Changhao QUAN

Person

Hefei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Injection mould and injection moulding method
- Patent number 12,186,952
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun He
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Injection mould and injection moulding method
- Patent number 11,820,058
- Issue date Nov 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun He
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer, semiconductor device and method for manufacturing the same
- Patent number 11,342,236
- Issue date May 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
- Publication number 20240014188
- Publication date Jan 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240014189
- Publication date Jan 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240014196
- Publication date Jan 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20230395441
- Publication date Dec 7, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230014834
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOULD AND INJECTION MOULDING METHOD
- Publication number 20210402660
- Publication date Dec 30, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jun He
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20210343548
- Publication date Nov 4, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jie LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOULD AND INJECTION MOULDING METHOD
- Publication number 20210339443
- Publication date Nov 4, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jun HE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210217674
- Publication date Jul 15, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Changhao QUAN

Person

Patents Grantslast 30 patents

Injection mould and injection moulding method

Injection mould and injection moulding method

Wafer, semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

INJECTION MOULD AND INJECTION MOULDING METHOD

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

INJECTION MOULD AND INJECTION MOULDING METHOD

WAFER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME