Patent Application
20080080142
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
Referring to
The printed circuit board 120 is disposed in the casing 110 and comprises a first metal ground layer 121, a second metal ground layer 122, and a plurality of metal connecting portions 123. The first metal ground layer 121 is disposed on the printed circuit board 120 opposite the second metal ground layer 122. The metal connecting portions 123 are respectively connected between the first metal ground layer 121 and the second metal ground layer 122. The second metal ground layer 122 is connected to the casing 110. In this embodiment, the casing 110 comprises a protrusion 111 to which the second metal ground layer 122 is connected. Moreover, each metal connecting portion 123 may be a through hole with an inner wall coated with metal. Additionally, the printed circuit board 120 may be a multilayer printed circuit board.
The chip 130 is electrically connected to the printed circuit board 120 and comprises a die 131, a heat-conducting portion 132, and a molding plastic 133. The heat-conducting portion 132 is connected to the die 131 and is soldered with the first metal ground layer 121 of the printed circuit board 120. The molding plastic 133 covers the die 131. Specifically, the first metal ground layer 121 is often coated with a solder mask S. To solder the heat-conducting portion 132 of the chip 130 with the first metal ground layer 121, the first metal ground layer 121 comprises a top solder mask opening 121a formed thereon. The heat-conducting portion 132 is soldered with the first metal ground layer 121 through the top solder mask opening 121a.
The conductive element 140 is connected between the protrusion 111 of the casing 110 and the second metal ground layer 122 of the printed circuit board 120. Similarly, the second metal ground layer 122 is often coated with a solder mask S. The second metal ground layer 122 comprises a bottom solder mask opening 122a formed thereon. The conductive element 140 is connected to the second metal ground layer 122 through the bottom solder mask opening 122a. Additionally, the conductive element 140 may comprise electric and/or thermal conductors. For example, the conductive element 140 may comprise conductive glue, a conductive tape, or a thermal pad.
Moreover, the chip 130 may be a chip with lead-frame package or ball grid array package. Specifically, when the chip 130 is a chip with lead-frame package, such as a chip with low profile plastic quad flat package (LQFP), the heat-conducting portion 132 thereof is an exposed die pad connected to the die 131. Here, the exposed die pad is composed of metal, such as aluminum. In another aspect, when the chip 130 is a chip with ball grid array package, such as a chip with flip chip ball grid array package (FCBGA package), the heat-conducting portion 132 thereof is formed by a plurality of thermal ground balls connected to the die 131.
When the die 131 of the chip 130 is in operation, heat generated thereby is conducted to the casing 110 sequentially through the heat-conducting portion 132, first metal ground layer 121, metal connecting portions 123, second metal ground layer 122, and conductive element 140 and is further transmitted to the exterior of the electronic device 100.
Accordingly, as the heat generated by the die 131 is not distributed over the molding plastic 133 but conducted to the casing 110 through the heat-conducting portion 132, first metal ground layer 121, metal connecting portions 123, second metal ground layer 122, and conductive element 140, the value of the coefficient (k) of thermal conduction is significantly increased. Additionally, the temperature difference (ΔT) between the die 131 and the casing 110 is larger than the temperature difference between the die 131 and the molding plastic 133. Thus, the thermal conduction rate (Q/t) is increased and the ability of heat spread or dissipation from the die 131 (or chip 130) is enhanced. Moreover, neither a heat sink nor a fan is required for the disclosed electronic device. Thus, the overall size and manufacturing costs of the electronic device 100 are significantly reduced.
More specifically, as the first metal ground layer 121 is connected to the second metal ground layer 122 through a shortest conduction path (metal connecting portions 123) and the second metal ground layer 122 is connected to the casing 110, static electricity in the printed circuit board 120 is easily conducted to the casing 110, effectively enhancing electrostatic discharge (ESD) protection in the electronic device 100. Thus, time, effort, and test equipment for solving issues of electrostatic discharge (ESD) are not required, further reducing the manufacturing costs of the electronic device 100.
