Charles C. Garretson

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing head with local wafer pressure
- Patent number 11,986,923
- Issue date May 21, 2024
- Applied Materials, Inc.
- Andrew Nagengast
- B24 - GRINDING POLISHING
Information Patent Grant
Control of processing parameters for substrate polishing with angul...
- Patent number 11,931,853
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming retaining ring with shaped surface
- Patent number 11,850,703
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface and method of forming
- Patent number 11,577,361
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Hung Chih Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Retaining ring design
- Patent number 11,400,560
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Jeonghoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,282,755
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retaining ring with shaped surface
- Patent number 11,260,500
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for profile and surface preparation of retain...
- Patent number 11,241,769
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- David Masayuki Ishikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 10,766,117
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with local area rate control and oscillation mode
- Patent number 10,610,994
- Issue date Apr 7, 2020
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textured small pad for chemical mechanical polishing
- Patent number 10,589,399
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Local area polishing system and polishing pad assemblies for a poli...
- Patent number 10,434,623
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing automated recipe generation
- Patent number 10,256,111
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- Eric Lau
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for profile and surface preparation of retain...
- Patent number 10,252,397
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- David Masayuki Ishikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with Shaped Surface
- Patent number 9,937,601
- Issue date Apr 10, 2018
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Dynamic residue clearing control with in-situ profile control (ISPC)
- Patent number 9,242,337
- Issue date Jan 26, 2016
- Applied Materials, Inc.
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 9,186,773
- Issue date Nov 17, 2015
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Closed-loop control for improved polishing pad profiles
- Patent number 9,138,860
- Issue date Sep 22, 2015
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring monitoring and control of pressure
- Patent number 9,017,138
- Issue date Apr 28, 2015
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method for compensation of variability in chemical mechanical polis...
- Patent number 8,758,085
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback for polishing rate correction in chemical mechanical polis...
- Patent number 8,755,927
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 8,585,468
- Issue date Nov 19, 2013
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback for polishing rate correction in chemical mechanical polis...
- Patent number 8,467,896
- Issue date Jun 18, 2013
- Applied Materials, Inc.
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Closed-loop control for effective pad conditioning
- Patent number 8,337,279
- Issue date Dec 25, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback for polishing rate correction in chemical mechanical polis...
- Patent number 8,190,285
- Issue date May 29, 2012
- Applied Materials, Inc.
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 8,066,551
- Issue date Nov 29, 2011
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 7,927,190
- Issue date Apr 19, 2011
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring with shaped surface
- Patent number 7,344,434
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Profile control platen
- Patent number 7,115,024
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING HEAD WITH LOCAL WAFER PRESSURE
- Publication number 20240253179
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Andrew NAGENGAST
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FORMING RETAINING RING WITH SHAPED SURFACE
- Publication number 20230182261
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING DESIGN
- Publication number 20220339755
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Jeonghoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBST...
- Publication number 20220283554
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE LEARNING FOR CLASSIFYING RETAINING RINGS
- Publication number 20220281052
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH ANGUL...
- Publication number 20220281053
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
Asymmetry Correction Via Oriented Wafer Loading
- Publication number 20220208621
- Publication date Jun 30, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING WITH SHAPED SURFACE AND METHOD OF FORMING
- Publication number 20220152778
- Publication date May 19, 2022
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH LOCAL WAFER PRESSURE
- Publication number 20220143779
- Publication date May 12, 2022
- Applied Materials, Inc.
- Andrew NAGENGAST
- B24 - GRINDING POLISHING
Information Patent Application
Asymmetry Correction Via Oriented Wafer Loading
- Publication number 20210066142
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- Eric Lau
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Retaining Ring with Shaped Surface
- Publication number 20200398399
- Publication date Dec 24, 2020
- Applied Materials, Inc.
- Hung Chih Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20200282506
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...
- Publication number 20190105754
- Publication date Apr 11, 2019
- Applied Materials, Inc.
- David Masayuki ISHIKAWA
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING DESIGN
- Publication number 20190099857
- Publication date Apr 4, 2019
- Applied Materials, Inc.
- Jeonghoon OH
- B24 - GRINDING POLISHING
Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20180250788
- Publication date Sep 6, 2018
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
Retaining Ring With Shaped Surface
- Publication number 20180185979
- Publication date Jul 5, 2018
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION
- Publication number 20180005842
- Publication date Jan 4, 2018
- Applied Materials, Inc.
- Eric LAU
- G01 - MEASURING TESTING
Information Patent Application
POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE
- Publication number 20170274495
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...
- Publication number 20170274497
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
TEXTURED SMALL PAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170274498
- Publication date Sep 28, 2017
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...
- Publication number 20160121453
- Publication date May 5, 2016
- Applied Materials, Inc.
- David Masayuki ISHIKAWA
- B24 - GRINDING POLISHING
Information Patent Application
Retaining Ring With Shaped Surface
- Publication number 20160045997
- Publication date Feb 18, 2016
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
DYNAMIC RESIDUE CLEARING CONTROL WITH IN-SITU PROFILE CONTROL (ISPC)
- Publication number 20140273749
- Publication date Sep 18, 2014
- Jun QIAN
- B24 - GRINDING POLISHING
Information Patent Application
Retaining Ring With Shaped Surface
- Publication number 20140053981
- Publication date Feb 27, 2014
- Applied Materials, Inc.
- Hung Chih Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLIS...
- Publication number 20130273812
- Publication date Oct 17, 2013
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING MONITORING AND CONTROL OF PRESSURE
- Publication number 20130203321
- Publication date Aug 8, 2013
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE
- Publication number 20130122783
- Publication date May 16, 2013
- Applied Materials, Inc.
- Gregory E. Menk
- B24 - GRINDING POLISHING
Information Patent Application
FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLIS...
- Publication number 20120231701
- Publication date Sep 13, 2012
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL ME...
- Publication number 20120100779
- Publication date Apr 26, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING

