Cheng-Chieh CHANG

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device
- Patent number 12,274,030
- Issue date Apr 8, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation module
- Patent number 12,228,146
- Issue date Feb 18, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Tiled device and electronic device
- Patent number 12,219,843
- Issue date Feb 4, 2025
- Innolux Corporation
- Ya-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCI-E bus standard compliant multifunctional interface board
- Patent number 12,174,768
- Issue date Dec 24, 2024
- Innodisk Corporation
- Hsi-Hsi Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive structures and methods of formation
- Patent number 12,170,331
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,170,325
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing the same
- Patent number 12,148,873
- Issue date Nov 19, 2024
- AUO Corporation
- Fang-Cheng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight module
- Patent number 12,140,793
- Issue date Nov 12, 2024
- CHICONY POWER TECHNOLOGY CO., LTD.
- Cheng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer and method of forming same
- Patent number 12,107,149
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Jhe Sie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Network device and network connection method
- Patent number 12,096,495
- Issue date Sep 17, 2024
- Realtek Semiconductor Corporation
- Cheng-Ju Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,087,575
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct memory access data path for RAID storage
- Patent number 12,079,521
- Issue date Sep 3, 2024
- GRAID Technology Inc.
- Guo-Fu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method to form an inductive component
- Patent number 12,080,472
- Issue date Sep 3, 2024
- Cyntec Co., Ltd.
- Pei-I Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 12,068,252
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side contact structures in semiconductor devices
- Patent number 12,046,634
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,040,434
- Issue date Jul 16, 2024
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric structure extending into...
- Patent number 12,027,608
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and package structure having multi-dies the...
- Patent number 12,020,998
- Issue date Jun 25, 2024
- Mediatek Inc.
- Chuan-Shian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,009,294
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of narrow type inkjet print head chip
- Patent number 12,005,711
- Issue date Jun 11, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,002,737
- Issue date Jun 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,996,466
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Huang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain EPI structure for improving contact quality
- Patent number 11,996,333
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,973,124
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of titanium silicide and titanium nitride by hy...
- Patent number 11,972,951
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled device and electronic device
- Patent number 11,968,869
- Issue date Apr 23, 2024
- Innolux Corporation
- Ya-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure field-effect transistor device and method of forming
- Patent number 11,961,919
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,962,878
- Issue date Apr 16, 2024
- Acer Incorporated
- Yu-Chin Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Board, circuit board, and fixture
- Patent number 11,956,887
- Issue date Apr 9, 2024
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLANTING COLUMN
- Publication number 20250113784
- Publication date Apr 10, 2025
- SHENG SAN CO., LTD.
- Cheng-Chung CHANG
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087635
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Shu-Chuan CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20250072027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMATION
- Publication number 20250063758
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCRETE FLOOR HARDENING AGENT
- Publication number 20250042815
- Publication date Feb 6, 2025
- Jun An Shun Technology Co., Ltd.
- Cheng-Feng CHANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
IMAGE QUALITY EVALUATION SYSTEM, IMAGE QUALITY EVALUATION METHOD AN...
- Publication number 20250045894
- Publication date Feb 6, 2025
- WISTRON NEWEB CORPORATION
- CHENG-YUAN CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR REDUCING SURFACE TENSION OF POLYMER MATERIAL AND METHOD...
- Publication number 20250011558
- Publication date Jan 9, 2025
- National Tsing Hua University
- Rong-Ming HO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CODING APPARATUS AND CODING METHOD
- Publication number 20250007534
- Publication date Jan 2, 2025
- NOVATEK MICROELECTRONICS CORP.
- Cheng-Yang Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method of Redialing under Handover Limitation
- Publication number 20240406807
- Publication date Dec 5, 2024
- MEDIATEK INC.
- Chun-Li Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMON RAIL CONTACT
- Publication number 20240387655
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET HEAD CHIP IDENTIFICATION CIRCUIT
- Publication number 20240383255
- Publication date Nov 21, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
AIR SPACER AND METHOD OF FORMING SAME
- Publication number 20240379820
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Jhe Sie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INSULATING FINS
- Publication number 20240379797
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240363339
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Conductive Structures
- Publication number 20240355742
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240339572
- Publication date Oct 10, 2024
- Lextar Electronics Corporation
- Yu-Jing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Side Contact Structures in Semiconductor Devices
- Publication number 20240339497
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-WEAR SCREW
- Publication number 20240328445
- Publication date Oct 3, 2024
- AURAS Technology Co., Ltd.
- Cheng-Ju CHANG
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
TERMINAL, METHOD, AND SERVER
- Publication number 20240320706
- Publication date Sep 26, 2024
- 17LIVE Japan Inc.
- Hao-Jung LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY
- Publication number 20240312844
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...
- Publication number 20240313091
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERFORMING ENHANCED PREAMBLE PUNCTURING IN WIRELESS COMM...
- Publication number 20240306133
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Cheng-Yi Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PERFORMING DYNAMIC SUPER-BAND OPERATION IN WIRELESS SYST...
- Publication number 20240306204
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Cheng-Yi Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240290869
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Huang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240282674
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240282698
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240266335
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Huan-Shiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation Of Titanium Silicide And Titanium Nitride By Hy...
- Publication number 20240249948
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Chieh CHANG

Person

Patents Grantslast 30 patents

Heat dissipation device

Heat dissipation module

Tiled device and electronic device

PCI-E bus standard compliant multifunctional interface board

Conductive structures and methods of formation

Method of manufacturing a semiconductor device and a semiconductor...

Light emitting device and method for manufacturing the same

Backlight module

Semiconductor structure cutting process and structures formed thereby

Air spacer and method of forming same

Network device and network connection method

Conductive feature formation and structure

Direct memory access data path for RAID storage

Method to form an inductive component

Hybrid conductive structures

Dual side contact structures in semiconductor devices

Diode package structure and manufacturing method thereof

Semiconductor structure having dielectric structure extending into...

Semiconductor structure and package structure having multi-dies the...

Middle-of-line interconnect structure and manufacturing method

Manufacturing method of narrow type inkjet print head chip

Electronic package and method of fabricating the same

Semiconductor device and method of manufacture

Source/drain EPI structure for improving contact quality

Method of manufacturing a semiconductor device and a semiconductor...

Selective formation of titanium silicide and titanium nitride by hy...

Tiled device and electronic device

Nanostructure field-effect transistor device and method of forming

Electronic device

Board, circuit board, and fixture

Patents Applicationslast 30 patents

PLANTING COLUMN

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

CONDUCTIVE STRUCTURES AND METHODS OF FORMATION

CONCRETE FLOOR HARDENING AGENT

IMAGE QUALITY EVALUATION SYSTEM, IMAGE QUALITY EVALUATION METHOD AN...

METHOD FOR REDUCING SURFACE TENSION OF POLYMER MATERIAL AND METHOD...

CODING APPARATUS AND CODING METHOD

Method of Redialing under Handover Limitation

COMMON RAIL CONTACT

INKJET HEAD CHIP IDENTIFICATION CIRCUIT

AIR SPACER AND METHOD OF FORMING SAME

TRANSISTOR INSULATING FINS

Semiconductor Structure Cutting Process and Structures Formed Thereby

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

Hybrid Conductive Structures

DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Dual Side Contact Structures in Semiconductor Devices

ANTI-WEAR SCREW

TERMINAL, METHOD, AND SERVER

SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY

SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC STRUCTURE EXTENDING INTO...

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

METHOD FOR PERFORMING ENHANCED PREAMBLE PUNCTURING IN WIRELESS COMM...

METHOD FOR PERFORMING DYNAMIC SUPER-BAND OPERATION IN WIRELESS SYST...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

Selective Formation Of Titanium Silicide And Titanium Nitride By Hy...