Moreover, the electronic device 100 may selectively omit the conductive element 140. Namely, the protrusion 111 of the casing 110 may be directly connected to the second metal ground layer 122 through the bottom solder mask opening 122a, achieving the effect described.
Elements corresponding to those in the first embodiment share the same reference numerals.
Referring to
When the conduction base 150 comprises an electric conductor, such as metal, heat spread or dissipation from the die 131 (or chip 130) and electrostatic discharge (ESD) protection in the electronic device 100′ are effectively enhanced. In another aspect, when the conduction base 150 comprises a thermal conductor, such as an insulating thermal pad, heat spread or dissipation from the die 131 (or chip 130) is effectively enhanced.
Similarly, the electronic device 100′ may selectively omit the conductive element 140. Namely, the conduction base 150 may be directly connected to the second metal ground layer 122 through the bottom solder mask opening 122a, achieving the effect described.
Structure, disposition, and function of other elements in this embodiment are the same as those in the first embodiment, and explanation thereof is omitted for simplicity.
Referring to
The printed circuit board 320 is disposed in the casing 310 and comprises a first metal ground layer 321, a second metal ground layer 322, and a plurality of metal connecting portions 323. The first metal ground layer 321 is opposite the second metal ground layer 322. The metal connecting portions 323 are respectively connected between the first metal ground layer 321 and the second metal ground layer 322. In this embodiment, each metal connecting portion 323 may be a through hole with an inner wall coated with metal. Additionally, the printed circuit board 320 may be a multilayer printed circuit board.
The chip 330 is electrically connected to the printed circuit board 320 and comprises a die 331, a heat-conducting portion 332, and a molding plastic 333. The heat-conducting portion 332 is connected to the die 331 and is soldered with the first metal ground layer 321 of the printed circuit board 320. The molding plastic 333 covers the die 331. Specifically, the first metal ground layer 321 is often coated with a solder mask S. To connect the heat-conducting portion 332 of the chip 330 with the first metal ground layer 321, the first metal ground layer 321 comprises a solder mask opening 321a formed thereon. The heat-conducting portion 332 is soldered with the first metal ground layer 321 through the solder mask opening 321a.
The metal connecting members 340 are fit in the printed circuit board 320 and connect the first metal ground layer 321 and second metal ground layer 322 to the casing 310. Specifically, the metal connecting members 340 may be screws fixing the printed circuit board 320 to the casing 310, in addition to connecting the first metal ground layer 321 and second metal ground layer 322 to the casing 310.
Similarly, the chip 330 may be a chip with lead-frame package or ball grid array package. When the chip 330 is a chip with lead-frame package, such as a chip with low profile plastic quad flat package (LQFP), the heat-conducting portion 332 thereof is an exposed die pad connected to the die 331. Here, the exposed die pad is composed of metal, such as aluminum. In another aspect, when the chip 330 is a chip with ball grid array package, such as a chip with flip chip ball grid array package (FCBGA package), the heat-conducting portion 332 thereof is formed by a plurality of thermal ground balls connected to the die 331.
When the die 331 of the chip 330 is in operation, heat generated thereby is conducted to the casing 310 through the heat-conducting portion 332, first metal ground layer 321, metal connecting portions 323, second metal ground layer 322, and metal connecting members 340 and is further transmitted to the exterior of the electronic device 300.
Accordingly, as the heat generated by the die 331 is not distributed over the molding plastic 333 but conducted to the casing 310 through the heat-conducting portion 332, first metal ground layer 321, metal connecting portions 323, second metal ground layer 322, and metal connecting members 340, the value of the thermal conduction coefficient (k) is significantly increased. Additionally, the temperature difference (ΔT) between the die 331 and the casing 310 is larger than the temperature difference between the die 331 and the molding plastic 333. Thus, the thermal conduction rate (Q/t) at which the heat generated by the die 331 is conducted to the casing 310 is high, enhancing heat spread or dissipation from the die 331 (or chip 330). Similarly, as neither a heat sink nor a fan is required, the overall size and manufacturing costs of the electronic device 300 are significantly reduced.
