Cheng-Chi Cheng

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing and measuring system for semiconductor structures
- Patent number 12,191,215
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ta Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter module
- Patent number 11,439,016
- Issue date Sep 6, 2022
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter module
- Patent number 11,252,820
- Issue date Feb 15, 2022
- Delta Electronics, Inc.
- Da Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water-cooling heat dissipation system
- Patent number 7,069,737
- Issue date Jul 4, 2006
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device having improved fastening structure
- Patent number 7,019,979
- Issue date Mar 28, 2006
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening structure of heat sink
- Patent number 6,968,889
- Issue date Nov 29, 2005
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening device for heat slug
- Patent number 6,882,534
- Issue date Apr 19, 2005
- Waffer Tech. Co.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning and buckling structure for use in a radiator
- Patent number 6,672,379
- Issue date Jan 6, 2004
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Positioning structure for heat dissipating fins
- Patent number 6,607,028
- Issue date Aug 19, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink assembly
- Patent number 6,595,275
- Issue date Jul 22, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating fin
- Patent number 6,571,862
- Issue date Jun 3, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device for a CPU
- Patent number 6,542,370
- Issue date Apr 1, 2003
- Waffer Technology Corporation
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20230125695
- Publication date Apr 27, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-TA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING AND MEASURING SYSTEM FOR SEMICONDUCTOR STRUCTURES
- Publication number 20230128335
- Publication date Apr 27, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-TA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20220132670
- Publication date Apr 28, 2022
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT DEVICE
- Publication number 20090195417
- Publication date Aug 6, 2009
- MOBINNOVA CORP.
- Cheng-Chi CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HAND-HELD ELECTRONIC DEVICE
- Publication number 20090109179
- Publication date Apr 30, 2009
- MOBINNOVA HONG KONG LIMITED
- Cheng-Chi Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Air conditioning heat dissipation system
- Publication number 20050254213
- Publication date Nov 17, 2005
- Jack Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Water-cooling heat dissipation system
- Publication number 20050230086
- Publication date Oct 20, 2005
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATING DEVICE HAVING IMPROVED FASTENING STRUCTURE
- Publication number 20050111190
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening structure of heat sink
- Publication number 20050111196
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening structure of heat sink
- Publication number 20050109488
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening device for heat slug
- Publication number 20040130875
- Publication date Jul 8, 2004
- WAFFER TECHNOLOGY CORP.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Chi Cheng

Person

Patents Grantslast 30 patents

Manufacturing and measuring system for semiconductor structures

Power converter module

Power converter module

Water-cooling heat dissipation system

Heat dissipating device having improved fastening structure

Fastening structure of heat sink

Fastening device for heat slug

Positioning and buckling structure for use in a radiator

Positioning structure for heat dissipating fins

Heat sink assembly

Heat dissipating fin

Heat dissipating device for a CPU

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURES

MANUFACTURING AND MEASURING SYSTEM FOR SEMICONDUCTOR STRUCTURES

POWER CONVERTER MODULE

INPUT DEVICE

HAND-HELD ELECTRONIC DEVICE

Air conditioning heat dissipation system

Water-cooling heat dissipation system

HEAT DISSIPATING DEVICE HAVING IMPROVED FASTENING STRUCTURE

Fastening structure of heat sink

Fastening structure of heat sink

Fastening device for heat slug