Charles C. Garretson

Person

Patents Grantslast 30 patents

Polishing head with local wafer pressure

Control of processing parameters for substrate polishing with angul...

Asymmetry correction via oriented wafer loading

Method of forming retaining ring with shaped surface

Retaining ring with shaped surface and method of forming

Retaining ring design

Asymmetry correction via oriented wafer loading

Retaining ring with shaped surface

Methods and apparatus for profile and surface preparation of retain...

Retaining ring with shaped surface

Polishing system with local area rate control and oscillation mode

Textured small pad for chemical mechanical polishing

Local area polishing system and polishing pad assemblies for a poli...

Chemical mechanical polishing automated recipe generation

Methods and apparatus for profile and surface preparation of retain...

Retaining ring with Shaped Surface

Dynamic residue clearing control with in-situ profile control (ISPC)

Retaining ring with shaped surface

Closed-loop control for improved polishing pad profiles

Retaining ring monitoring and control of pressure

Method for compensation of variability in chemical mechanical polis...

Feedback for polishing rate correction in chemical mechanical polis...

Retaining ring with shaped surface

Feedback for polishing rate correction in chemical mechanical polis...

Closed-loop control for effective pad conditioning

Feedback for polishing rate correction in chemical mechanical polis...

Retaining ring with shaped surface

Retaining ring with shaped surface

Retaining ring with shaped surface

Profile control platen

Patents Applicationslast 30 patents

POLISHING HEAD WITH LOCAL WAFER PRESSURE

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

METHOD OF FORMING RETAINING RING WITH SHAPED SURFACE

RETAINING RING DESIGN

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBST...

MACHINE LEARNING FOR CLASSIFYING RETAINING RINGS

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH ANGUL...

Asymmetry Correction Via Oriented Wafer Loading

RETAINING RING WITH SHAPED SURFACE AND METHOD OF FORMING

POLISHING HEAD WITH LOCAL WAFER PRESSURE

Asymmetry Correction Via Oriented Wafer Loading

Retaining Ring with Shaped Surface

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...

RETAINING RING DESIGN

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

Retaining Ring With Shaped Surface

CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION

POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE

LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...

TEXTURED SMALL PAD FOR CHEMICAL MECHANICAL POLISHING

METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...

Retaining Ring With Shaped Surface

DYNAMIC RESIDUE CLEARING CONTROL WITH IN-SITU PROFILE CONTROL (ISPC)

Retaining Ring With Shaped Surface

FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLIS...

RETAINING RING MONITORING AND CONTROL OF PRESSURE

PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE

FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLIS...

APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL ME...