Changhan Yun

Person

Cambridge, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising an integrated passive device configured as a cap...
- Patent number 12,016,247
- Issue date Jun 18, 2024
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Metal-insulator-metal (MIM) capacitor structure for layer count red...
- Patent number 12,009,292
- Issue date Jun 11, 2024
- QUALCOMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable circuit including integrated filter circuit coupled to vari...
- Patent number 11,770,115
- Issue date Sep 26, 2023
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip modules employing conductive pillars to couple a passive compo...
- Patent number 11,728,293
- Issue date Aug 15, 2023
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, package and/or substrate comprising curved antenna
- Patent number 11,658,403
- Issue date May 23, 2023
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked inductor having a discrete metal-stack pattern
- Patent number 11,626,236
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance fine tuning by fin capacitor design
- Patent number 11,515,247
- Issue date Nov 29, 2022
- QUALCOMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising capacitor configured for power amplifier outpu...
- Patent number 11,502,652
- Issue date Nov 15, 2022
- QUALCOMM Incorporated
- Daniel Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond inductor structures for flip chip dies
- Patent number 11,239,158
- Issue date Feb 1, 2022
- QUALCOMM Incorporated
- Paragkumar Ajaybhai Thadesar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband filter with resonators and inductors
- Patent number 11,121,699
- Issue date Sep 14, 2021
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance inductors
- Patent number 11,024,454
- Issue date Jun 1, 2021
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid passive-on-glass (POG) acoustic filter
- Patent number 10,944,379
- Issue date Mar 9, 2021
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,903,240
- Issue date Jan 26, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid structure with conductive pillar technology
- Patent number 10,693,432
- Issue date Jun 23, 2020
- QUALCOMMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors formed with through glass vias
- Patent number 10,614,942
- Issue date Apr 7, 2020
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive-on-glass (POG) device and method
- Patent number 10,607,980
- Issue date Mar 31, 2020
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of through glass via (TGV) filter and acoustic filter
- Patent number 10,582,609
- Issue date Mar 3, 2020
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D pillar inductor
- Patent number 10,553,671
- Issue date Feb 4, 2020
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,523,253
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device comprising a capacitor and inductor structure com...
- Patent number 10,498,307
- Issue date Dec 3, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional structure to form an embedded three-dimensional str...
- Patent number 10,490,348
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close proximity tunable inductive elements
- Patent number 10,490,621
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Paragkumar Ajaybhai Thadesar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional high quality passive structure with conductive pi...
- Patent number 10,433,425
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Kai Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array (LGA) packaging of passive-on-glass (POG) structure
- Patent number 10,361,149
- Issue date Jul 23, 2019
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying thickness inductor
- Patent number 10,354,795
- Issue date Jul 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,332,911
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid inductor
- Patent number 10,332,671
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and method of making same
- Patent number 10,319,694
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Daniel Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an embedded inductor and a thin film magnetic...
- Patent number 10,290,414
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...
- Publication number 20240321724
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Doosoub SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...
- Publication number 20240297165
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER
- Publication number 20240097648
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIE EDGE PROTECTION TO ELIMINATE DIE CHIPPING
- Publication number 20230352423
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Sameer Sunil VADHAVKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND D...
- Publication number 20230230910
- Publication date Jul 20, 2023
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT RED...
- Publication number 20230187340
- Publication date Jun 15, 2023
- QUALCOMM Incorporated
- Nosun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES
- Publication number 20230082743
- Publication date Mar 16, 2023
- RF360 Europe GmbH
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INDUCTOR HAVING A DISCRETE METAL-STACK PATTERN
- Publication number 20220285080
- Publication date Sep 8, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULES EMPLOYING CONDUCTIVE PILLARS TO COUPLE A PASSIVE COMPO...
- Publication number 20220246552
- Publication date Aug 4, 2022
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE
- Publication number 20220248541
- Publication date Aug 4, 2022
- QUALCOMM Incorporated
- Daniel Daeik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE FINE TUNING BY FIN CAPACITOR DESIGN
- Publication number 20220223516
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Nosun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE CIRCUIT INCLUDING INTEGRATED FILTER CIRCUIT COUPLED TO VARI...
- Publication number 20220123735
- Publication date Apr 21, 2022
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED PASSIVE DEVICE CONFIGURED AS A CAP...
- Publication number 20220069193
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DEVICE, PACKAGE AND/OR SUBSTRATE COMPRISING CURVED ANTENNA
- Publication number 20220069453
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER OUTPU...
- Publication number 20210351750
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Daniel Daeik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND FILTER WITH RESONATORS AND INDUCTORS
- Publication number 20210257989
- Publication date Aug 19, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTERCONNECT
- Publication number 20200388604
- Publication date Dec 10, 2020
- QUALCOMM Incorporated
- Byoungyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND FILTER WITH RESONATORS AND INDUCTORS
- Publication number 20200266512
- Publication date Aug 20, 2020
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES
- Publication number 20200091094
- Publication date Mar 19, 2020
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INDUCTORS FORMED WITH THROUGH GLASS VIAS
- Publication number 20200020473
- Publication date Jan 16, 2020
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY
- Publication number 20190356294
- Publication date Nov 21, 2019
- QUALCOMM Incorporated
- Nosun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
- Publication number 20190259780
- Publication date Aug 22, 2019
- Qualcomm Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER
- Publication number 20190132942
- Publication date May 2, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...
- Publication number 20190081607
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED CIRCUIT WAFERS
- Publication number 20190035621
- Publication date Jan 31, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180316374
- Publication date Nov 1, 2018
- Qualcomm Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL
- Publication number 20180177052
- Publication date Jun 21, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER
- Publication number 20180167054
- Publication date Jun 14, 2018
- QUALCOMM Incorporated
- David Francis Berdy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PASSIVE-ON-GLASS (POG) DEVICE AND METHOD
- Publication number 20180145062
- Publication date May 24, 2018
- Qualcomm Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT
- Publication number 20180090475
- Publication date Mar 29, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS

