Cheng-Yuan Tsai

Person

Yun-Lin, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of enhancing adhesion strength of BSG film to silicon nitrid...
- Patent number 6,861,104
- Issue date Mar 1, 2005
- United Microelectronics Corp.
- Hsin-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving the coating capability of low-k dielectric layer
- Patent number 6,764,965
- Issue date Jul 20, 2004
- United Microelectronics Corp.
- Tsung-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing adhesion ability of dielectric material in se...
- Patent number 6,677,231
- Issue date Jan 13, 2004
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer silicon carbide based barrier
- Patent number 6,670,715
- Issue date Dec 30, 2003
- United Microelectronics Corp.
- Neng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a shallow trench isolation structure
- Patent number 6,653,204
- Issue date Nov 25, 2003
- United Microelectronics Corp.
- Hsin-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a low dielectric constant material layer
- Patent number 6,599,826
- Issue date Jul 29, 2003
- United Microelectronics Corp.
- Tsung-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing etching residues
- Patent number 6,554,002
- Issue date Apr 29, 2003
- United Microelectronics Corp.
- Chih-Ning Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of a surface treatment on a fluorinated silicate glass film
- Patent number 6,521,545
- Issue date Feb 18, 2003
- United Microelectronics Corp.
- Neng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of a surface treatment in improving adhesion of an organic p...
- Patent number 6,521,300
- Issue date Feb 18, 2003
- United Microelectronics Corp.
- Tsung-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stabilizing low dielectric constant materials
- Patent number 6,486,079
- Issue date Nov 26, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilevel interconnects including performi...
- Patent number 6,429,115
- Issue date Aug 6, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an intermetal dielectric layer
- Patent number 6,410,106
- Issue date Jun 25, 2002
- United Microelectronics Crop.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for gap filling
- Patent number 6,410,446
- Issue date Jun 25, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving surface wettability of low k material
- Patent number 6,383,913
- Issue date May 7, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming inter-metal dielectric layer
- Patent number 6,376,394
- Issue date Apr 23, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for spin-on coating with an organic material having a low d...
- Patent number 6,365,228
- Issue date Apr 2, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-K dual damascene integration process
- Patent number 6,323,123
- Issue date Nov 27, 2001
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dual damascene
- Patent number 6,319,814
- Issue date Nov 20, 2001
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing an electrostatic chuck from being corroded du...
- Patent number 6,261,977
- Issue date Jul 17, 2001
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an inter-metal dielectric layer
- Patent number 6,218,284
- Issue date Apr 17, 2001
- United Microelectronics, Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an intermetal dielectric layer
- Patent number 6,200,653
- Issue date Mar 13, 2001
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming copper interconnects in dielectric materials with low const...
- Patent number 6,197,681
- Issue date Mar 6, 2001
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating shallow trench isolation (STI)
- Patent number 6,146,974
- Issue date Nov 14, 2000
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an undoped silicate glass layer on a semiconducto...
- Patent number 6,001,746
- Issue date Dec 14, 1999
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of enhancing adhesion strength of BSG film to silicon nitrid...
- Publication number 20030219993
- Publication date Nov 27, 2003
- Hsin-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heating injection apparatus for vapor liquid delivery system
- Publication number 20030159652
- Publication date Aug 28, 2003
- UNITED MICROELECTRONICS CORP.
- Neng-Hui Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bilayer silicon carbide based barrier
- Publication number 20030102491
- Publication date Jun 5, 2003
- Neng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxygen-doped silicon carbide etch stop layer
- Publication number 20030085408
- Publication date May 8, 2003
- Neng-Hui Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF A SURFACE TREATMENT IN IMPROMOVING ADHESION OF AN ORGANIC...
- Publication number 20030035904
- Publication date Feb 20, 2003
- Tsung-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving the coating capability of low-k dielectric layer
- Publication number 20030036290
- Publication date Feb 20, 2003
- United Microelectronics Corp.
- Tsung-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A LOW DIELECTRIC CONSTANT MATERIAL LAYER
- Publication number 20020182849
- Publication date Dec 5, 2002
- Tsung-Tans Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving adhesion of low k materials with adjacent layer
- Publication number 20020164889
- Publication date Nov 7, 2002
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stabilizing low dielectric constant layer
- Publication number 20020137360
- Publication date Sep 26, 2002
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing etching residues
- Publication number 20020113037
- Publication date Aug 22, 2002
- Chih-Ning Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STABILIZING LOW DIELECTRIC CONSTANT MATERIALS
- Publication number 20020115305
- Publication date Aug 22, 2002
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methof for forming dielectric of low dielectric constant on hydroph...
- Publication number 20020034647
- Publication date Mar 21, 2002
- Anseime Chen
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for forming an inter-metal dielectric layer
- Publication number 20010019883
- Publication date Sep 6, 2001
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an intermetal dielectric layer
- Publication number 20010001678
- Publication date May 24, 2001
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Yuan Tsai

Person

Patents Grantslast 30 patents

Method of enhancing adhesion strength of BSG film to silicon nitrid...

Method for improving the coating capability of low-k dielectric layer

Method for increasing adhesion ability of dielectric material in se...

Bilayer silicon carbide based barrier

Method of forming a shallow trench isolation structure

Method for fabricating a low dielectric constant material layer

Method for removing etching residues

Method of a surface treatment on a fluorinated silicate glass film

Method of a surface treatment in improving adhesion of an organic p...

Method for stabilizing low dielectric constant materials

Method of manufacturing multilevel interconnects including performi...

Method of forming an intermetal dielectric layer

Method for gap filling

Method for improving surface wettability of low k material

Method of forming inter-metal dielectric layer

Process for spin-on coating with an organic material having a low d...

Low-K dual damascene integration process

Method of fabricating dual damascene

Method for preventing an electrostatic chuck from being corroded du...

Method for forming an inter-metal dielectric layer

Method of forming an intermetal dielectric layer

Forming copper interconnects in dielectric materials with low const...

Method of fabricating shallow trench isolation (STI)

Method of forming an undoped silicate glass layer on a semiconducto...

Patents Applicationslast 30 patents

Method of enhancing adhesion strength of BSG film to silicon nitrid...

Heating injection apparatus for vapor liquid delivery system

Bilayer silicon carbide based barrier

Oxygen-doped silicon carbide etch stop layer

METHOD OF A SURFACE TREATMENT IN IMPROMOVING ADHESION OF AN ORGANIC...

Method for improving the coating capability of low-k dielectric layer

METHOD FOR FABRICATING A LOW DIELECTRIC CONSTANT MATERIAL LAYER

Method for improving adhesion of low k materials with adjacent layer

Method for stabilizing low dielectric constant layer

Method for removing etching residues

METHOD FOR STABILIZING LOW DIELECTRIC CONSTANT MATERIALS

Methof for forming dielectric of low dielectric constant on hydroph...

Method for forming an inter-metal dielectric layer

Method of forming an intermetal dielectric layer