CHENG-YI HSIEH

Person

Tu-Cheng, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride-based devices and methods of testing thereof
- Patent number 12,216,152
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal heat dissipation fan of portable electronic device
- Patent number 12,219,731
- Issue date Feb 4, 2025
- Acer Incorporated
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Graphics card assembly
- Patent number 12,219,732
- Issue date Feb 4, 2025
- Acer Incorporated
- Yu-Ming Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,210,188
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head-mounted display, tapping input signal generating method and no...
- Patent number 12,182,335
- Issue date Dec 31, 2024
- HTC Corporation
- Chao-Hsiang Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having prism structure and manufacturing method thereof
- Patent number 12,164,158
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Grant
System and method for remotely controlling extended reality by virt...
- Patent number 12,147,614
- Issue date Nov 19, 2024
- HTC Corporation
- Chao-Hsiang Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation system of electronic device
- Patent number 12,140,159
- Issue date Nov 12, 2024
- Acer Incorporated
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 12,131,973
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal heat dissipation fan
- Patent number 12,104,603
- Issue date Oct 1, 2024
- Acer Incorporated
- Cheng-Wen Hsieh
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Control system and control method
- Patent number 12,085,997
- Issue date Sep 10, 2024
- HTC Corporation
- Yuhui Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
SerDes receiver with optimized CDR pulse shaping
- Patent number 12,074,737
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chaitanya Palusa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Head-mounted display, unlocking method and non-transitory computer...
- Patent number 12,073,020
- Issue date Aug 27, 2024
- HTC Corporation
- Meng-Chi Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device
- Patent number 12,068,306
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for duty cycle measurement
- Patent number 12,066,476
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Zero mask high density capacitor
- Patent number 12,062,652
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delay lock loop circuits and methods for operating same
- Patent number 12,057,846
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,040,283
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system of portable electronic device
- Patent number 12,035,503
- Issue date Jul 9, 2024
- Acer Incorporated
- Tsung-Ting Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber structure
- Patent number 12,025,382
- Issue date Jul 2, 2024
- Acer Incorporated
- Chun-Chieh Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Die stacking structure and method forming same
- Patent number 12,002,799
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic nucleic acid detection system and method thereof
- Patent number 11,965,898
- Issue date Apr 23, 2024
- TCI GENE INC
- Yung-Hsiang Lin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Centrifugal heat dissipation fan and heat dissipation system of ele...
- Patent number 11,968,800
- Issue date Apr 23, 2024
- Acer Incorporated
- Tsung-Ting Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE HAVING PRISM STRUCTURE
- Publication number 20250060542
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
POWER MANAGEMENT METHOD OF SYSTEM AND RELATED INTERNET DATA CENTER
- Publication number 20250062621
- Publication date Feb 20, 2025
- Wiwynn Corporation
- Chia-Hung Yen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
- Publication number 20250063824
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...
- Publication number 20250046702
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIAL-FLOW HEAT-DISSIPATION FAN
- Publication number 20250027502
- Publication date Jan 23, 2025
- ACER INCORPORATED
- Cheng-Wen Hsieh
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
CIRCUITS DESIGNED AND MANUFACTURED WITH FIRST AND SECOND DESIGN RULES
- Publication number 20250031443
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND DEVICE FOR BEAMFORMING
- Publication number 20250023604
- Publication date Jan 16, 2025
- MEDIATEK INC.
- Li-Chieh CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER SUPPLY SYSTEM AND CONTROL METHOD
- Publication number 20250023383
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Hsieh-Hsiung CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022766
- Publication date Jan 16, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL IMAGING LENS
- Publication number 20250013022
- Publication date Jan 9, 2025
- E-PIN OPTICAL INDUSTRY CO., LTD.
- Chih-Hsiang Yin
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE DEVICE WITH ARTIFICIAL FIELD PLATES
- Publication number 20240421194
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-An LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421273
- Publication date Dec 19, 2024
- Lite-On Technology Corporation
- CHENG-YAN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395756
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTERACTING WITH EXTENDED REALITY ENVIRONMENT
- Publication number 20240377886
- Publication date Nov 14, 2024
- HTC CORPORATION
- Tzu-Yin Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERDES RECEIVER WITH OPTIMIZED CDR PULSE SHAPING
- Publication number 20240372759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chaitanya Palusa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
IMMERSION COOLING SYSTEM AND RELATED IMMERSION COOLING METHOD
- Publication number 20240365509
- Publication date Oct 31, 2024
- Wiwynn Corporation
- Hsien-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Delay Lock Loop Circuits and Methods for Operating Same
- Publication number 20240364349
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20240363697
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Duty Cycle Measurement
- Publication number 20240361371
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Zero Mask High Density Capacitor
- Publication number 20240363614
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT LAYOUT
- Publication number 20240363615
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAD-MOUNTED DISPLAY AND METHOD FOR IMAGE PROCESSING BASED ON DIOPT...
- Publication number 20240355238
- Publication date Oct 24, 2024
- HTC CORPORATION
- Cheng Hsin Hsieh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

CHENG-YI HSIEH

Person

Patents Grantslast 30 patents

Package and method of forming same

Gallium nitride-based devices and methods of testing thereof

Centrifugal heat dissipation fan of portable electronic device

Graphics card assembly

Semiconductor package and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Semiconductor package and manufacturing method thereof

Head-mounted display, tapping input signal generating method and no...

Manufacturing method of semiconductor package

Package having prism structure and manufacturing method thereof

System and method for remotely controlling extended reality by virt...

Heat dissipation system of electronic device

Semiconductor package and method of manufacturing the same

Semiconductor device and method forming the same

Semiconductor device and method of making the same

Centrifugal heat dissipation fan

Semiconductor package

Control system and control method

SerDes receiver with optimized CDR pulse shaping

Head-mounted display, unlocking method and non-transitory computer...

Integrated circuit device

Systems and methods for duty cycle measurement

Zero mask high density capacitor

Delay lock loop circuits and methods for operating same

Method of fabricating semiconductor structure

Heat dissipation system of portable electronic device

Vapor chamber structure

Die stacking structure and method forming same

Automatic nucleic acid detection system and method thereof

Centrifugal heat dissipation fan and heat dissipation system of ele...

Patents Applicationslast 30 patents

PACKAGE HAVING PRISM STRUCTURE

POWER MANAGEMENT METHOD OF SYSTEM AND RELATED INTERNET DATA CENTER

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...

AXIAL-FLOW HEAT-DISSIPATION FAN

CIRCUITS DESIGNED AND MANUFACTURED WITH FIRST AND SECOND DESIGN RULES

METHOD AND DEVICE FOR BEAMFORMING

POWER SUPPLY SYSTEM AND CONTROL METHOD

SEMICONDUCTOR DEVICE

OPTICAL IMAGING LENS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

GALLIUM NITRIDE DEVICE WITH ARTIFICIAL FIELD PLATES

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE AND METHOD OF FORMING SAME

SYSTEM AND METHOD FOR INTERACTING WITH EXTENDED REALITY ENVIRONMENT

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SERDES RECEIVER WITH OPTIMIZED CDR PULSE SHAPING

SEMICONDUCTOR PACKAGE

IMMERSION COOLING SYSTEM AND RELATED IMMERSION COOLING METHOD

Delay Lock Loop Circuits and Methods for Operating Same

QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES

Systems and Methods for Duty Cycle Measurement

Zero Mask High Density Capacitor

INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT LAYOUT

HEAD-MOUNTED DISPLAY AND METHOD FOR IMAGE PROCESSING BASED ON DIOPT...