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Patents Grants
last 30 patents
Information
Patent Grant
Method for packaging small size memory cards
Patent number
7,089,661
Issue date
Aug 15, 2006
Flex-P Industries Sdn Bhd.
Piau Fong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Direct attachment of semiconductor chip to organic substrate
Patent number
7,042,070
Issue date
May 9, 2006
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density internal ball grid array integrated circuit package
Patent number
6,768,646
Issue date
Jul 27, 2004
Texas Instruments Incorporated
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct attachment semiconductor chip to organic substrate
Patent number
6,602,803
Issue date
Aug 5, 2003
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating thin integrated circuit units
Patent number
6,468,831
Issue date
Oct 22, 2002
Texas Instruments Incorporated
Chew Weng Leong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
Patent number
6,387,729
Issue date
May 14, 2002
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package
Patent number
6,365,833
Issue date
Apr 2, 2002
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modifying memory device organization in high density packages
Patent number
6,278,616
Issue date
Aug 21, 2001
Texas Instruments Incorporated
Tito Gelsomini
G11 - INFORMATION STORAGE
Information
Patent Grant
Stacked double sided integrated circuit package
Patent number
6,274,929
Issue date
Aug 14, 2001
Texas Instruments Incorporated
Chew Weng Leong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device testing and burn-in methodology
Patent number
6,218,202
Issue date
Apr 17, 2001
Texas Instruments Incorporated
Chee Kiang Yew
G01 - MEASURING TESTING
Information
Patent Grant
Thin stacked integrated circuit device
Patent number
6,137,164
Issue date
Oct 24, 2000
Texas Instruments Incorporated
Chee Klang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin chip-size integrated circuit package
Patent number
6,091,140
Issue date
Jul 18, 2000
Texas Instruments Incorporated
Tuck Fook Toh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
Patent number
6,087,203
Issue date
Jul 11, 2000
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridging method of interconnects for integrated circuit packages
Patent number
6,084,306
Issue date
Jul 4, 2000
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip size integrated circuit package
Patent number
6,049,129
Issue date
Apr 11, 2000
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density single inline memory module
Patent number
5,956,233
Issue date
Sep 21, 1999
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method and apparatus for a communication hub
Publication number
20050033996
Publication date
Feb 10, 2005
Piau Fong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Method for packaging small size memory cards
Publication number
20040245674
Publication date
Dec 9, 2004
Chee Kiang Yew
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for packaging small size memory cards
Publication number
20040201969
Publication date
Oct 14, 2004
Piau Fong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Direct attachment of semiconductor chip to organic substrate
Publication number
20040004283
Publication date
Jan 8, 2004
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT ATTACHMENT SEMICONDUCTOR CHIP TO ORGANIC SUBSTRATE
Publication number
20020130397
Publication date
Sep 19, 2002
CHEE KIANG YEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for adhering and sealing a silicon chip in an integrated cir...
Publication number
20020001882
Publication date
Jan 3, 2002
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin integrated circuit unit
Publication number
20020000648
Publication date
Jan 3, 2002
Chew Weng Leong
H01 - BASIC ELECTRIC ELEMENTS