Chengchung LIN

Person

JiangYin City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer system-level three-dimensional fan-out three-dimensional fan-...
- Patent number 12,119,295
- Issue date Oct 15, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked fan-out packaging structure and method ma...
- Patent number 12,113,045
- Issue date Oct 8, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure radiating electromagnetic wave in horizontal di...
- Patent number 12,040,546
- Issue date Jul 16, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing the same
- Patent number 11,973,046
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-layer stacked 3D fan-out packaging structure and method maki...
- Patent number 11,973,070
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer system-level fan-out packaging structure and manufacturing me...
- Patent number 11,894,243
- Issue date Feb 6, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structure and method for LED chip
- Patent number 11,894,357
- Issue date Feb 6, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and method for preparing same
- Patent number 11,798,888
- Issue date Oct 24, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yayuan Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,871
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,942
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,749,657
- Issue date Sep 5, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip packaging structure and method thereof
- Patent number 11,735,564
- Issue date Aug 22, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including antenna
- Patent number 11,728,558
- Issue date Aug 15, 2023
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing the same
- Patent number 11,728,158
- Issue date Aug 15, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,699,840
- Issue date Jul 11, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging module and making method thereof
- Patent number 11,626,657
- Issue date Apr 11, 2023
- HAUWEI DEVICE CO., LTD
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and packaging method
- Patent number 11,605,604
- Issue date Mar 14, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,515,269
- Issue date Nov 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having antenna module
- Patent number 11,508,675
- Issue date Nov 22, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,488,915
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 11,462,403
- Issue date Oct 4, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens antenna packaging structure, preparation method and electronic...
- Patent number 11,322,852
- Issue date May 3, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,316,247
- Issue date Apr 26, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging structure and method for forming the same
- Patent number 11,316,252
- Issue date Apr 26, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna package structure and packaging method
- Patent number 11,302,658
- Issue date Apr 12, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,289,793
- Issue date Mar 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240234235
- Publication date Jul 11, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240136245
- Publication date Apr 25, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SYSTEM-LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240088000
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20240088002
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...
- Publication number 20240088008
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...
- Publication number 20240063029
- Publication date Feb 22, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20240055416
- Publication date Feb 15, 2024
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240047326
- Publication date Feb 8, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
- Publication number 20230386950
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20230386952
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGING SYSTEM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230386967
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
- Publication number 20230352450
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...
- Publication number 20230352451
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...
- Publication number 20230352449
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING ME...
- Publication number 20230352461
- Publication date Nov 2, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20230352469
- Publication date Nov 2, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20230343669
- Publication date Oct 26, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PRE...
- Publication number 20230335526
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230335514
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20230335453
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230335507
- Publication date Oct 19, 2023
- SJ Semiconductor (Jiangyin ) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2.5D/3D ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20230335478
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...
- Publication number 20230163114
- Publication date May 25, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20230049487
- Publication date Feb 16, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415803
- Publication date Dec 29, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...
- Publication number 20220415816
- Publication date Dec 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD FOR PACKAGING AND METHOD MANUFACTURING THE SAME, AND...
- Publication number 20220415670
- Publication date Dec 29, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yujie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...
- Publication number 20220319870
- Publication date Oct 6, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVE IN HORIZONTAL DI...
- Publication number 20220320748
- Publication date Oct 6, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-LAYER STACKED 3D FAN-OUT PACKAGING STRUCTURE AND METHOD MAKI...
- Publication number 20220271018
- Publication date Aug 25, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chengchung LIN

Person

Patents Grantslast 30 patents

Wafer system-level three-dimensional fan-out three-dimensional fan-...

Three-dimensional stacked fan-out packaging structure and method ma...

Packaging structure radiating electromagnetic wave in horizontal di...

Semiconductor structure and method for preparing the same

Double-layer stacked 3D fan-out packaging structure and method maki...

Wafer system-level fan-out packaging structure and manufacturing me...

System-level packaging structure and method for LED chip

Semiconductor package structure with heat sink and method preparing...

Chip packaging structure and method for preparing same

Fan-out packaging structure and method

Fan-out packaging structure and method

Fan-out packaging structure and method

Three-dimensional chip packaging structure and method thereof

Semiconductor structure including antenna

Semiconductor structure and method for preparing the same

Antenna package structure and antenna packaging method

Antenna packaging module and making method thereof

Fan-out antenna packaging structure and packaging method

Semiconductor packaging structure having antenna module

Semiconductor package structure having antenna module

Packaging structure and packaging method for antenna

Semiconductor package structure with heat sink and method preparing...

Antenna package structure and antenna packaging method

Semiconductor structure and method for manufacturing same

Antenna feeder package structure and packaging method

Lens antenna packaging structure, preparation method and electronic...

Semiconductor packaging structure having antenna module

Antenna packaging structure and method for forming the same

Fan-out antenna package structure and packaging method

Semiconductor packaging structure having antenna module

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

FAN-OUT SYSTEM-LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...

PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...

WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME

FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...

FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURIN...

WAFER PACKAGING SYSTEM AND METHOD FOR MANUFACTURING THE SAME

POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...

THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD...

FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...

THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING ME...

STACKED MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF

ELECTRONIC PACKAGING STRUCTURE

HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PRE...

FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

PACKAGING STRUCTURE AND PACKAGING METHOD

CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

2.5D/3D ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING...

THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...

WAFER-LEVEL ASIC 3D INTEGRATED SUBSTRATE, PACKAGING DEVICE AND PREP...

ADAPTER BOARD FOR PACKAGING AND METHOD MANUFACTURING THE SAME, AND...

PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...

PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVE IN HORIZONTAL DI...

DOUBLE-LAYER STACKED 3D FAN-OUT PACKAGING STRUCTURE AND METHOD MAKI...