CHAO-KUN HU

Person

Somers, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrode with alloy interface
- Patent number 11,557,482
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve reliability in Cu interconnects using Cu inte...
- Patent number 10,943,863
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve reliability in Cu interconnects using Cu inte...
- Patent number 10,818,590
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 10,580,740
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve reliability in Cu interconnects using Cu inte...
- Patent number 10,461,026
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 10,192,829
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration test structure for Cu barrier integrity and blech...
- Patent number 9,759,766
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 9,754,891
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration test structure for Cu barrier integrity and blech...
- Patent number 9,472,477
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Copper interconnect with CVD liner and metallic cap
- Patent number 9,111,938
- Issue date Aug 18, 2015
- International Business Machines Corporation
- Frieder H. Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect with CVD liner and metallic cap
- Patent number 9,059,176
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Frieder Hainrich Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous/non-uniform metal cap structure and process for inter...
- Patent number 8,889,546
- Issue date Nov 18, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous/non-uniform metal cap structure and process for inter...
- Patent number 8,823,176
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic capped interconnect structure with high electromigration r...
- Patent number 8,796,853
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a via with a via gouging feature and...
- Patent number 8,232,196
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnect structure for integrated circuits having enhanced elec...
- Patent number 8,232,646
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient interconnect structure for electrical fuse applications
- Patent number 8,133,767
- Issue date Mar 13, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for integrated circuits having improved elec...
- Patent number 8,056,039
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures of and methods and tools for forming in-situ metallic/di...
- Patent number 8,039,966
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structures comprising capping layers with low dielectr...
- Patent number 8,026,166
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen-containing metal cap for interconnect structures
- Patent number 8,013,446
- Issue date Sep 6, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient interconnect structure for electrical fuse applications
- Patent number 7,893,520
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming electrically blown metal fuses for...
- Patent number 7,737,528
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of copper w...
- Patent number 7,468,320
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing electromigration lifetime and current density in IC usin...
- Patent number 7,439,173
- Issue date Oct 21, 2008
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing electromigration lifetime and current density in IC usin...
- Patent number 7,301,236
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip Cu interconnection using 1 to 5 nm thick metal cap
- Patent number 7,247,946
- Issue date Jul 24, 2007
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated interconnection structures on integrated circuit chips
- Patent number 6,946,716
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTERCONNECT WITH A RELIABILITY LINER IN WIDE FEATURES
- Publication number 20210257299
- Publication date Aug 19, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode with Alloy Interface
- Publication number 20210104406
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...
- Publication number 20200006226
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...
- Publication number 20200006227
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20190148303
- Publication date May 16, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...
- Publication number 20180005939
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20170358533
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION TEST STRUCTURE FOR CU BARRIER INTEGRITY AND BLECH...
- Publication number 20170176514
- Publication date Jun 22, 2017
- International Business Machines Corporation
- GRISELDA BONILLA
- G01 - MEASURING TESTING
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20170084540
- Publication date Mar 23, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
- Publication number 20150061135
- Publication date Mar 5, 2015
- International Business Machines Corporation
- Frieder H. Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
- Publication number 20130277842
- Publication date Oct 24, 2013
- International Business Machines Corporation
- Frieder Hainrich Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC CAPPED INTERCONNECT STRUCTURE WITH HIGH ELECTROMIGRATION R...
- Publication number 20130221527
- Publication date Aug 29, 2013
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTER...
- Publication number 20120329271
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING A VIA WITH A VIA GOUGING FEATURE AND...
- Publication number 20120199976
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING ENHANCED ELEC...
- Publication number 20110175226
- Publication date Jul 21, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING A VIA WITH A VIA GOUGING FEATURE AND...
- Publication number 20110100697
- Publication date May 5, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT INTERCONNECT STRUCTURE FOR ELECTRICAL FUSE APPLICATIONS
- Publication number 20110092031
- Publication date Apr 21, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES OF AND METHODS AND TOOLS FOR FORMING IN-SITU METALLIC/DI...
- Publication number 20110049716
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTER...
- Publication number 20100084767
- Publication date Apr 8, 2010
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITROGEN-CONTAINING METAL CAP FOR INTERCONNECT STRUCTURES
- Publication number 20100038782
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...
- Publication number 20100038793
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...
- Publication number 20090294901
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...
- Publication number 20090294973
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT INTERCONNECT STRUCTURE FOR ELECTRICAL FUSE APPLICATIONS
- Publication number 20090278229
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...
- Publication number 20090142924
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...
- Publication number 20080026567
- Publication date Jan 31, 2008
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...
- Publication number 20070087555
- Publication date Apr 19, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-chip Cu interconnection using 1 to 5 nm thick metal cap
- Publication number 20060160350
- Publication date Jul 20, 2006
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20060017169
- Publication date Jan 26, 2006
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduced electromigration and stressed induced migration of copper w...
- Publication number 20050266673
- Publication date Dec 1, 2005
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS

