The present invention relates to the field of semiconductor devices, and in particular, to an electroplating apparatus and an electroplating method.
Electroplating is the primary process for completing copper interconnections. Currently, there are two types of electroplating apparatus on the market: horizontal jet cup plating and vertical rack plating. Vertical rack plating is to immerse substrates vertically in the plating solution, and one plating tank can perform multiple substrates plating at the same time. Cup plating is to cover a substrate in a cup-shaped plating tank, and plating is performed one cup per substrate. Compared with rack plating, the process of cup plating is more controllable and can meet more complex and diverse product requirements.
With the development of technology, the chip area increases, and the number of bumps in the chip increases sharply. There may even be tens of thousands or even more than 100,000 of bumps inside a single chip. The electroplating process requires higher electroplating rate and output, and in the field of advanced packaging, higher uniformity inside the chip is also required. However, it is difficult to achieve uniformity inside the chip, that is, the coplanarity of the bumps, in the case of weak stirring. At the same time, for the advanced packaging technology of interconnections between chips, the height of copper pillars can reach 250 um, which puts higher requirements on the mass transfer during the electroplating process. Ordinary stirring has weak mass transfer and cannot meet the requirements of production capacity and quality.
To enhance the stirring of electroplating solution, a paddle assembly can be installed in the electroplating apparatus, which includes multiple paddles parallel to the substrate surface. The paddles reciprocate to stir the electroplating solution, fully supplying metal ions and electroplating additives to the substrate surface. However, in practice, during the stirring process of ordinary paddles, there is no control over the time while the surface of the substrate is blocked by the paddles. As a result, quantity of electricity received by each point on the surface of the substrate is uneven, and there still exists the problem of uneven electroplating height.
The present invention aims to provide an electroplating apparatus and an electroplating method in view of the above technical problems, so as to improve the consistency of electroplating height on the substrate.
To achieve the objective, an embodiment of the present invention proposes an electroplating apparatus comprising multiple parallel paddles, the paddles being arranged in parallel to the substrate to stir the electroplating solution. The electroplating apparatus further comprises a controller and a driving mechanism. The driving mechanism is connected to the controller and the paddles respectively, and the controller controls the driving mechanism to make the paddles move periodically so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is an integer.
Another embodiment of the present invention proposes an electroplating apparatus comprising multiple parallel paddles, the paddles being arranged in parallel to the substrate to stir the electroplating solution. The electroplating apparatus further comprises a controller and a driving mechanism. The driving mechanism is connected to the controller and the paddles respectively, and the controller controls the driving mechanism to make the paddles move periodically so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is an integer.
Another embodiment of the present invention proposes an electroplating apparatus comprising multiple parallel paddles, the paddles being arranged in parallel to the substrate to stir the electroplating solution. The electroplating apparatus further comprises a controller and a driving mechanism. The driving mechanism is connected to the controller and the paddles respectively, and the controller controls the driving mechanism to make the paddles move periodically so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is a non-integer greater than 1, and x is a value that makes x*N be an integer.
Another embodiment of the present invention proposes an electroplating apparatus comprising multiple parallel paddles, the paddles being arranged in parallel to the substrate to stir the electroplating solution. The electroplating apparatus further comprises a controller and a driving mechanism. The driving mechanism is connected to the controller and the paddles respectively, and the controller controls the driving mechanism to make the paddles move periodically so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is a non-integer greater than 1, and x is a value that makes x*N be an integer.
One embodiment of the present invention proposes an electroplating method comprising setting multiple parallel paddles, the paddles being arranged parallel to the substrate and moving to stir the electroplating solution, and controlling the paddles movement so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is an integer.
Another embodiment of the present invention proposes an electroplating method comprising setting multiple parallel paddles, the paddles being arranged parallel to the substrate and moving to stir the electroplating solution, and controlling the paddles movement so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is an integer.
Another embodiment of the present invention proposes an electroplating method comprising setting multiple parallel paddles, the paddles being arranged parallel to the substrate and moving to stir the electroplating solution, and controlling the paddles movement so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is a non-integer greater than 1, and x is a value that makes x*N be an integer.
Another embodiment of the present invention proposes an electroplating method comprising setting multiple parallel paddles, the paddles being arranged parallel to the substrate and moving to stir the electroplating solution, and controlling the paddles movement so that each corresponding point on the substrate accumulated time blocked by the paddles is equal;
Taking the arrangement direction of the paddles as the coordinate axis direction, the movement steps of the paddles within one cycle comprising:
Wherein, Δ≥a+b, a is the width of the paddle, b is the narrowest width between adjacent paddles,
N is a non-integer greater than 1, and x is a value that makes x*N be an integer.
