Charles Odegard

Person

McKinney, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-based methodology of widening the pitch of semiconductor chip...
- Patent number 8,674,504
- Issue date Mar 18, 2014
- Texas Systems Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to increase die stand-off height
- Patent number 7,598,124
- Issue date Oct 6, 2009
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned plasma treatment to improve distribution of underfill mat...
- Patent number 7,550,314
- Issue date Jun 23, 2009
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,445,960
- Issue date Nov 4, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased stand-off height integrated circuit assemblies, systems,...
- Patent number 7,393,719
- Issue date Jul 1, 2008
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 7,323,362
- Issue date Jan 29, 2008
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,319,275
- Issue date Jan 15, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,276,401
- Issue date Oct 2, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,271,494
- Issue date Sep 18, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to increase die stand-off height
- Patent number 7,224,071
- Issue date May 29, 2007
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned plasma treatment to improve distribution of underfill mat...
- Patent number 7,045,904
- Issue date May 16, 2006
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 6,977,429
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 6,869,831
- Issue date Mar 22, 2005
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration-assisted method for underfilling flip-chip electronic dev...
- Patent number 6,855,578
- Issue date Feb 15, 2005
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PROBE PAD LAYOUT/DESIGN, AND RELATED DEVICE
- Publication number 20090189299
- Publication date Jul 30, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Ariel L. Miranda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Crack-Deflecting Structure and Method
- Publication number 20090166810
- Publication date Jul 2, 2009
- Daniel Joseph Stillman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...
- Publication number 20090039524
- Publication date Feb 12, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...
- Publication number 20080218986
- Publication date Sep 11, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
UNDERFILL DISPENSE AT SUBSTRATE APERTURE
- Publication number 20080085573
- Publication date Apr 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20080050860
- Publication date Feb 28, 2008
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration-Assisted Method for Underfilling Flip-Chip Electronic Dev...
- Publication number 20080003721
- Publication date Jan 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methodology to control underfill fillet size, flow-out and bleed in...
- Publication number 20070269930
- Publication date Nov 22, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20070128881
- Publication date Jun 7, 2007
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for polymer encapsulated solder lid attach
- Publication number 20060270106
- Publication date Nov 30, 2006
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill dispense at substrate aperture
- Publication number 20060234427
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased stand-off height integrated circuit assemblies, systems,...
- Publication number 20060234490
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and Method to Increase Die Stand-off Height
- Publication number 20060211172
- Publication date Sep 21, 2006
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Patterned plasma treatment to improve distribution of underfill mat...
- Publication number 20060148136
- Publication date Jul 6, 2006
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20060027907
- Publication date Feb 9, 2006
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration-assisted method for underfilling flip-chip electronic dev...
- Publication number 20050253281
- Publication date Nov 17, 2005
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20050212149
- Publication date Sep 29, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20050161834
- Publication date Jul 28, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package
- Publication number 20050151273
- Publication date Jul 14, 2005
- Richard Willson Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterned plasma treatment to improve distribution of underfill mat...
- Publication number 20050127533
- Publication date Jun 16, 2005
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20050124090
- Publication date Jun 9, 2005
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method to increase die stand-off height
- Publication number 20040232561
- Publication date Nov 25, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Vibration-assisted method for underfilling flip-chip electronic dev...
- Publication number 20040033643
- Publication date Feb 19, 2004
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20030052414
- Publication date Mar 20, 2003
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Charles Odegard

Person

Patents Grantslast 30 patents

Wire-based methodology of widening the pitch of semiconductor chip...

System and method to increase die stand-off height

Patterned plasma treatment to improve distribution of underfill mat...

Adhesion by plasma conditioning of semiconductor chip

Increased stand-off height integrated circuit assemblies, systems,...

Manufacturing system and apparatus for balanced product flow with a...

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip surfaces

System and method to increase die stand-off height

Patterned plasma treatment to improve distribution of underfill mat...

Manufacturing system and apparatus for balanced product flow with a...

Adhesion by plasma conditioning of semiconductor chip surfaces

Vibration-assisted method for underfilling flip-chip electronic dev...

Patents Applicationslast 30 patents

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...

METHOD OF FORMING A PROBE PAD LAYOUT/DESIGN, AND RELATED DEVICE

Semiconductor Device Crack-Deflecting Structure and Method

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...

Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...

UNDERFILL DISPENSE AT SUBSTRATE APERTURE

Adhesion by plasma conditioning of semiconductor chip

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Dev...

Methodology to control underfill fillet size, flow-out and bleed in...

Adhesion by plasma conditioning of semiconductor chip surfaces

System and method for polymer encapsulated solder lid attach

Underfill dispense at substrate aperture

Increased stand-off height integrated circuit assemblies, systems,...

System and Method to Increase Die Stand-off Height

Patterned plasma treatment to improve distribution of underfill mat...

Manufacturing system and apparatus for balanced product flow with a...

Vibration-assisted method for underfilling flip-chip electronic dev...

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip

Semiconductor chip package

Patterned plasma treatment to improve distribution of underfill mat...

Manufacturing system and apparatus for balanced product flow with a...

System and method to increase die stand-off height

Vibration-assisted method for underfilling flip-chip electronic dev...

Adhesion by plasma conditioning of semiconductor chip surfaces