Charles H. Perry

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making an electronic package
- Patent number 7,278,207
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling an interconnect device assembly
- Patent number 6,988,310
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Gerald G. Advocate, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic package
- Patent number 6,961,995
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,858,111
- Issue date Feb 22, 2005
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical coupling of substrates by conductive buttons
- Patent number 6,848,914
- Issue date Feb 1, 2005
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a land grid array module
- Patent number 6,711,810
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Todd H. Buley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy-siloxanes based electrically conductive adhesives for semicon...
- Patent number 6,548,175
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer and ceramic composite electronic substrates
- Patent number 6,528,145
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Daniel George Berger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant layer for encapsulated columns
- Patent number 6,486,415
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive interconnection with insulating polymer carrier
- Patent number 6,458,623
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,333,104
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for pre-cleaning and post-cleaning deposited metal
- Patent number 6,227,943
- Issue date May 8, 2001
- International Business Machines Corporation
- John J. Garant
- B24 - GRINDING POLISHING
Information Patent Grant
Method of etching molybdenum metal from substrates
- Patent number 6,221,269
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Krishna G. Sachdev
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High density Z-axis connector
- Patent number 6,174,175
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Alex A. Behfar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low TCE polyimides as improved insulator in multilayer interconnect...
- Patent number 5,976,710
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming cavity substrates using compressive pads
- Patent number 5,788,808
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Govindarajan Natarajan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of forming cavity substrates using compressive pads
- Patent number 5,759,320
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Govindarajan Natarajan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer ceramic substrate with capped vias
- Patent number 5,293,504
- Issue date Mar 8, 1994
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,277,725
- Issue date Jan 11, 1994
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayer ceramic substrate with graded vias
- Patent number 5,260,519
- Issue date Nov 9, 1993
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric composite substrate
- Patent number 5,139,852
- Issue date Aug 18, 1992
- International Business Machines Corporation
- Arnold I. Baise
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,135,595
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method and means for co-sintering ceramic/metal MLC substrates
- Patent number 5,130,067
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Philip L. Flaitz
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for forming a defect-free surface on a porous ceramic substrate
- Patent number 4,937,930
- Issue date Jul 3, 1990
- International Business Machines Corporation
- James N. Humenik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strengthening a ceramic by post sinter coating with a compressive s...
- Patent number 4,781,970
- Issue date Nov 1, 1988
- International Business Machines Corporation
- Steven G. Barbee
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Gas-loaded pressure diaphragm
- Patent number 4,684,339
- Issue date Aug 4, 1987
- International Business Machines Corporation
- Raschid J. Bezama
- B30 - PRESSES
Information Patent Grant
Method for providing pinhole free dielectric layers
- Patent number 4,519,851
- Issue date May 28, 1985
- International Business Machines Corporation
- Charles H. Perry
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of making an electronic package
- Publication number 20070278654
- Publication date Dec 6, 2007
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic package
- Publication number 20050250249
- Publication date Nov 10, 2005
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of assembling an interconnect device assembly and apparatus...
- Publication number 20040002233
- Publication date Jan 1, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical coupling of substrates by conductive buttons
- Publication number 20030073329
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a land grid array module and alignment tool fo...
- Publication number 20030051338
- Publication date Mar 20, 2003
- International Business Machines Corporation
- Todd H. Buley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Compliant layer for encapsulated columns
- Publication number 20030020150
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy-siloxanes based electrically conductive adhesives for semicon...
- Publication number 20020127406
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Krishna G. Sachdev
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive interconnection with insulating polymer carrier
- Publication number 20020093104
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated cloumns
- Publication number 20020092676
- Publication date Jul 18, 2002
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive polymer interconnection configurations
- Publication number 20020028327
- Publication date Mar 7, 2002
- Charles H. Perry
- H01 - BASIC ELECTRIC ELEMENTS

Charles H. Perry

Person

Patents Grantslast 30 patents

Method of making an electronic package

Method of assembling an interconnect device assembly

Method of making an electronic package

Conductive polymer interconnection configurations

Electrical coupling of substrates by conductive buttons

Method of assembling a land grid array module

Epoxy-siloxanes based electrically conductive adhesives for semicon...

Polymer and ceramic composite electronic substrates

Compliant layer for encapsulated columns

Conductive adhesive interconnection with insulating polymer carrier

Conductive polymer interconnection configurations

Method and system for pre-cleaning and post-cleaning deposited metal

Method of etching molybdenum metal from substrates

High density Z-axis connector

Low TCE polyimides as improved insulator in multilayer interconnect...

Apparatus for forming cavity substrates using compressive pads

Method of forming cavity substrates using compressive pads

Multilayer ceramic substrate with capped vias

Process for fabricating a low dielectric composite substrate

Multilayer ceramic substrate with graded vias

Low dielectric composite substrate

Process for fabricating a low dielectric composite substrate

Method and means for co-sintering ceramic/metal MLC substrates

Method for forming a defect-free surface on a porous ceramic substrate

Strengthening a ceramic by post sinter coating with a compressive s...

Gas-loaded pressure diaphragm

Method for providing pinhole free dielectric layers

Patents Applicationslast 30 patents

Method of making an electronic package

Method of making an electronic package

Method of assembling an interconnect device assembly and apparatus...

Electrical coupling of substrates by conductive buttons

Method of assembling a land grid array module and alignment tool fo...

Compliant layer for encapsulated columns

Epoxy-siloxanes based electrically conductive adhesives for semicon...

Conductive adhesive interconnection with insulating polymer carrier

Compliant layer for encapsulated cloumns

Conductive polymer interconnection configurations