Chenglin Liu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat sink design for flip chip ball grid array
- Patent number 11,282,762
- Issue date Mar 22, 2022
- Marvell Asia Pte, Ltd.
- Huahung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual row quad flat no-lead semiconductor package
- Patent number 9,666,510
- Issue date May 30, 2017
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual row quad flat no-lead semiconductor package
- Patent number 9,425,139
- Issue date Aug 23, 2016
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with laser vias and methods for making the...
- Patent number 9,299,589
- Issue date Mar 29, 2016
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package substrate with through holes and method of...
- Patent number 9,288,909
- Issue date Mar 15, 2016
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 9,224,677
- Issue date Dec 29, 2015
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of package pins in semiconductor packaging
- Patent number 9,123,699
- Issue date Sep 1, 2015
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with laser vias and methods for making the...
- Patent number 9,064,784
- Issue date Jun 23, 2015
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched hybrid die package
- Patent number 8,999,755
- Issue date Apr 7, 2015
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced package
- Patent number 8,900,932
- Issue date Dec 2, 2014
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solution for drive systems such as hard disk drives and dig...
- Patent number 8,848,313
- Issue date Sep 30, 2014
- Marvell International Ltd.
- Chenglin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on leads
- Patent number 8,809,118
- Issue date Aug 19, 2014
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing heat sink into packaging by strip formation assembly
- Patent number 8,741,694
- Issue date Jun 3, 2014
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched hybrid die package
- Patent number 8,673,687
- Issue date Mar 18, 2014
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing heat sink into packaging by strip formation assembly
- Patent number 8,581,374
- Issue date Nov 12, 2013
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with internal wiring bus
- Patent number 8,518,742
- Issue date Aug 27, 2013
- Marvell World Trade Ltd.
- Chenglin Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 8,482,112
- Issue date Jul 9, 2013
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced package
- Patent number 8,357,568
- Issue date Jan 22, 2013
- Marvell International Technology Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solution for drive systems such as hard disk drives and dig...
- Patent number 8,355,221
- Issue date Jan 15, 2013
- Marvell International Ltd.
- Chenglin Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip on leads
- Patent number 8,294,248
- Issue date Oct 23, 2012
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solution for drive systems such as hard disk drives and dig...
- Patent number 8,218,261
- Issue date Jul 10, 2012
- Marvell International Ltd.
- Chenglin Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 8,022,522
- Issue date Sep 20, 2011
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die wire-bonding
- Patent number 7,969,022
- Issue date Jun 28, 2011
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solution for drive systems such as hard disk drives and dig...
- Patent number 7,957,094
- Issue date Jun 7, 2011
- Marvell International Ltd.
- Chenglin Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor packaging with internal wiring bus
- Patent number 7,911,053
- Issue date Mar 22, 2011
- Marvell World Trade Ltd.
- Chenglin Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal solution for drive systems such as hard disk drives and dig...
- Patent number 7,764,462
- Issue date Jul 27, 2010
- Marvell International Ltd.
- Chenglin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal enhanced package
- Patent number 7,675,157
- Issue date Mar 9, 2010
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Sink Design For Flip Chip Ball Grid Array
- Publication number 20200258807
- Publication date Aug 13, 2020
- Marvell Asia Pte, Ltd.
- Huahung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE
- Publication number 20170047305
- Publication date Feb 16, 2017
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20160358845
- Publication date Dec 8, 2016
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF...
- Publication number 20160196986
- Publication date Jul 7, 2016
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20140069703
- Publication date Mar 13, 2014
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF...
- Publication number 20130193572
- Publication date Aug 1, 2013
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON LEADS
- Publication number 20130045573
- Publication date Feb 21, 2013
- Marvell World Trade Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED PACKAGE
- Publication number 20130011964
- Publication date Jan 10, 2013
- MARVEL WORLD TRADE LTD.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Connect Lead
- Publication number 20110012240
- Publication date Jan 20, 2011
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Exposed Chip Package
- Publication number 20100283143
- Publication date Nov 11, 2010
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED PACKAGE
- Publication number 20090269891
- Publication date Oct 29, 2009
- MARVEL WORLD TRADE LTD.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging With Internal Wiring Bus
- Publication number 20080258291
- Publication date Oct 23, 2008
- Chenglin Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP ON LEADS
- Publication number 20080128876
- Publication date Jun 5, 2008
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhanced package
- Publication number 20070178622
- Publication date Aug 2, 2007
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Chenglin Liu

Person

Patents Grantslast 30 patents

Heat sink design for flip chip ball grid array

Dual row quad flat no-lead semiconductor package

Dual row quad flat no-lead semiconductor package

Ball grid array package with laser vias and methods for making the...

Ball grid array package substrate with through holes and method of...

Semiconductor package

Formation of package pins in semiconductor packaging

Ball grid array package with laser vias and methods for making the...

Etched hybrid die package

Thermal enhanced package

Thermal solution for drive systems such as hard disk drives and dig...

Chip on leads

Placing heat sink into packaging by strip formation assembly

Etched hybrid die package

Placing heat sink into packaging by strip formation assembly

Semiconductor packaging with internal wiring bus

Semiconductor package

Thermal enhanced package

Thermal solution for drive systems such as hard disk drives and dig...

Chip on leads

Thermal solution for drive systems such as hard disk drives and dig...

Semiconductor package

Die-to-die wire-bonding

Thermal solution for drive systems such as hard disk drives and dig...

Semiconductor packaging with internal wiring bus

Thermal solution for drive systems such as hard disk drives and dig...

Thermal enhanced package

Patents Applicationslast 30 patents

Heat Sink Design For Flip Chip Ball Grid Array

PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE

DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF...

DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF...

CHIP ON LEADS

THERMAL ENHANCED PACKAGE

Multi-Connect Lead

Die Exposed Chip Package

THERMAL ENHANCED PACKAGE

Semiconductor Packaging With Internal Wiring Bus

CHIP ON LEADS

Thermal enhanced package