CHENG-KANG PENG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,156,479
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Lin Huang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Immersion heat dissipation structure
- Patent number 11,510,342
- Issue date Nov 22, 2022
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Optical transceiver and fiber array thereof
- Patent number 11,119,287
- Issue date Sep 14, 2021
- Prime World International Holdings Ltd.
- Cheng-Te Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Lin Huang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LIQUID-COOLING HEAT-DISSIPATION STRUCTURE
- Publication number 20230292469
- Publication date Sep 14, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE
- Publication number 20230266076
- Publication date Aug 24, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE STRUCTURE
- Publication number 20230262931
- Publication date Aug 17, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION-TYPE HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTUR...
- Publication number 20230240044
- Publication date Jul 27, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE
- Publication number 20230200022
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE HAVING MICROPOROUS STRUCTURE
- Publication number 20230184498
- Publication date Jun 15, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE
- Publication number 20230189475
- Publication date Jun 15, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE
- Publication number 20230180435
- Publication date Jun 8, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION HEAT DISSIPATION STRUCTURE
- Publication number 20230160646
- Publication date May 25, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING HEAT DISSIPATION SUBSTRATE WITH PARTIAL COMPRESSION...
- Publication number 20230152045
- Publication date May 18, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING HEAT DISSIPATION SUBSTRATE STRUCTURE WITH PARTIAL CO...
- Publication number 20230156866
- Publication date May 18, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION HEAT DISSIPATION STRUCTURE HAVING MACROSCOPIC FIN STRUCTU...
- Publication number 20230121635
- Publication date Apr 20, 2023
- Amulaire thermal technology, INC.
- CHING-MING YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSION-TYPE POROUS HEAT DISSIPATION SUBSTRATE STRUCTURE
- Publication number 20230098773
- Publication date Mar 30, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TWO-PHASE IMMERSION TYPE HEAT DISSIPATION FIN COMPOSITE STRUCTURE
- Publication number 20230064787
- Publication date Mar 2, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WATER-COOLING DEVICE WITH COMPOSITE HEAT-DISSIPATING STRUCTURE
- Publication number 20220246493
- Publication date Aug 4, 2022
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216396
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Lin Huang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LIFT-OFF STRUCTURE FOR SPRAYED THIN LAYER ON SUBSTRATE SURFACE AND...
- Publication number 20220193828
- Publication date Jun 23, 2022
- Amulaire thermal technology, INC.
- Cheng-Shu Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING FOCUSING LENS WITH FIBER ARRAY AND METHOD OF ALIG...
- Publication number 20210333490
- Publication date Oct 28, 2021
- Prime World International Holdings Ltd.
- Cheng-Te PENG
- G02 - OPTICS
Information Patent Application
THIN-TYPE KEYBOARD STRUCTURE
- Publication number 20150206673
- Publication date Jul 23, 2015
- CHICONY ELECTRONICS CO., LTD.
- CHIH-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS

CHENG-KANG PENG

Person

Patents Grantslast 30 patents

Memory device and manufacturing method thereof

Immersion heat dissipation structure

Optical transceiver and fiber array thereof

Patents Applicationslast 30 patents

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

LIQUID-COOLING HEAT-DISSIPATION STRUCTURE

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE STRUCTURE

IMMERSION-TYPE HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTUR...

TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE

IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE HAVING MICROPOROUS STRUCTURE

IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE

IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE

IMMERSION HEAT DISSIPATION STRUCTURE

LIQUID COOLING HEAT DISSIPATION SUBSTRATE WITH PARTIAL COMPRESSION...

LIQUID COOLING HEAT DISSIPATION SUBSTRATE STRUCTURE WITH PARTIAL CO...

IMMERSION HEAT DISSIPATION STRUCTURE HAVING MACROSCOPIC FIN STRUCTU...

IMMERSION-TYPE POROUS HEAT DISSIPATION SUBSTRATE STRUCTURE

TWO-PHASE IMMERSION TYPE HEAT DISSIPATION FIN COMPOSITE STRUCTURE

WATER-COOLING DEVICE WITH COMPOSITE HEAT-DISSIPATING STRUCTURE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

LIFT-OFF STRUCTURE FOR SPRAYED THIN LAYER ON SUBSTRATE SURFACE AND...

METHOD OF BONDING FOCUSING LENS WITH FIBER ARRAY AND METHOD OF ALIG...

THIN-TYPE KEYBOARD STRUCTURE