Changhan Yun

Person

Patents Grantslast 30 patents

Package comprising an integrated passive device configured as a cap...

Metal-insulator-metal (MIM) capacitor structure for layer count red...

Tunable circuit including integrated filter circuit coupled to vari...

Chip modules employing conductive pillars to couple a passive compo...

Device, package and/or substrate comprising curved antenna

Stacked inductor having a discrete metal-stack pattern

Capacitance fine tuning by fin capacitor design

Substrate comprising capacitor configured for power amplifier outpu...

Wire bond inductor structures for flip chip dies

Wideband filter with resonators and inductors

High performance inductors

Hybrid passive-on-glass (POG) acoustic filter

Integrated circuits (ICs) on a glass substrate

Solenoid structure with conductive pillar technology

Inductors formed with through glass vias

Passive-on-glass (POG) device and method

Integration of through glass via (TGV) filter and acoustic filter

3D pillar inductor

Glass substrate including passive-on-glass device and semiconductor...

Integrated device comprising a capacitor and inductor structure com...

Two-dimensional structure to form an embedded three-dimensional str...

Close proximity tunable inductive elements

Three-dimensional high quality passive structure with conductive pi...

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Varying thickness inductor

Integrated circuits (ICs) on a glass substrate

Solenoid inductor

Backside drill embedded die substrate

Semiconductor assembly and method of making same

Substrate comprising an embedded inductor and a thin film magnetic...

Patents Applicationslast 30 patents

METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...

DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER

DIE EDGE PROTECTION TO ELIMINATE DIE CHIPPING

DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND D...

METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT RED...

INTEGRATED PASSIVE DEVICES

STACKED INDUCTOR HAVING A DISCRETE METAL-STACK PATTERN

CHIP MODULES EMPLOYING CONDUCTIVE PILLARS TO COUPLE A PASSIVE COMPO...

SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE

CAPACITANCE FINE TUNING BY FIN CAPACITOR DESIGN

TUNABLE CIRCUIT INCLUDING INTEGRATED FILTER CIRCUIT COUPLED TO VARI...

PACKAGE COMPRISING AN INTEGRATED PASSIVE DEVICE CONFIGURED AS A CAP...

DEVICE, PACKAGE AND/OR SUBSTRATE COMPRISING CURVED ANTENNA

SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER OUTPU...

WIDEBAND FILTER WITH RESONATORS AND INDUCTORS

MULTI-DIE INTERCONNECT

WIDEBAND FILTER WITH RESONATORS AND INDUCTORS

INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES

INDUCTORS FORMED WITH THROUGH GLASS VIAS

SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY

INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE

INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER

INTEGRATED DEVICE COMPRISING A CAPACITOR AND INDUCTOR STRUCTURE COM...

SHAPED CIRCUIT WAFERS

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL

HYBRID PASSIVE-ON-GLASS (POG) ACOUSTIC FILTER

PASSIVE-ON-GLASS (POG) DEVICE AND METHOD

BACKSIDE GROUND PLANE FOR INTEGRATED CIRCUIT