More specifically, as the first metal ground layer 321 is connected to the second metal ground layer 322 through a shortest conduction path (metal connecting members 340 and metal connecting portions 323), and the second metal ground layer 322 is connected to the casing 310 through a shortest conduction path (metal connecting members 340), static electricity in the printed circuit board 320 is easily conducted to the casing 310, effectively enhancing electrostatic discharge (ESD) protection in the electronic device 300. Thus, time, effort, and test equipment for solving issues of electrostatic discharge (ESD) can be omitted, further reducing the manufacturing costs of the electronic device 300.
Moreover, the printed circuit board 320 may selectively omit the metal connecting portions 323. At this point, heat generated by the die 331 is conducted to the casing 310 through the heat-conducting portion 332, first metal ground layer 321, and metal connecting members 340 and is further transmitted to the exterior of the electronic device 300. Accordingly, heat spread or dissipation from the die 331 (or chip 330) and electrostatic discharge (ESD) protection in the electronic device 300 are also enhanced.
Referring to
The printed circuit board 420 is disposed in the casing 410 and comprises a metal ground layer 421 connected to the casing 410. In this embodiment, the casing 410 comprises a protrusion 411 to which the metal ground layer 421 is connected. Additionally, the printed circuit board 420 may be a multilayer printed circuit board.
The chip 430 is electrically connected to the printed circuit board 420 and comprises a die 431, a heat-conducting portion 432, and a molding plastic 433. The heat-conducting portion 432 is connected to the die 431 and is soldered with the metal ground layer 421 of the printed circuit board 420. The molding plastic 433 covers the die 431.
Specifically, the metal ground layer 421 is often coated with a solder mask S. To connect the heat-conducting portion 432 of the chip 430 with the metal ground layer 421, the metal ground layer 421 comprises a top solder mask opening 421a formed thereon. The heat-conducting portion 432 is soldered with the metal ground layer 421 through the top solder mask opening 421a.
The conductive element 440 is connected between the protrusion 411 of the casing 410 and the metal ground layer 421 of the printed circuit board 420. Specifically, the metal ground layer 421 further comprises a bottom solder mask opening 421b formed thereon. The conductive element 440 is soldered with the metal ground layer 421 through the bottom solder mask opening 421b. Additionally, the conductive element 440 may comprise electric and/or thermal conductors. For example, the conductive element 440 may comprise conductive glue, a conductive tape, or a thermal pad.
Similarly, the chip 430 may be a chip with lead-frame package or ball grid array package. When the chip 430 is a chip with lead-frame package, such as a chip with low profile plastic quad flat package (LQFP), the heat-conducting portion 432 thereof is an exposed die pad connected to the die 431. Here, the exposed die pad is composed of metal, such as aluminum. In another aspect, when the chip 430 is a chip with ball grid array package, such as a chip with flip chip ball grid array package (FCBGA package), the heat-conducting portion 432 thereof is formed by a plurality of thermal ground balls connected to the die 431.
When the die 431 of the chip 430 is in operation, heat generated thereby is conducted to the casing 410 sequentially through the heat-conducting portion 432, metal ground layer 421, and conductive element 440 and is further transmitted to the exterior of the electronic device 400.
Accordingly, as the heat generated by the die 431 is not distributed over the molding plastic 433 but conducted to the casing 410 through the heat-conducting portion 432, metal ground layer 421, and conductive element 440, the value of the thermal conduction coefficient (k) is significantly increased comparing to the traditional packaging structure. Additionally, the temperature difference (ΔT) between the die 431 and the casing 410 is larger than the temperature difference between the die 431 and the molding plastic 433. Thus, the thermal conduction rate
at which the heat generated by the die 431 distributing over the casing 410 has a higher conducting rate than traditional devices, and thus the efficiency of heat spread or dissipation from the die 431 (or chip 430) is improved. As disclosed, neither a heat sink nor a fan is required, the overall size and manufacturing costs of the electronic device 400 are significantly reduced.