The present invention improves the consistency of electroplating height by designing the movement mode of the paddle, which blocks each corresponding point on the substrate for an equal amount of time and receives an equal amount of quantity of electricity.
To provide a detailed description of the technical content, structural features, achieved objectives and effects of the present invention, the following will be described in detail with reference to embodiments and accompanying diagrams.
In an electroplating apparatus, in order to enhance the agitation of the electroplating solution, a paddle can be installed in a position opposite to the substrate. During electroplating, the paddle reciprocates along a direction parallel to the substrate to enhance the agitation of the electroplating solution. As the paddle itself blocks the electric field, only the gap between the paddles allows the electric field to pass through. Therefore, the area on the substrate facing the paddle will have a “shadow”, where the received quantity of electricity is less than that of the “non-shadow” area. If the degree of “shadowing” varies at different points on the substrate, the received quantity of electricity will be uneven, resulting in uneven plating height on the entire substrate.
During electroplating, the substrate rotates, and the result of the “shadowing” appears as concentric rings on the surface of the substrate, that is, significant fluctuations in the electroplating height along the radial direction of the substrate, as shown in
As shown in
As shown in
As shown in
The cross-section of the paddles 103 can also be triangular or rectangular. Compared the paddle board with rectangular paddles, the opening area of the paddle board with triangular or trapezoidal paddles is larger, so that the side of the paddle board 108 with a larger opening area faces the substrate 104, and the electroplating solution is stirred more fully on this side, thereby further improving the consistency of the plating height. On the other hand, since bubbles are easily generated on the side of the paddle 103 during high-speed stirring, the bubbles will adhere to the side of the paddle 103. If the side of the paddle 103 is designed as an inclined surface, the bubbles are more easily discharged from the paddle board 108.
As shown in
In this embodiment, a=b, that is, the opening rate of the opening area of the paddle board 108 at the bottom is 50%.
As shown by the arrow in
As shown in
In order to facilitate the observation of the coordinate position of the paddle 103, multiple dashed lines perpendicular to the coordinate axis are drawn in
Within one cycle, the paddle 103 moves alternately from side to side. Since each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for an equal amount of time, when the electric field is evenly distributed, each point on the substrate 104 corresponding to the paddle 103 receives the same amount of quantity of electricity, and thus the electroplating height at each point is the same.
Within one cycle, to ensure that the coordinate ranges covered by the paddle 103 at each turning point do not overlap, it is required that that is, so that the stirring degree at each point during electroplating is more balanced. The width a of the paddle 103 can range from 5 mm to 15 mm, and can be set according to the size of the substrate 104 and the size of the parts of the electroplating apparatus. Taking a=5 mm and 4=15 mm as an example, the paddle 103 reverses at the following four coordinate points: 15 mm, 5 mm, 20 mm, 0 mm.
In the electroplating process, after completing one cycle of movement, the paddle 103 immediately enters the next cycle of movement.
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Unlike First embodiment, as shown in
Within one cycle, the paddle 103 moves alternately from side to side. Since each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for an equal amount of time, when the electric field is evenly distributed, each point on the substrate 104 corresponding to the paddle 103 receives the same amount of quantity of electricity, and thus the electroplating height at each point is the same.
Within one cycle, to ensure that the coordinate ranges covered by the paddle 103 at each reversal position do not overlap, it is required that that is, Taking a=6 mm and 4=20 mm as an example, the paddle 103 reverses at the following six coordinate points: 20 mm, 6 mm, 26 mm, 12 mm, 32 mm, 0 mm.
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Unlike First embodiment, as shown in
As shown in
Within one cycle, the paddle 103 moves alternately from side to side. Since each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for an equal amount of time, when the electric field is evenly distributed, each point on the substrate 104 corresponding to the paddle 103 receives the same amount of quantity of electricity, and thus the electroplating height at each point is the same.
Similarly, within one cycle, to make the coordinates at which the paddle 103 reverses as dispersed as possible, Δ≥a+b is required, that is, Δ≥3b. Taking b=10 mm and Δ=35 mm as an example, the coordinates at which the paddle 103 pauses are: 35 mm, 10 mm, 45 mm, 20 mm, 55 mm, 0 mm.
In First embodiment to Third embodiment, the multiple between the width a of the paddle 103 and the narrowest width b of the gap between adjacent paddles 103 is an integer. For an electroplating apparatus where the multiple between the width a of the paddle 103 and the narrowest width b of the gap between adjacent paddles 103 is an integer, the present embodiment discloses the following electroplating method:
Execute the program in the controller to move the paddle 103 as follows: within one cycle, the movement steps of the paddle 103 are:
Wherein,
N is an integer.
