Cheng YANG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method for calculating surface relaxation rate of shale
- Patent number 12,153,004
- Issue date Nov 26, 2024
- SOUTHWEST PETROLEUM UNIVERSITY
- Xinyang He
- G01 - MEASURING TESTING
Information Patent Grant
Method and electronic device for grouping objects in data managemen...
- Patent number 12,040,948
- Issue date Jul 16, 2024
- Dell Products L.P.
- Weiyang Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of thermal interface material in multi-chip package
- Patent number 11,682,603
- Issue date Jun 20, 2023
- Flex Ltd.
- Cheng Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,304,302
- Issue date Apr 12, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded copper structure for microelectronics package
- Patent number 11,270,974
- Issue date Mar 8, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with double side mounted board
- Patent number 10,896,877
- Issue date Jan 19, 2021
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane treatment of ammonia-containing waste water
- Patent number 10,752,533
- Issue date Aug 25, 2020
- DDP SPECIALTY ELECTRONIC MATERIALS US, INC
- Cheng Yang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Overlapping stacked die package with vertical columns
- Patent number 10,629,561
- Issue date Apr 21, 2020
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping stacked die package with vertical columns
- Patent number 10,256,208
- Issue date Apr 9, 2019
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a fin locate...
- Patent number 10,236,216
- Issue date Mar 19, 2019
- Semiconductor Manufacturing International (Shanghai) Corp.
- Hai Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with molding compound
- Patent number 9,936,582
- Issue date Apr 3, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via guard ring
- Patent number 9,269,676
- Issue date Feb 23, 2016
- Intel Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for a dram capacitor having low depletion ratio
- Patent number 8,742,542
- Issue date Jun 3, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for a DRAM capacitor having low depletion ratio
- Patent number 8,426,286
- Issue date Apr 23, 2013
- Semiconductor Manufacturing International (Shanghai) Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via guard ring
- Patent number 8,395,241
- Issue date Mar 12, 2013
- Intel Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for continuous line-type landing polysilicon cont...
- Patent number 8,318,556
- Issue date Nov 27, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ping Ting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for direct etching
- Patent number 7,534,711
- Issue date May 19, 2009
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-EFFICIENCY ACTIVE LAYER AND SEMICONDUCTOR LIGHT-EMITTING DEVIC...
- Publication number 20240332910
- Publication date Oct 3, 2024
- Suzhou Everbright Photonics Co., Ltd.
- Jun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20240327980
- Publication date Oct 3, 2024
- Suzhou Everbright Photonics Co., Ltd.
- Yang CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR WRITING FEEDBACK USING AN ARTIFICIAL INTELL...
- Publication number 20240303247
- Publication date Sep 12, 2024
- Microsoft Technology Licensing, LLC
- Aleksey Aleksandrovich SOKOLOV
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR GROWTH DEVICE AND OPERATION METHOD THEREOF
- Publication number 20240218559
- Publication date Jul 4, 2024
- Suzhou Everbright Photonics Co., Ltd.
- Jun WANG
- C30 - CRYSTAL GROWTH
Information Patent Application
MULTI-ACTIVE AREA SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTUR...
- Publication number 20240222547
- Publication date Jul 4, 2024
- Shuzhou Everbright Photonics Co., ltd.
- Jun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INJECTION MOLDING MOLD, INJECTION MOLDING DEV...
- Publication number 20240140007
- Publication date May 2, 2024
- JCET MANAGEMENT CO., LTD.
- Cheng Yang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HAND TOOL WITH SLIDE ADJUSTMENT FOR LOCKING FLEXIBLE HEAD
- Publication number 20240100682
- Publication date Mar 28, 2024
- APEX BRANDS, INC.
- Minglin Shi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
HAND TOOL WITH LOCKING FLEXIBLE HEAD
- Publication number 20240082995
- Publication date Mar 14, 2024
- APEX BRANDS, INC.
- Minglin Shi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND ELECTRONIC DEVICE FOR GROUPING OBJECTS IN DATA MANAGEMEN...
- Publication number 20230336427
- Publication date Oct 19, 2023
- Dell Products L.P.
- Weiyang LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Torque Wrench with Strain Gauges
- Publication number 20230182272
- Publication date Jun 15, 2023
- APEX BRANDS, INC.
- Minglin Shi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Ratchet Wrench with Drive Pins
- Publication number 20220331936
- Publication date Oct 20, 2022
- APEX BRANDS, INC.
- Minglin Shi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20220330435
- Publication date Oct 13, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
- Publication number 20220238482
- Publication date Jul 28, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR STACKED DIE PACKAGES
- Publication number 20220045034
- Publication date Feb 10, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of Thermal Interface Material in Multi-Chip Package
- Publication number 20210305124
- Publication date Sep 30, 2021
- Flex Ltd.
- Cheng YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
- Publication number 20210125958
- Publication date Apr 29, 2021
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20210100106
- Publication date Apr 1, 2021
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER TOWER ARCHITECTURE
- Publication number 20200379526
- Publication date Dec 3, 2020
- Apple Inc.
- Bart K. Andre
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AIR SUPPLY IN IMAGING DEVICES
- Publication number 20200023660
- Publication date Jan 23, 2020
- Hewlett-Packard Development Company, L.P.
- Cheng-Qun Yang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS
- Publication number 20190189585
- Publication date Jun 20, 2019
- Intel Corporation
- Junfeng ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20190164845
- Publication date May 30, 2019
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL (Shangha i) CORPORATION
- Hai Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBRANE TREATMENT OF AMMONIA-CONTAINING WASTE WATER
- Publication number 20180257965
- Publication date Sep 13, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Cheng YANG
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180108572
- Publication date Apr 19, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hai Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS
- Publication number 20170278821
- Publication date Sep 28, 2017
- Intel Corporation
- Junfeng ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND
- Publication number 20150359100
- Publication date Dec 10, 2015
- Intel Corporation
- Junfeng Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH SILICON VIA GUARD RING
- Publication number 20140038390
- Publication date Feb 6, 2014
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO
- Publication number 20130207233
- Publication date Aug 15, 2013
- Semiconductor Manufacturing International (Shanghai) Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA GUARD RING
- Publication number 20120228777
- Publication date Sep 13, 2012
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO
- Publication number 20110254127
- Publication date Oct 20, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for calculating surface relaxation rate of shale

