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Cheang-Whang Chang
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Mountain View, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Interwafer connection structure for coupling wafers in a wafer stack
Patent number
11,901,338
Issue date
Feb 13, 2024
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Runtime measurement of process variations and supply voltage charac...
Patent number
11,585,854
Issue date
Feb 21, 2023
Xilinx, Inc.
Da Cheng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Stacked silicon package assembly having vertical thermal management
Patent number
11,488,936
Issue date
Nov 1, 2022
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked silicon package assembly having thermal management
Patent number
11,355,412
Issue date
Jun 7, 2022
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device with stacked dies having mirrored circuitry
Patent number
11,205,639
Issue date
Dec 21, 2021
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked silicon package assembly having thermal management
Patent number
11,145,566
Issue date
Oct 12, 2021
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC die with dummy structures
Patent number
11,114,344
Issue date
Sep 7, 2021
Xilinx, Inc.
Hui-Wen Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test circuits for testing a die stack
Patent number
11,054,461
Issue date
Jul 6, 2021
Xilinx, Inc.
Nui Chong
G01 - MEASURING TESTING
Information
Patent Grant
Package integration for memory devices
Patent number
10,770,430
Issue date
Sep 8, 2020
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package assembly with modular core dice
Patent number
10,692,837
Issue date
Jun 23, 2020
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer edge partial die engineered for stacked die yield
Patent number
10,431,565
Issue date
Oct 1, 2019
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-die transistor characterization in an IC
Patent number
10,379,155
Issue date
Aug 13, 2019
Xilinx, Inc.
Ping-Chin Yeh
G01 - MEASURING TESTING
Information
Patent Grant
Circuit for and method of testing bond connections between a first...
Patent number
10,262,911
Issue date
Apr 16, 2019
Xilinx, Inc.
Yuqing Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and design of low sheet resistance MEOL resistors
Patent number
10,103,139
Issue date
Oct 16, 2018
Xilinx, Inc.
Nui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for assembling and testing a multi-integrated...
Patent number
10,096,502
Issue date
Oct 9, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded wire arrangement for die testing
Patent number
9,412,674
Issue date
Aug 9, 2016
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of testing a semiconductor structure
Patent number
8,810,269
Issue date
Aug 19, 2014
Xilinx, Inc.
Yuqing Gong
G01 - MEASURING TESTING
Information
Patent Grant
Methods of manufacturing a semiconductor structure
Patent number
8,802,454
Issue date
Aug 12, 2014
Xilinx, Inc.
Arifur Rahman
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SINGLE EVENT UPSET TOLERANT MEMORY DEVICE
Publication number
20240201863
Publication date
Jun 20, 2024
Xilinx, Inc.
Kumar RAHUL
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED CIRCUIT (IC) Protections
Publication number
20240145411
Publication date
May 2, 2024
Xilinx, Inc.
Myongseob KIM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD FOR MITIGATING WARPAGE ON STACKED WAFERS
Publication number
20240038556
Publication date
Feb 1, 2024
Xilinx, Inc.
Myongseob KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK
Publication number
20230140675
Publication date
May 4, 2023
Xilinx, Inc.
Myongseob KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE WITH STACKED DIES HAVING MIRRORED CIRCUITRY
Publication number
20210265312
Publication date
Aug 26, 2021
Xilinx, Inc.
Myongseob KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
Publication number
20210249328
Publication date
Aug 12, 2021
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING VERTICAL THERMAL MANAGEMENT
Publication number
20210193620
Publication date
Jun 24, 2021
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INTEGRATION FOR MEMORY DEVICES
Publication number
20200303341
Publication date
Sep 24, 2020
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
Publication number
20200105642
Publication date
Apr 2, 2020
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...
Publication number
20180144963
Publication date
May 24, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DESIGN OF LOW SHEET RESISTANCE MEOL RESISTORS
Publication number
20170012041
Publication date
Jan 12, 2017
Xilinx, Inc.
Nui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-DIE TRANSISTOR CHARACTERIZATION IN AN IC
Publication number
20160097805
Publication date
Apr 7, 2016
Xilinx, Inc.
Ping-Chin Yeh
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF TESTING A SEMICONDUCTOR STRUCTURE
Publication number
20140091819
Publication date
Apr 3, 2014
Xilinx, Inc.
Yuqing Gong
G01 - MEASURING TESTING