Zheng et al., Intermetallic Growth on PWBs Soldered with Sn3.8Ag.07Cu, 2002 Electronic Components & Technology Conference, Apr. 2002, pp. 1226-1231.* |
Zeng et al., Intermetallic Reactions between Lead-free SnAgCu Solder and Ni(P)/Au Surface Finish on PWBs, 2001 Electronic Components & Technology Conference, Apr. 2001.* |
Yang et al., Intermetallic Growth between SN-Ag-(Cu) Solder and Ni, 2001 Int'l Symposium on Electronic Materials and Packaging, Jul., 2001, pp. 219-224.* |
Zeng et al., Interfacial Reactions between Lead-free SnAgCu Solder and Ni(P) Surface Finish aon Printed Circuit boards, IEEE Transactions on Electronic packaging Manufacturing, vol., 25, No. 3, Jul. 2002, pp. 162, 167.* |
Kinyanjui et al., Effects of Reflow Conditions on the Formation of Au-Ni-Sn Compounds at the INterface of Au-Pb-Sn and Au-Sn Solder Joints with Ni Substrate, 2002 Electronic Components & Technology Conference, Apr. 2002, pp. 161-167.* |
Shiau et al., Effectg of Cu Concentrastin on teh Solid-State Aging Reactions bewtween SnAgCu Lead-free Solders and Ni, From Http://www.seas.ucla.edu/eThinFilm/Pb-freeWorkshop/abs/p_shiau.html website , found 3/3/3.* |
Shiau et al., Reactions between Sn-Ag-Cu Lead-freee Solders and the Au/Ni Surface Finish in Advanced Electronic Packages, found on INSPEC search engine, 2002. |