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Cheng-Yi Weng

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220093548
    • Publication date Mar 24, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Pei-Jen LO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    • Publication number 20210074669
    • Publication date Mar 11, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Shun-Tsat TU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SLIDE RAIL ASSEMBLY
    • Publication number 20160227666
    • Publication date Aug 4, 2016
    • KING SLIDE WORKS CO., LTD.
    • KEN-CHING CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLIDE RAIL ASSEMBLY
    • Publication number 20160060934
    • Publication date Mar 3, 2016
    • KING SLIDE WORKS CO., LTD.
    • KEN-CHING CHEN
    • E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
  • Information Patent Application

    CABLE MANAGEMENT DEVICE
    • Publication number 20150271945
    • Publication date Sep 24, 2015
    • KING SLIDE TECHNOLOGY CO., LTD.
    • KEN-CHING CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLIDE ASSEMBLY WITH DECELERATION DEVICE
    • Publication number 20140327352
    • Publication date Nov 6, 2014
    • KING SLIDE TECHNOLOGY CO., LTD.
    • KEN-CHING CHEN
    • A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20130161816
    • Publication date Jun 27, 2013
    • Chi-Chih Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGES AND RELATED METHODS
    • Publication number 20120104607
    • Publication date May 3, 2012
    • Cheng-Yi Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKABLE SEMICONDUCTOR DEVICE PACKAGES
    • Publication number 20120049338
    • Publication date Mar 1, 2012
    • Kuang-Hsiung CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package
    • Publication number 20110156251
    • Publication date Jun 30, 2011
    • Chi-Chih Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKABLE SEMICONDUCTOR DEVICE PACKAGES
    • Publication number 20110117700
    • Publication date May 19, 2011
    • ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    • CHENG-YI WENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package-on-Package Device, Semiconductor Package, and Method for Ma...
    • Publication number 20100171206
    • Publication date Jul 8, 2010
    • Chi-Chih Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stackable Semiconductor Device Packages
    • Publication number 20100171205
    • Publication date Jul 8, 2010
    • Kuang-Hsiung CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKABLE SEMICONDUCTOR DEVICE PACKAGES
    • Publication number 20100171207
    • Publication date Jul 8, 2010
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE-ON-PACKAGE DEVICE, SEMICONDUCTOR PACKAGE AND METHOD FOR MAN...
    • Publication number 20100133675
    • Publication date Jun 3, 2010
    • Advanced Semiconductor Engineering, Inc.
    • Lin Wang Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20100032822
    • Publication date Feb 11, 2010
    • Advanced Semiconductor Engineering, Inc.
    • CHEN-KAI LIAO
    • H01 - BASIC ELECTRIC ELEMENTS