More specifically, as the metal ground layer 421 is connected to the casing 410 through a shortest conduction path, static electricity in the printed circuit board 420 is easily transmitted to the casing 410, effectively enhancing electrostatic discharge (ESD) protection in the electronic device 400. Thus, time, effort, and test equipment for solving issues of electrostatic discharge (ESD) can be omitted, further reducing the manufacturing costs of the electronic device 400.
Moreover, the electronic device 400 may selectively omit the conductive element 440. Namely, the protrusion 411 of the casing 410 may be directly connected to the metal ground layer 421 through the bottom solder mask opening 421b, achieving the effect described.
Elements corresponding to those in the fourth embodiment share the same reference numerals.
Referring to
When the conduction base 450 comprises an electric conductor, such as metal, heat spread or dissipation from the die 431 (or chip 430) and electrostatic discharge (ESD) protection in the electronic device 400′ are effectively enhanced. In another aspect, when the conduction base 450 comprises a thermal conductor, such as an insulating thermal pad, heat spread or dissipation from the die 431 (or chip 430) is effectively enhanced.
Similarly, the electronic device 400′ may selectively omit the conductive element 440. Namely, the conduction base 450 may be directly connected to the metal ground layer 421 through the bottom solder mask opening 421b, achieving the effect described.
Structure, disposition, and function of other elements in this embodiment are the same as those in the fourth embodiment, and explanation thereof is omitted for simplicity.
Referring to
The printed circuit board 620 is disposed in the casing 610 and comprises a metal ground layer 621. Additionally, the printed circuit board 620 may be a multilayer printed circuit board.
The chip 630 is electrically connected to the printed circuit board 620 and comprises a die 631, a heat-conducting portion 632, and a molding plastic 633. The heat-conducting portion 632 is connected to the die 631 and is soldered with the metal ground layer 621 of the printed circuit board 620. The molding plastic 633 covers the die 631. Specifically, the metal ground layer 621 is often coated with a solder mask S. To connect the heat-conducting portion 632 of the chip 630 with the metal ground layer 621, the metal ground layer 621 comprises a solder mask opening 621a formed thereon. The heat-conducting portion 632 is soldered with the metal ground layer 621 through the solder mask opening 621a.
The metal connecting members 640 are fit in the printed circuit board 620 and connect the metal ground layer 621 to the casing 610. Specifically, the metal connecting members 640 may be screws fixing the printed circuit board 620 to the casing 610, in addition to connecting the metal ground layer 621 to the casing 610.
Similarly, the chip 630 may be a chip with lead-frame package or ball grid array package. When the chip 630 is a chip with lead-frame package, such as a chip with low profile plastic quad flat package (LQFP), the heat-conducting portion 632 thereof is an exposed die pad connected to the die 631. Here, the exposed die pad is composed of metal, such as aluminum. In another aspect, when the chip 630 is a chip with ball grid array package, such as a chip with flip chip ball grid array package (FCBGA package), the heat-conducting portion 632 thereof is formed by a plurality of thermal ground balls connected to the die 631.
When the die 631 of the chip 630 is in operation, heat generated thereby is transmitted to the casing 610 through the heat-conducting portion 632, metal ground layer 621, and metal connecting members 640 and is further transmitted to the exterior of the electronic device 600.
Accordingly, as the heat generated by the die 631 is not distributed over the molding plastic 633 but conducted to the casing 610 through the heat-conducting portion 632, metal ground layer 621, and metal connecting members 640, the value of the thermal conduction coefficient (k) is significantly increased. Additionally, the temperature difference (ΔT) between the die 631 and the casing 610 is larger than the temperature difference between the die 631 and the molding plastic 633. Thus, the thermal conduction rate
is increased, and the heat spread or dissipation from the die 631 (or chip 630) is enhanced as well. The embodiment as disclosed requires neither a heat sink nor a fan. Thus, the overall size and manufacturing costs of the electronic device 600 are significantly reduced.