CHAO-KUN HU

Person

Patents Grantslast 30 patents

Electrode with alloy interface

Techniques to improve reliability in Cu interconnects using Cu inte...

Techniques to improve reliability in Cu interconnects using Cu inte...

Low-temperature diffusion doping of copper interconnects independen...

Techniques to improve reliability in Cu interconnects using Cu inte...

Low-temperature diffusion doping of copper interconnects independen...

Electromigration test structure for Cu barrier integrity and blech...

Low-temperature diffusion doping of copper interconnects independen...

Electromigration test structure for Cu barrier integrity and blech...

Copper interconnect with CVD liner and metallic cap

Copper interconnect with CVD liner and metallic cap

Discontinuous/non-uniform metal cap structure and process for inter...

Discontinuous/non-uniform metal cap structure and process for inter...

Metallic capped interconnect structure with high electromigration r...

Interconnect structure having a via with a via gouging feature and...

Interconnect structure for integrated circuits having enhanced elec...

Efficient interconnect structure for electrical fuse applications

Interconnect structure for integrated circuits having improved elec...

Structures of and methods and tools for forming in-situ metallic/di...

Interconnect structures comprising capping layers with low dielectr...

Nitrogen-containing metal cap for interconnect structures

Efficient interconnect structure for electrical fuse applications

Structure and method of forming electrically blown metal fuses for...

Reduced electromigration and stressed induced migration of copper w...

Increasing electromigration lifetime and current density in IC usin...

Increasing electromigration lifetime and current density in IC usin...

On-chip Cu interconnection using 1 to 5 nm thick metal cap

Copper recess process with application to selective capping and ele...

Copper recess process with application to selective capping and ele...

Electroplated interconnection structures on integrated circuit chips

Patents Applicationslast 30 patents

HYBRID INTERCONNECT WITH A RELIABILITY LINER IN WIDE FEATURES

Electrode with Alloy Interface

Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...

Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

Techniques to Improve Reliability in Cu Interconnects Using Cu Inte...

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

ELECTROMIGRATION TEST STRUCTURE FOR CU BARRIER INTEGRITY AND BLECH...

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP

COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP

METALLIC CAPPED INTERCONNECT STRUCTURE WITH HIGH ELECTROMIGRATION R...

DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTER...

INTERCONNECT STRUCTURE HAVING A VIA WITH A VIA GOUGING FEATURE AND...

INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING ENHANCED ELEC...

INTERCONNECT STRUCTURE HAVING A VIA WITH A VIA GOUGING FEATURE AND...

EFFICIENT INTERCONNECT STRUCTURE FOR ELECTRICAL FUSE APPLICATIONS

STRUCTURES OF AND METHODS AND TOOLS FOR FORMING IN-SITU METALLIC/DI...

DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTER...

NITROGEN-CONTAINING METAL CAP FOR INTERCONNECT STRUCTURES

INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...

STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...

INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...

EFFICIENT INTERCONNECT STRUCTURE FOR ELECTRICAL FUSE APPLICATIONS

REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...

INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...

INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...

On-chip Cu interconnection using 1 to 5 nm thick metal cap

Electroplated interconnection structures on integrated circuit chips

Reduced electromigration and stressed induced migration of copper w...