Chee Sheng Lim

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode package having a protective coating
- Patent number 11,444,225
- Issue date Sep 13, 2022
- Dominant Opto Technologies SDN BHD
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package with substrate configuration having en...
- Patent number 11,444,227
- Issue date Sep 13, 2022
- Dominant Opto Technologies SDN BHD
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and housing sub-assembly for use in a light emitting dio...
- Patent number 11,329,206
- Issue date May 10, 2022
- Dominant Opto Technologies SDN BHD
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a die
- Patent number 8,907,501
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode
- Patent number D710809
- Issue date Aug 12, 2014
- DOMINANT Opto Technologies Sdn. Bhd.
- Tek Beng Low
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device and method of packaging a semiconductor device...
- Patent number 8,637,977
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip electronic package with reduced stress
- Patent number 8,604,595
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a die
- Patent number 8,563,357
- Issue date Oct 22, 2013
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging a semiconductor device...
- Patent number 8,486,757
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package
- Patent number 8,373,279
- Issue date Feb 12, 2013
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of an integrated circuit package
- Patent number RE43818
- Issue date Nov 20, 2012
- Infineon Technologies AG
- Chee Chian Lim
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Electronic component and method for its production
- Patent number 8,049,311
- Issue date Nov 1, 2011
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of assembly
- Patent number 7,956,459
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and a method of making the integrated cir...
- Patent number 7,944,050
- Issue date May 17, 2011
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of an integrated circuit package
- Patent number 7,618,845
- Issue date Nov 17, 2009
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package, panel and methods of manufacturing the...
- Patent number 7,553,745
- Issue date Jun 30, 2009
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHTING SYSTEMS AND ASSOCIATED METHODS OF COMBINING VISIBLE AND NO...
- Publication number 20240234647
- Publication date Jul 11, 2024
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING SYSTEMS AND ASSOCIATED METHODS OF COMBINING VISIBLE AND NO...
- Publication number 20240136478
- Publication date Apr 25, 2024
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING SYSTEMS AND METHODS COMBINING VISIBLE AND NON-VISIBLE LIGH...
- Publication number 20230071389
- Publication date Mar 9, 2023
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING SYSTEMS AND ASSOCIATED METHODS COMBINING VISIBLE AND NON-V...
- Publication number 20220399482
- Publication date Dec 15, 2022
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND HOUSING SUB-ASSEMBLY FOR USE IN A LIGHT EMITTING DIO...
- Publication number 20220102600
- Publication date Mar 31, 2022
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE HAVING A PROTECTIVE COATING
- Publication number 20220077359
- Publication date Mar 10, 2022
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE HAVING A SMALL LIGHT EMITTING SURFACE
- Publication number 20220077353
- Publication date Mar 10, 2022
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE HAVING BACK-TO-BACK COMPARTMENT CONFIG...
- Publication number 20210257348
- Publication date Aug 19, 2021
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE WITH SUBSTRATE CONFIGURATION HAVING EN...
- Publication number 20210098669
- Publication date Apr 1, 2021
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING SYSTEMS AND ASSOCIATED METHODS COMBINING VISIBLE AND NON-V...
- Publication number 20190371977
- Publication date Dec 5, 2019
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE (LED) PACKAGE
- Publication number 20190355876
- Publication date Nov 21, 2019
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING SYSTEMS AND METHODS COMBINING VISIBLE AND NON-VISIBLE LIGH...
- Publication number 20190123246
- Publication date Apr 25, 2019
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SIMPLIFYING INTEGRATION OF LEDs INTO MULTIP...
- Publication number 20190049512
- Publication date Feb 14, 2019
- DOMINANT Opto Technologies Sdn Bhd
- Tek Beng LOW
- G01 - MEASURING TESTING
Information Patent Application
Method of Packaging a Die
- Publication number 20150091195
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging a Die
- Publication number 20140015134
- Publication date Jan 16, 2014
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...
- Publication number 20130285249
- Publication date Oct 31, 2013
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE (LED) COMPONENT WITH HIGH SIGNAL-TO-NOISE RATIO
- Publication number 20130277693
- Publication date Oct 24, 2013
- Tek Beng LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHTING DEVICE WITH HIGH COLOUR RE-PRODUCIBILITY
- Publication number 20120025223
- Publication date Feb 2, 2012
- Tek Beng Low
- F21 - LIGHTING
Information Patent Application
DIE PACKAGE
- Publication number 20110261542
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...
- Publication number 20110121461
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging a Die
- Publication number 20090321961
- Publication date Dec 31, 2009
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component and Method for its Production
- Publication number 20090250807
- Publication date Oct 8, 2009
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND A METHOD OF MAKING THE INTEGRATED CIR...
- Publication number 20090194873
- Publication date Aug 6, 2009
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Electronic Package with Reduced Stress
- Publication number 20090008756
- Publication date Jan 8, 2009
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Assembly
- Publication number 20090001609
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method for Manufacturing an Integrat...
- Publication number 20080105960
- Publication date May 8, 2008
- Beng Keh See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package, Panel and Methods of Manufacturing the...
- Publication number 20080009097
- Publication date Jan 10, 2008
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of an integrated circuit package
- Publication number 20070178628
- Publication date Aug 2, 2007
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Chee Sheng Lim

Person

Patents Grantslast 30 patents

Light emitting diode package having a protective coating

Light emitting diode package with substrate configuration having en...

Lead frame and housing sub-assembly for use in a light emitting dio...

Method of packaging a die

Light emitting diode

Semiconductor device and method of packaging a semiconductor device...

Multi-chip electronic package with reduced stress

Method of packaging a die

Semiconductor device and method of packaging a semiconductor device...

Die package

Fabrication of an integrated circuit package

Electronic component and method for its production

Semiconductor device and method of assembly

Integrated circuit device and a method of making the integrated cir...

Fabrication of an integrated circuit package

Integrated circuit package, panel and methods of manufacturing the...

Patents Applicationslast 30 patents

LIGHTING SYSTEMS AND ASSOCIATED METHODS OF COMBINING VISIBLE AND NO...

LIGHTING SYSTEMS AND ASSOCIATED METHODS OF COMBINING VISIBLE AND NO...

LIGHTING SYSTEMS AND METHODS COMBINING VISIBLE AND NON-VISIBLE LIGH...

LIGHTING SYSTEMS AND ASSOCIATED METHODS COMBINING VISIBLE AND NON-V...

LEAD FRAME AND HOUSING SUB-ASSEMBLY FOR USE IN A LIGHT EMITTING DIO...

LIGHT EMITTING DIODE PACKAGE HAVING A PROTECTIVE COATING

LIGHT EMITTING DIODE PACKAGE HAVING A SMALL LIGHT EMITTING SURFACE

LIGHT EMITTING DIODE PACKAGE HAVING BACK-TO-BACK COMPARTMENT CONFIG...

LIGHT EMITTING DIODE PACKAGE WITH SUBSTRATE CONFIGURATION HAVING EN...

LIGHTING SYSTEMS AND ASSOCIATED METHODS COMBINING VISIBLE AND NON-V...

LIGHT EMITTING DIODE (LED) PACKAGE

LIGHTING SYSTEMS AND METHODS COMBINING VISIBLE AND NON-VISIBLE LIGH...

SYSTEMS AND METHODS FOR SIMPLIFYING INTEGRATION OF LEDs INTO MULTIP...

Method of Packaging a Die

Method of Packaging a Die

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...

LIGHT EMITTING DIODE (LED) COMPONENT WITH HIGH SIGNAL-TO-NOISE RATIO

LED LIGHTING DEVICE WITH HIGH COLOUR RE-PRODUCIBILITY

DIE PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...

Method of Packaging a Die

Electronic Component and Method for its Production

INTEGRATED CIRCUIT DEVICE AND A METHOD OF MAKING THE INTEGRATED CIR...

Multi-Chip Electronic Package with Reduced Stress

Semiconductor Device and Method of Assembly

Integrated Circuit Package and Method for Manufacturing an Integrat...

Integrated Circuit Package, Panel and Methods of Manufacturing the...

Fabrication of an integrated circuit package