More specifically, as the metal ground layer 621 is connected to the casing 610 through a shortest conduction path (metal connecting members 640), static electricity in the printed circuit board 620 is easily conducted to the casing 610, effectively enhancing electrostatic discharge (ESD) protection in the electronic device 600. Thus, time, effort, and test equipment for solving issues of electrostatic discharge (ESD) are not required, and the manufacturing costs of the electronic device 600 are further reduced as well.
Referring to
The casing 710 comprises a protrusion 711. The printed circuit board 720 is disposed in the casing 710. Additionally, the printed circuit board 720 may be a multilayer printed circuit board.
The chip 730 is electrically connected to the printed circuit board 720 and comprises a die 731, a heat-conducting portion 732, and a molding plastic 733. The heat-conducting portion 732 is connected between the die 731 and the protrusion 711 of the casing 710. The molding plastic 733 covers the die 731. Specifically, the chip 730 of this embodiment is a chip with lead-frame package and the heat-conducting portion 732 thereof is a reverse exposed die pad connected to the die 731. Here, the reverse exposed die pad is composed of metal, such as aluminum.
The conductive element 740 is connected between the protrusion 711 of the casing 710 and the heat-conducting portion 732. Additionally, the conductive element 740 may comprise electric and/or thermal conductors. For example, the conductive element 740 may comprise conductive glue, a conductive tape, or a thermal pad.
When the die 731 of the chip 730 is in operation, heat generated thereby is conducted to the casing 710 through the heat-conducting portion 732 and conductive element 740 and is further transmitted to the exterior of the electronic device 700.
Since the heat generated by the die 731 is not conducted to the molding plastic 733 but conducted to the casing 710 through the heat-conducting portion 732 and conductive element 740, the value of the coefficient (k) of thermal conduction is significantly increased. Additionally, the temperature difference (ΔT) between the die 731 and the casing 710 is also increased. Thus, the thermal conduction rate
at which the heat generated by the die 731 conducting to the casing 710 is increased, and the heat spread or dissipation from the die 731 (or chip 730) is enhanced. The embodiment as disclosed requires neither a heat sink nor a fan. Thus, the overall size and manufacturing costs of the electronic device 700 are significantly reduced.
Moreover, when the conductive element 740 comprises conductive glue or a conductive tape, static electricity in the printed circuit board 720 is easily conducted to the casing 710, effectively enhancing electrostatic discharge (ESD) protection in the electronic device 700. Thus, time, effort, and test equipment for solving issues of electrostatic discharge (ESD) are not required, further reducing the manufacturing costs of the electronic device 700.
Moreover, the electronic device 700 may selectively omit the conductive element 740. Namely, the protrusion 711 of the casing 710 may be directly connected to the heat-conducting portion 732, achieving the effect described.
Elements corresponding to those in the seventh embodiment share the same reference numerals.
Referring to
Specifically, when the conduction base 750 comprises an electric conductor, such as metal, heat spread or dissipation from the die 731 (or chip 730) and electrostatic discharge (ESD) protection in the electronic device 700′ are effectively enhanced. In another aspect, when the conduction base 750 comprises a thermal conductor, such as an insulating thermal pad, heat spread or dissipation from the die 731 (or chip 730) is effectively enhanced.
Similarly, the electronic device 700′ may selectively omit the conductive element 740. Namely, the conduction base 750 may be directly connected to the heat-conducting portion 732, achieving the effect described.
Structure, disposition, and function of other elements in this embodiment are the same as those in the seventh embodiment, and explanation thereof is omitted for simplicity.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
This application claims the benefit of U.S. Provisional Application No. 60/827,222, filed Sep. 28, 2006, incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 60827222 | Sep 2006 | US |
