Charles W. Eichelberger

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Single chip modules, repairable multichip modules, and methods of f...
- Patent number 6,159,767
- Issue date Dec 12, 2000
- EPIC Technologies, Inc.
- Charles William Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test structure and test process
- Patent number 5,897,728
- Issue date Apr 27, 1999
- Lockheed Martin Corporation
- Herbert Stanley Cole
- G01 - MEASURING TESTING
Information Patent Grant
Single chip modules, repairable multichip modules, and methods of f...
- Patent number 5,841,193
- Issue date Nov 24, 1998
- EPIC Technologies, Inc.
- Charles William Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible high density interconnect structure and flexibly interconn...
- Patent number 5,452,182
- Issue date Sep 19, 1995
- Martin Marietta Corporation
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic high density interconnected electronic system
- Patent number 5,359,496
- Issue date Oct 25, 1994
- General Electric Company
- William P. Kornrumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HDI impedance matched microwave circuit assembly
- Patent number 5,355,102
- Issue date Oct 11, 1994
- General Electric Company
- William P. Kornrumpf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High density interconnect thermoplastic die attach material and sol...
- Patent number 5,348,607
- Issue date Sep 20, 1994
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect structure including a chamber
- Patent number 5,331,203
- Issue date Jul 19, 1994
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic systems disposed in a high force environment
- Patent number 5,258,647
- Issue date Nov 2, 1993
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip integrated circuit modules
- Patent number 5,250,843
- Issue date Oct 5, 1993
- Integrated System Assemblies Corp.
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact high density interconnect structure
- Patent number 5,241,456
- Issue date Aug 31, 1993
- General Electric Company
- Walter M. Marcinkiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect thermoplastic die attach material and sol...
- Patent number 5,225,023
- Issue date Jul 6, 1993
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging configuration for rapid customized des...
- Patent number 5,214,655
- Issue date May 25, 1993
- General Electric Company
- Charles W. Eichelberger
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect structure with top mounted components
- Patent number 5,200,810
- Issue date Apr 6, 1993
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutliple lamination high density interconnect process and structure...
- Patent number 5,157,589
- Issue date Oct 20, 1992
- General Electric Company
- Herbert S. Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing components bonded to a substrate
- Patent number 5,154,793
- Issue date Oct 13, 1992
- General Electric Company
- Robert J. Wojnarowski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Die attachment method for use in high density interconnected assemb...
- Patent number 5,151,776
- Issue date Sep 29, 1992
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for testing and burn-in of integrated circuit chips
- Patent number 5,149,662
- Issue date Sep 22, 1992
- Integrated System Assemblies Corporation
- Charles W. Eichelberger
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for positioning an integrated circuit chip wit...
- Patent number 5,144,747
- Issue date Sep 8, 1992
- Integrated System Assemblies Corporation
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip protection layer and protected chip
- Patent number 5,144,407
- Issue date Sep 1, 1992
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multichip module systems
- Patent number 5,111,278
- Issue date May 5, 1992
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting a stack of integrated circuits at a very...
- Patent number 5,107,586
- Issue date Apr 28, 1992
- General Electric Company
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy/polyimide copolymer blend dielectric and layered circuits inc...
- Patent number 5,108,825
- Issue date Apr 28, 1992
- General Electric Company
- Robert J. Wojnarowski
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Direct patterning of metals over a thermally inefficient surface us...
- Patent number 5,104,480
- Issue date Apr 14, 1992
- General Electric Company
- Robert J. Wojnarowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for packaging integrated circuit chips employing a polyme...
- Patent number 5,094,709
- Issue date Mar 10, 1992
- General Electric Company
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration for testing and burn-in of integrated circuit chips
- Patent number 5,091,769
- Issue date Feb 25, 1992
- Charles W. Eichelberger
- G01 - MEASURING TESTING
Information Patent Grant
Ultrasonic array with a high density of electrical connections
- Patent number 5,091,893
- Issue date Feb 25, 1992
- General Electric Company
- Lowell S. Smith
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
High density interconnect with high volumetric efficiency
- Patent number 5,019,946
- Issue date May 28, 1991
- General Electric Company
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment method using nonconductive adhesive for use in high...
- Patent number 5,019,535
- Issue date May 28, 1991
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflector switched lasers
- Patent number 5,018,150
- Issue date May 21, 1991
- General Electric Company
- Robert J. Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS

Charles W. Eichelberger

Person

Patents Grantslast 30 patents

Single chip modules, repairable multichip modules, and methods of f...

Integrated circuit test structure and test process

Single chip modules, repairable multichip modules, and methods of f...

Flexible high density interconnect structure and flexibly interconn...

Hermetic high density interconnected electronic system

HDI impedance matched microwave circuit assembly

High density interconnect thermoplastic die attach material and sol...

High density interconnect structure including a chamber

Electronic systems disposed in a high force environment

Multichip integrated circuit modules

Compact high density interconnect structure

High density interconnect thermoplastic die attach material and sol...

Integrated circuit packaging configuration for rapid customized des...

High density interconnect structure with top mounted components

Mutliple lamination high density interconnect process and structure...

Method and apparatus for removing components bonded to a substrate

Die attachment method for use in high density interconnected assemb...

Methods for testing and burn-in of integrated circuit chips

Apparatus and method for positioning an integrated circuit chip wit...

Semiconductor chip protection layer and protected chip

Three-dimensional multichip module systems

Method for interconnecting a stack of integrated circuits at a very...

Epoxy/polyimide copolymer blend dielectric and layered circuits inc...

Direct patterning of metals over a thermally inefficient surface us...

Apparatus for packaging integrated circuit chips employing a polyme...

Configuration for testing and burn-in of integrated circuit chips

Ultrasonic array with a high density of electrical connections

High density interconnect with high volumetric efficiency

Die attachment method using nonconductive adhesive for use in high...

Reflector switched lasers