Method and electronic device for grouping objects in data managemen...

Methods of creating exposed cavities in molded electronic devices

Control of thermal interface material in multi-chip package

Methods of creating exposed cavities in molded electronic devices

Embedded copper structure for microelectronics package

System in package with double side mounted board

Membrane treatment of ammonia-containing waste water

Overlapping stacked die package with vertical columns

Overlapping stacked die package with vertical columns

Method for manufacturing a semiconductor device having a fin locate...

Integrated circuit assemblies with molding compound

Through silicon via guard ring

Method and device for a dram capacitor having low depletion ratio

Method and device for a DRAM capacitor having low depletion ratio

Through silicon via guard ring

Method and system for continuous line-type landing polysilicon cont...

System and method for direct etching

Patents Applicationslast 30 patents

HIGH-EFFICIENCY ACTIVE LAYER AND SEMICONDUCTOR LIGHT-EMITTING DEVIC...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

SYSTEMS AND METHODS FOR WRITING FEEDBACK USING AN ARTIFICIAL INTELL...

SEMICONDUCTOR GROWTH DEVICE AND OPERATION METHOD THEREOF

MULTI-ACTIVE AREA SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTUR...

SEMICONDUCTOR PACKAGE INJECTION MOLDING MOLD, INJECTION MOLDING DEV...

HAND TOOL WITH SLIDE ADJUSTMENT FOR LOCKING FLEXIBLE HEAD

HAND TOOL WITH LOCKING FLEXIBLE HEAD

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

METHOD AND ELECTRONIC DEVICE FOR GROUPING OBJECTS IN DATA MANAGEMEN...

Torque Wrench with Strain Gauges

Ratchet Wrench with Drive Pins

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE

DEVICES, SYSTEMS, AND METHODS FOR STACKED DIE PACKAGES

Control of Thermal Interface Material in Multi-Chip Package

EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

COMPUTER TOWER ARCHITECTURE

AIR SUPPLY IN IMAGING DEVICES

OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MEMBRANE TREATMENT OF AMMONIA-CONTAINING WASTE WATER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS

INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND

THROUGH SILICON VIA GUARD RING

METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO

THROUGH SILICON VIA GUARD RING

METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO