Cheng-Heng Kao

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Tao-Yuang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip interconnection structure and process of making the same
- Patent number 6,744,142
- Issue date Jun 1, 2004
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating flip chip interconnection structure
- Patent number 6,642,079
- Issue date Nov 4, 2003
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling the formation of intermetallic compounds in...
- Patent number 6,602,777
- Issue date Aug 5, 2003
- National Central University
- Cheng-Heng Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME
- Publication number 20030234453
- Publication date Dec 25, 2003
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING THE FORMATION OF INTERMETALLIC COMPOUNDS IN...
- Publication number 20030132271
- Publication date Jul 17, 2003
- Cheng-Heng Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR