Chee Hiong Chew

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,355,009
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,755
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,812
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates and related methods
- Patent number 12,300,558
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip design and method of controlling clip position
- Patent number 12,283,562
- Issue date Apr 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate package systems and related methods
- Patent number 12,211,775
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,033,904
- Issue date Jul 9, 2024
- Semiconductor Components Industries, L.L.C.
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,955,412
- Issue date Apr 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,948,870
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,908,840
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,894,347
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting clip design for pressure sintering
- Patent number 11,804,421
- Issue date Oct 31, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,791,288
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with guide pin
- Patent number 11,710,687
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,672,087
- Issue date Jun 6, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer with pattern layout for dual side cooling power module
- Patent number 11,562,938
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 11,532,539
- Issue date Dec 20, 2022
- Semiconductor Components Industries, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20250201675
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
- Publication number 20250118640
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20250038066
- Publication date Jan 30, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE
- Publication number 20250029901
- Publication date Jan 23, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Silnore Tejero SABANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240290758
- Publication date Aug 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES AND RELATED METHODS
- Publication number 20240258181
- Publication date Aug 1, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203846
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203845
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE
- Publication number 20240162197
- Publication date May 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240128240
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
- Publication number 20240038632
- Publication date Feb 1, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
- Publication number 20240030208
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240030108
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
- Publication number 20230326901
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GUIDE PIN
- Publication number 20230317579
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED POWER TERMINALS IN A POWER ELECTRONICS MODULE
- Publication number 20230180410
- Publication date Jun 8, 2023
- Semiconductor Components Industries, LLC
- Vemmond Jeng Hung NG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20230073773
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20230073330
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS

Chee Hiong Chew

Person

Patents Grantslast 30 patents

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor package and related methods

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor package system and related methods

Substrates and related methods

Clip design and method of controlling clip position

Semiconductor package with wettable flank and related methods

Multiple substrate package systems and related methods

Semiconductor package with wettable flank

Die sidewall coatings and related methods

Semiconductor package system and related methods

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor packages with die including cavities

Low stress asymmetric dual side module

Backmetal removal methods

Semiconductor packages with die support structure for thin die

Low stress asymmetric dual side module

Semiconductor package and related methods

Connecting clip design for pressure sintering

Reinforced semiconductor die and related methods

Semiconductor package with guide pin

Semiconductor package

Semiconductor package with elastic coupler and related methods

Spacer with pattern layout for dual side cooling power module

Semiconductor devices and methods of making the same

Semiconductor package with wettable flank

Polymer resin and compression mold chip scale package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

PACKAGE WITH MOLDING CAVITY

POWER MODULE WITH OVERLAPPING TERMINALS

DIE SIDEWALL COATINGS AND RELATED METHODS

SANDWICH PACKAGE FOR MICROELECTRONICS

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE

HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION

SEMICONDUCTOR PACKAGE WITH GUIDE PIN

STACKED POWER TERMINALS IN A POWER ELECTRONICS MODULE

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK