Che-Min Chu

Person

Xinzhuang City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with ring-like structure
- Patent number 12,183,709
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,848,302
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,545,463
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump layout for coplanarity improvement
- Patent number 11,211,318
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure including ring-like structure and method for...
- Patent number 11,088,108
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 10,950,557
- Issue date Mar 16, 2021
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple layer scheme patterning process
- Patent number 10,879,070
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and chip structure
- Patent number 10,607,860
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple layer scheme patterning process
- Patent number 10,515,803
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-threshold voltage field effect transistor and manufacturing m...
- Patent number 10,276,575
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amey Mahadev Walke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having conductive shield
- Patent number 10,276,510
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure including intermetallic compound
- Patent number 10,170,429
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with bumps
- Patent number 10,014,218
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-semiconductor field-effect transistor with extended gat...
- Patent number 9,997,601
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiuan-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a motion sensor device
- Patent number 9,880,192
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-time-programming (OTP) memory cell with floating gate shielding
- Patent number 9,865,609
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Lin Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-threshold voltage field effect transistor and manufacturing m...
- Patent number 9,837,416
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Amey Mahadev Walke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 9,825,010
- Issue date Nov 21, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating MEMS devices having a plurality of cavities
- Patent number 9,561,954
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-oxide-semiconductor field-effect transistor with extended gat...
- Patent number 9,209,298
- Issue date Dec 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiuan-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motion sensor device and methods for forming the same
- Patent number 8,960,003
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- G01 - MEASURING TESTING
Information Patent Grant
MEMS devices having a plurality of cavities
- Patent number 8,916,943
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin capped channel layers of semiconductor devices and methods of...
- Patent number 8,883,598
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Ting Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-type semiconductor package having EMI shielding layer con...
- Patent number 8,853,834
- Issue date Oct 7, 2014
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package utilizing tape to reinforce fixing of leads t...
- Patent number 8,541,870
- Issue date Sep 24, 2013
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LDD epitaxy for FinFETs
- Patent number 8,278,179
- Issue date Oct 2, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Da-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device embedded non-volatile memory cell and fabricati...
- Patent number 7,091,535
- Issue date Aug 15, 2006
- Taiwan Semiconductor Manufacturing Company
- Hung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20230113265
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20210375821
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200411467
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200176395
- Publication date Jun 4, 2020
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Layer Scheme Patterning Process
- Publication number 20200126792
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP LAYOUT FOR COPLANARITY IMPROVEMENT
- Publication number 20200105654
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multiple Layer Scheme Patterning Process
- Publication number 20200020532
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20190096821
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20190096699
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180151537
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Heng-Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-THRESHOLD VOLTAGE FIELD EFFECT TRANSISTOR AND MANUFACTURING M...
- Publication number 20180090497
- Publication date Mar 29, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- AMEY MAHADEV WALKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287874
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287870
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE-TIME-PROGRAMMING (OTP) MEMORY CELL WITH FLOATING GATE SHIELDING
- Publication number 20170221910
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Lin Chen
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-THRESHOLD VOLTAGE FIELD EFFECT TRANSISTOR AND MANUFACTURING M...
- Publication number 20170033106
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- AMEY MAHADEV WALKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Oxide-Semiconductor Field-Effect Transistor with Extended Gat...
- Publication number 20160079368
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiuan-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motion Sensor Device and Methods for Forming the Same
- Publication number 20150177273
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES
- Publication number 20150104895
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Metal-Oxide-Semiconductor Field-Effect Transistor with Extended Gat...
- Publication number 20140252499
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiuan-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Structures and Methods of Forming the Same
- Publication number 20140246708
- Publication date Sep 4, 2014
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING LAYER CON...
- Publication number 20140167231
- Publication date Jun 19, 2014
- Powertech Technology Inc.
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CAPPED CHANNEL LAYERS OF SEMICONDUCTOR DEVICES AND METHODS OF...
- Publication number 20130230977
- Publication date Sep 5, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Che-Ting Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motion Sensor Device and Methods for Forming the Same
- Publication number 20130068023
- Publication date Mar 21, 2013
- Taiwan Semiconductor Manufaturing Company, Ltd.
- Shyh-Wei Cheng
- G01 - MEASURING TESTING
Information Patent Application
LDD Epitaxy for FinFETs
- Publication number 20110223736
- Publication date Sep 15, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Da-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Device Mismatch by Adjusting Titanium Formation
- Publication number 20110084391
- Publication date Apr 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage device embedded non-volatile memory cell and fabricati...
- Publication number 20050194647
- Publication date Sep 8, 2005
- Taiwan Semiconductor Manufacturing Co.
- Hung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Che-Min Chu

Person

Patents Grantslast 30 patents

Chip package structure with ring-like structure

Chip package structure with ring-like structure

Chip package structure with ring-like structure

Bump layout for coplanarity improvement

Chip package structure including ring-like structure and method for...

Stacked chip package structure and manufacturing method thereof

Multiple layer scheme patterning process

Package structure and chip structure

Multiple layer scheme patterning process

Multi-threshold voltage field effect transistor and manufacturing m...

Manufacturing method of package structure having conductive shield

Method for forming package structure including intermetallic compound

Method for forming semiconductor device structure with bumps

Metal-oxide-semiconductor field-effect transistor with extended gat...

Method of manufacturing a motion sensor device

One-time-programming (OTP) memory cell with floating gate shielding

Multi-threshold voltage field effect transistor and manufacturing m...

Stacked chip package structure and manufacturing method thereof

Method of fabricating MEMS devices having a plurality of cavities

Metal-oxide-semiconductor field-effect transistor with extended gat...

Motion sensor device and methods for forming the same

MEMS devices having a plurality of cavities

Thin capped channel layers of semiconductor devices and methods of...

Leadframe-type semiconductor package having EMI shielding layer con...

Semiconductor package utilizing tape to reinforce fixing of leads t...

LDD epitaxy for FinFETs

High voltage device embedded non-volatile memory cell and fabricati...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Multiple Layer Scheme Patterning Process

BUMP LAYOUT FOR COPLANARITY IMPROVEMENT

Multiple Layer Scheme Patterning Process

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND CHIP STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MULTI-THRESHOLD VOLTAGE FIELD EFFECT TRANSISTOR AND MANUFACTURING M...

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ONE-TIME-PROGRAMMING (OTP) MEMORY CELL WITH FLOATING GATE SHIELDING

MULTI-THRESHOLD VOLTAGE FIELD EFFECT TRANSISTOR AND MANUFACTURING M...

Metal-Oxide-Semiconductor Field-Effect Transistor with Extended Gat...

Motion Sensor Device and Methods for Forming the Same

METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES

Metal-Oxide-Semiconductor Field-Effect Transistor with Extended Gat...

MEMS Structures and Methods of Forming the Same

LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING LAYER CON...

THIN CAPPED CHANNEL LAYERS OF SEMICONDUCTOR DEVICES AND METHODS OF...

Motion Sensor Device and Methods for Forming the Same

LDD Epitaxy for FinFETs

Reducing Device Mismatch by Adjusting Titanium Formation

High voltage device embedded non-volatile memory cell and fabricati...