TREA

Charles William Griffin

Follow

Person

  • Underhill, VT, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Via leakage and breakdown testing
    • Patent number 9,851,398
    • Issue date Dec 26, 2017
    • GLOBALFOUNDRIES Inc.
    • Fen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring structures
    • Patent number 9,780,031
    • Issue date Oct 3, 2017
    • Globalfoudries Inc.
    • Fen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging reliability superchips
    • Patent number 7,560,950
    • Issue date Jul 14, 2009
    • International Business Machines Corporation
    • Jason E. Blanchet
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Packaging reliability super chips
    • Patent number 7,348,792
    • Issue date Mar 25, 2008
    • International Business Machines Corporation
    • Jason E. Blanchet
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Packaging reliability superchips
    • Patent number 7,102,377
    • Issue date Sep 5, 2006
    • International Business Machines Corporation
    • Jason E. Blanchet
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Structure and method for reliability stressing of dielectrics
    • Patent number 5,898,706
    • Issue date Apr 27, 1999
    • International Business Machines Corporation
    • Roger Aime Dufresne
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    VIA LEAKAGE AND BREAKDOWN TESTING
    • Publication number 20160291084
    • Publication date Oct 6, 2016
    • GLOBALFOUNDRIES INC.
    • Fen Chen
    • G01 - MEASURING TESTING
  • Information Patent Application

    WIRING STRUCTURES
    • Publication number 20160071790
    • Publication date Mar 10, 2016
    • International Business Machines Corporation
    • Fen CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT
    • Publication number 20150262911
    • Publication date Sep 17, 2015
    • International Business Machines Corporation
    • Fen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaging reliability superchips
    • Publication number 20080088335
    • Publication date Apr 17, 2008
    • Jason E. Blanchet
    • G01 - MEASURING TESTING
  • Information Patent Application

    Packaging reliability super chips
    • Publication number 20060290372
    • Publication date Dec 28, 2006
    • Jason E. Blanchet
    • G01 - MEASURING TESTING