Chao-Tsung Tseng

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method of making the same
- Patent number 11,552,014
- Issue date Jan 10, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate and method for manufacturing the same
- Patent number 10,475,765
- Issue date Nov 12, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 9,972,599
- Issue date May 15, 2018
- Phoenix Pioneer Technology Co., Ltd.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stucture and method of fabricating the same
- Patent number 9,905,503
- Issue date Feb 27, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC carrier of semiconductor package and manufacturing method thereof
- Patent number 9,806,012
- Issue date Oct 31, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package apparatus and manufacturing method thereof
- Patent number 9,583,436
- Issue date Feb 28, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chao-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mute circuits
- Patent number 8,340,320
- Issue date Dec 25, 2012
- Mediatek Inc.
- Chao-Wei Tseng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220238425
- Publication date Jul 28, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210159151
- Publication date May 27, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chao-Tsung Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20200161234
- Publication date May 21, 2020
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074260
- Publication date Mar 7, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261578
- Publication date Sep 13, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Carrier of Semiconductor Package and Manufacturing Method Thereof
- Publication number 20170162492
- Publication date Jun 8, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20160190059
- Publication date Jun 30, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHAO-TSUNG TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160181193
- Publication date Jun 23, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150359096
- Publication date Dec 10, 2015
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MUTE CIRCUITS
- Publication number 20100128886
- Publication date May 27, 2010
- MEDIATEK INC.
- Chao-Wei TSENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
- Publication number 20090236707
- Publication date Sep 24, 2009
- MEDIATEK INC.
- Nan-Cheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
- Publication number 20080080142
- Publication date Apr 3, 2008
- MEDIATEK INC.
- Nan-Cheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chao-Tsung Tseng

Person

Patents Grantslast 30 patents

Semiconductor package structure and method of making the same

Interposer substrate and method for manufacturing the same

Package structure and method of manufacturing the same

Package stucture and method of fabricating the same

IC carrier of semiconductor package and manufacturing method thereof

Package apparatus and manufacturing method thereof

Mute circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

SENSING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

INTERPOSER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

IC Carrier of Semiconductor Package and Manufacturing Method Thereof

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MUTE CIRCUITS

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING