Charles Divita

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Burlington, CA

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional packaging configuration for multi-chip module ass...
- Patent number 6,133,626
- Issue date Oct 17, 2000
- Gennum Corporation
- Robert E. Hawke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER CHIP WITH CAVITY
- Publication number 20090087010
- Publication date Apr 2, 2009
- Mark Vandermeulen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE