Chau Fatt Chiang

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,021,000
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual step laser processing of an encapsulant of a semiconductor chi...
- Patent number 11,791,169
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lead tip inspection feature
- Patent number 11,587,800
- Issue date Feb 21, 2023
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooled molded semiconductor package
- Patent number 11,302,613
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with double-sided cooling
- Patent number 10,886,199
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to lead interconnect in encapsulant of molded semiconductor pa...
- Patent number 10,796,981
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molding system with movable mold tool
- Patent number 10,639,833
- Issue date May 5, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Micro-electrical mechanical system sensor package and method of man...
- Patent number 10,631,100
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electrical mechanical system sensor package and method of man...
- Patent number 10,595,132
- Issue date Mar 17, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 10,501,312
- Issue date Dec 10, 2019
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 10,490,470
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Hock Heng Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-phase half bridge driver package and methods of manufacture
- Patent number 10,396,018
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,304,780
- Issue date May 28, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,163,812
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for simultaneously encapsulating semiconductor...
- Patent number 10,099,411
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Choon Huey Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded cavity package with embedded conductive layer and enhanced s...
- Patent number 9,868,632
- Issue date Jan 16, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing multiple semiconductor devices
- Patent number 8,053,280
- Issue date Nov 8, 2011
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package using a carrier
- Patent number 7,977,161
- Issue date Jul 12, 2011
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package with a bump using a...
- Patent number 7,838,332
- Issue date Nov 23, 2010
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLOATING METAL PORTION AND METHOD FOR MA...
- Publication number 20240343553
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20230049564
- Publication date Feb 16, 2023
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20220037222
- Publication date Feb 3, 2022
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20210391298
- Publication date Dec 16, 2021
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20210366732
- Publication date Nov 25, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chi...
- Publication number 20210050227
- Publication date Feb 18, 2021
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Molded Semiconductor Package with Double-Sided Cooling
- Publication number 20210020547
- Publication date Jan 21, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Cooled Molded Semiconductor Package
- Publication number 20210020550
- Publication date Jan 21, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20200321276
- Publication date Oct 8, 2020
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20200321269
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200185293
- Publication date Jun 11, 2020
- Stefan Schmalzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRICAL MECHANICAL SYSTEM SENSOR PACKAGE AND METHOD OF MAN...
- Publication number 20200084550
- Publication date Mar 12, 2020
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
- Publication number 20200048075
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Leadframe, Semiconductor Package and Method
- Publication number 20200051898
- Publication date Feb 13, 2020
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
- Publication number 20190164873
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Package and Semiconductor Package
- Publication number 20190109103
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
- Publication number 20190023561
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180308804
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating a semiconductor pa...
- Publication number 20180174935
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180108616
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Chau Fatt Chiang

Person

Patents Grantslast 30 patents

Semiconductor package with metal posts from structured leadframe

Semiconductor package and method for fabricating a semiconductor pa...

Dual step laser processing of an encapsulant of a semiconductor chi...

Semiconductor package with lead tip inspection feature

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Double-sided cooled molded semiconductor package

Pressure sensor having a lidless/laminate structure

Over-under sensor packaging with sensor spaced apart from control chip

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Manufacturing a package using plateable encapsulant

Molded semiconductor package with double-sided cooling

Chip to lead interconnect in encapsulant of molded semiconductor pa...

Semiconductor package with air cavity

Molding system with movable mold tool

Micro-electrical mechanical system sensor package and method of man...

Micro-electrical mechanical system sensor package and method of man...

Semiconductor package with a through port for sensor applications

Over-under sensor packaging with sensor spaced apart from control chip

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor package with plateable encapsulant and a method for m...

Multi-phase half bridge driver package and methods of manufacture

Device having substrate with conductive pillars

Device having substrate with conductive pillars

Method and apparatus for simultaneously encapsulating semiconductor...

Molded cavity package with embedded conductive layer and enhanced s...

Molded package structure with glue bleed stopper for sealing a MEMs...

Method of producing multiple semiconductor devices

Method of manufacturing a semiconductor package using a carrier

Method of manufacturing a semiconductor package with a bump using a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH FLOATING METAL PORTION AND METHOD FOR MA...

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

Semiconductor Package with Lead Tip Inspection Feature

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

Semiconductor Packages and Methods for Manufacturing Thereof

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

Semiconductor Package with Lead Tip Inspection Feature

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Dual Step Laser Processing of an Encapsulant of a Semiconductor Chi...

Pressure Sensor

Molded Semiconductor Package with Double-Sided Cooling

Double-Sided Cooled Molded Semiconductor Package

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Pa...

Semiconductor Package Having a Laser-Activatable Mold Compound

MICRO-ELECTRICAL MECHANICAL SYSTEM SENSOR PACKAGE AND METHOD OF MAN...

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

Leadframe, Semiconductor Package and Method

Manufacturing a package using plateable encapsulant

Semiconductor Package with Air Cavity

Multi-Phase Half Bridge Driver Package and Methods of Manufacture

Method of Forming a Semiconductor Package and Semiconductor Package

SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor Package with a Through Port for Sensor Applications a...

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS