Chanon Suwankasab

Person

Pathumthani, TH

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having lead frame with semiconductor die and...
- Patent number 12,125,771
- Issue date Oct 22, 2024
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic package and method of fabrication
- Patent number 11,482,478
- Issue date Oct 25, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, device package, and method of fabrication
- Patent number 11,114,239
- Issue date Sep 7, 2021
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integral EMI shield
- Patent number 11,049,817
- Issue date Jun 29, 2021
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit semiconductor device
- Patent number 10,790,220
- Issue date Sep 29, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor module with blade insert
- Patent number 10,340,211
- Issue date Jul 2, 2019
- NXP B.V.
- Chanon Suwankasab
- G01 - MEASURING TESTING
Information Patent Grant
Method of mounting passive electronic component on lead frame
- Patent number 9,721,877
- Issue date Aug 1, 2017
- Nexperia B.V.
- Chanon Suwankasab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin shrink outline package (TSOP)
- Patent number 9,257,374
- Issue date Feb 9, 2016
- NXP B.V.
- Chanon Suwankasab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SEMICONDUCTOR DIE AND...
- Publication number 20230178457
- Publication date Jun 8, 2023
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20220028766
- Publication date Jan 27, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION
- Publication number 20210151251
- Publication date May 20, 2021
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRAL EMI SHIELD
- Publication number 20200273810
- Publication date Aug 27, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT SEMICONDCUTOR DEVICE
- Publication number 20200126895
- Publication date Apr 23, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH PLATED LEAD TIPS
- Publication number 20190229044
- Publication date Jul 25, 2019
- NXP B.V.
- AMORNTHEP SAIYAJITARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Wire Connection
- Publication number 20170133342
- Publication date May 11, 2017
- NXP B.V.
- Wiwat Tanwongwan
- H01 - BASIC ELECTRIC ELEMENTS

Chanon Suwankasab

Person

Patents Grantslast 30 patents

Semiconductor package having lead frame with semiconductor die and...

Shielded electronic package and method of fabrication

Electronic device, device package, and method of fabrication

Semiconductor device with integral EMI shield

Press-fit semiconductor device

Sensor module with blade insert

Method of mounting passive electronic component on lead frame

Thin shrink outline package (TSOP)

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SEMICONDUCTOR DIE AND...

SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE WITH INTEGRAL EMI SHIELD

PRESS-FIT SEMICONDCUTOR DEVICE

LEAD FRAME WITH PLATED LEAD TIPS

Bond Wire Connection