Charles Wee Ming Lee

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 8,003,448
- Issue date Aug 23, 2011
- Infineon Technologies, AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 7,816,235
- Issue date Oct 19, 2010
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with contact support layer and method to prod...
- Patent number 7,452,747
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor device package
- Patent number 6,852,567
- Issue date Feb 8, 2005
- Infineon Technologies AG
- Charles-Wee-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for at least one semiconductor body
- Patent number 6,288,335
- Issue date Sep 11, 2001
- Infineon Technologies AG
- Charles-Wee-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20100314721
- Publication date Dec 16, 2010
- INFINEON TECHNOLOGIES AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20080006900
- Publication date Jan 10, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS