Chao-Ming Tseng

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Kaohsiung County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Leadless lead-frame
- Patent number 7,514,771
- Issue date Apr 7, 2009
- Advanced Semiconductor Engineering, Inc.
- Chao-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package
- Patent number 7,193,302
- Issue date Mar 20, 2007
- Advanced Semiconductor Engineering, Inc.
- Chao-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYLACTIC ACID RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20190127573
- Publication date May 2, 2019
- Advanced Semiconductor Engineering, Inc.
- Chean-Cheng SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080088002
- Publication date Apr 17, 2008
- Advanced Semiconductor Engineering, Inc.
- Chao-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless lead-frame
- Publication number 20070164406
- Publication date Jul 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Chao-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing leadless semiconductor packages
- Publication number 20050218499
- Publication date Oct 6, 2005
- Advanced Semiconductor Engineering, Inc.
- Chi-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless semiconductor package
- Publication number 20050139970
- Publication date Jun 30, 2005
- Advanced Semiconductor Engineering, Inc.
- Chao-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS