Charles Rosenstein

Person

Ramat Beit Shemesh, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor chips with array
- Patent number 9,548,254
- Issue date Jan 17, 2017
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 9,070,678
- Issue date Jun 30, 2015
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips
- Patent number 8,704,347
- Issue date Apr 22, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 8,653,644
- Issue date Feb 18, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 8,569,876
- Issue date Oct 29, 2013
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wafer level package
- Patent number 8,053,281
- Issue date Nov 8, 2011
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,935,568
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip packaging
- Patent number 7,936,062
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,807,508
- Issue date Oct 5, 2010
- Tessera Technologies Hungary Kft
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips
- Patent number 7,791,199
- Issue date Sep 7, 2010
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20150380336
- Publication date Dec 31, 2015
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20140151881
- Publication date Jun 5, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20120153443
- Publication date Jun 21, 2012
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS
- Publication number 20110012259
- Publication date Jan 20, 2011
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a wafer level package
- Publication number 20090162975
- Publication date Jun 25, 2009
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor chips with array
- Publication number 20080116544
- Publication date May 22, 2008
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor chips
- Publication number 20080116545
- Publication date May 22, 2008
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099900
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099907
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip packaging
- Publication number 20070190691
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging to lidded chips
- Publication number 20070190747
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Charles Rosenstein

Person

Patents Grantslast 30 patents

Packaged semiconductor chips with array

Packaged semiconductor chips with array

Packaged semiconductor chips

Packaged semiconductor chips with array

Packaged semiconductor chips with array

Method of forming a wafer level package

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer level chip packaging

Wafer-level fabrication of lidded chips with electrodeposited diele...

Packaged semiconductor chips

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

PACKAGED SEMICONDUCTOR CHIPS

Method of forming a wafer level package

Packaged semiconductor chips with array

Packaged semiconductor chips

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer level chip packaging

Wafer level packaging to lidded chips