconductor package with c...

Package structure having MEMS element

Fabrication method of package structure having MEMS element

Package having MEMS element and fabrication method thereof

Leadframe-based semiconductor package

Package structure having micro-electromechanical element

LED package structure and fabrication method thereof

Fabrication method of package structure having MEMS element

Package structure having micro-electromechanical element and fabric...

Package structure having MEMS element and fabrication method thereof

Sensor-type semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

SETTING METHOD FOR A TIRE DETECTION DATA TRANSMISSION SYSTEM

PACKAGE STRUCTURE HAVING MEMS ELEMENT

METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE

TIRE DETECTION DATA TRANSMISSION SYSTEM AND THE SETTING METHOD THEREOF

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

PACKAGE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT

LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND P...

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

PACKAGE STRUCTURE HAVING MEMS ELEMENT

PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRIC...

SENSOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Sensor semiconductor device and method for fabricating the same

Semiconductor package and method for fabricating the same

Sensor-type package and method for fabricating the same

Sensor package and method for fabricating the same

Sensor semiconductor device and manufacturing method thereof

Multi-chip semiconductor device having leads and method for fabrica...

Sensor-type semiconductor device and manufacturing method thereof

Sensor-type semiconductor package and method for fabricating the same

Sensor semiconductor device and manufacturing method thereof

Sensor semiconductor package and fabrication

Sensor-type semiconductor package and fabrication

Sensor-type semiconductor package and fabrication method thereof