Chenhua Lu

Person

  • Shanghai, CN

Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus

    • Patent number 11,859,303
    • Issue date Jan 2, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Zhaowei Jia
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING METHOD

    • Publication number 20240376625
    • Publication date Nov 14, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Meng Wu
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS

    • Publication number 20240376627
    • Publication date Nov 14, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Jian Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

    • Publication number 20240044038
    • Publication date Feb 8, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS

    • Publication number 20200354851
    • Publication date Nov 12, 2020
    • ACM Research (Shanghai) Inc.
    • Zhaowei Jia
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR