Charles I. Delheimer

Person

Noblesville, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave communication package
- Patent number 7,855,685
- Issue date Dec 21, 2010
- Delphi Technologies, Inc.
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with form in-place pedestal
- Patent number 7,202,571
- Issue date Apr 10, 2007
- Delphi Technologies, Inc.
- Brian D. Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting a leadless package and structure therefor
- Patent number 6,750,084
- Issue date Jun 15, 2004
- Delphi Technologies, Inc.
- Charles I. Delheimer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip with backside electrical contact and assembly and method...
- Patent number 6,262,489
- Issue date Jul 17, 2001
- Delphi Technologies, Inc.
- Mark Anthony Koors
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES
- Publication number 20160197400
- Publication date Jul 7, 2016
- Delphi Technologies, Inc.
- DAVID W. ZIMMERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave communication package
- Publication number 20090085808
- Publication date Apr 2, 2009
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect for an electrical circuit substrate
- Publication number 20080218988
- Publication date Sep 11, 2008
- Jeffrey H. Burns
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Connector applied underfill
- Publication number 20080176428
- Publication date Jul 24, 2008
- Scott D. Brandenburg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Technique for defining a wettable solder joint area for an electron...
- Publication number 20060255102
- Publication date Nov 16, 2006
- Rick B. Snyder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module with form in-place pedestal
- Publication number 20060033195
- Publication date Feb 16, 2006
- Brian D. Thompson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board assembly and method
- Publication number 20050081375
- Publication date Apr 21, 2005
- Frederick F. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting a leadless package and structure therefor
- Publication number 20030234441
- Publication date Dec 25, 2003
- Charles I. Delheimer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Charles I. Delheimer

Person

Patents Grantslast 30 patents

Microwave communication package

Electronic module with form in-place pedestal

Method of mounting a leadless package and structure therefor

Flip chip with backside electrical contact and assembly and method...

Patents Applicationslast 30 patents

CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES

Microwave communication package

Interconnect for an electrical circuit substrate

Connector applied underfill

Technique for defining a wettable solder joint area for an electron...

Electronic module with form in-place pedestal

Printed circuit board assembly and method

Method of mounting a leadless package and structure therefor