On the one hand, the alternating movement of the paddle 103 can make the distribution of metal ions and electroplating additives in the electroplating solution uniform. On the other hand, each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for an equal amount of time, which can make the electroplating height of each point on the substrate 104 corresponding to the paddle 103 the same.
Alternatively, within one cycle, the paddle 103 can move as follows:
To display the position of the paddle 103 at each turning point more intuitively, taking b=2a as an example, the movement of the paddle 103 within one cycle is divided into the following 12 steps, as shown in
Similarly, the time that each point on the substrate 104 corresponding to the paddle 103 is blocked is equal, so the received quantity of electricity is equal and the electroplating height is consistent.
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Unlike First embodiment, as shown in
As shown in
Within one cycle, the movement of the paddle 103 includes the following 10 steps:
Within one cycle, the time that each point on the substrate 104 corresponding to the paddle 103 is blocked is equal. When the electric field is uniformly distributed, each point on the substrate 104 corresponding to the paddle 103 receives an equal amount of quantity of electricity, so the electroplating height of each point is the same.
In Fifth embodiment, the multiple between the width a of the paddle 103 and the narrowest gap b between adjacent paddles 103 is a non-integer greater than 1. For the electroplating apparatus with a non-integer multiple between a and b greater than 1, the following electroplating method is disclosed in this example:
Execute the program in the controller to move the paddle 103 as follows: Within one cycle, the movement steps of the paddle are:
Wherein Δ≥a+b, a is the width of the paddle, b is the narrowest gap between adjacent paddles,
N is a non-integer greater than 1, and x is a value that makes x*N be an integer.
To understand this method, imagine that c is the smaller value between a and b, and use several small grids with a width of c to fill a large grid with a width of x*(a+b), where x is an integer. Each small grid is arranged along the width direction, the covered positions do not overlap, and the large grid is filled without leaving any gaps. By selecting a suitable value of x, x*(a+b) can be a multiple of c, which satisfies the requirement. x*(a+b) being a multiple of c is equivalent to x*(N+1) being an integer, that is, x*N is an integer.
The small grids with a width of c are regarded as the paddle 103 with a width of c, x*(N+1) is regarded as the number of return points in a group, and the large grid with a width of x*(a+b) is regarded as the coordinate range covered by the paddle 103 at the return points in the group. The description of filling the large grid with small grids can be regarded as achieving the effect of “the time that each point on the substrate 104 corresponding to the paddle 103 is blocked is equal” mentioned in Fifth embodiment. Since there are two groups of return points within one cycle, the number of return points within one cycle is 2x*(N+1). To simplify the expression, let y x*(N+1), then the coordinates of the first group of return points are 0, c, 2c, . . . , (y−2)*c, (y−1)*c, and the coordinates of the second group of return points are Δ, Δ+c, Δ+2c, . . . , Δ+(y−2)*c, Δ+(y−1)*c.
Within one cycle, the movement steps of the paddle 103 can also be:
Similarly, each point on the substrate 104 corresponding to the paddle 103 is covered for an equal amount of time, and the received quantity of electricity is equal, resulting in a consistent electroplating height.
This example discloses an electroplating apparatus that includes all the structures of the electroplating apparatus in First embodiment, which will not be repeated here.
In addition, as shown in
To compare the electroplating results of an electroplating apparatus without the diffusion plate 107 and an electroplating apparatus with the diffusion plate 107 of the present invention,
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Unlike First embodiment, the paddle 103 has an angle α with the coordinate axis in the direction of the paddle arrangement, where a is less than 90°. Therefore, the coordinate of the paddle 103 is the projection of the actual position of the paddle 103 on the coordinate axis. As shown in
Obviously, due to the existence of the angle α, the actual distance the paddle 103 moves are greater, so the size of the angle α can be set according to the actual situation.
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Furthermore, as shown in
To prevent corrosive gases from corroding precision components, the driving mechanism 105, eccentric bearing 1010, and guide rail 109 are surrounded by a nitrogen protection box 1012.
The present embodiment discloses an electroplating apparatus, which includes all the structures of the electroplating apparatus in First embodiment, as shown in
Unlike First embodiment, as shown in
It should be noted that the limitation of the coordinate of the paddle 103 in each embodiment of the present invention is to reflect the translation distance of the paddle 103. In an electroplating process, the origin position of the coordinate axis can be arbitrarily specified.
To demonstrate the effect achieved by the present invention,
In summary, the present invention has been specifically and comprehensively disclosed through the above embodiments and related diagrams, enabling those skilled in the art to implement the invention. The above embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. The scope of the present invention should be defined by the claims of the present invention. Changes in the number of components or the substitution of equivalent components as described in this document should also be within the scope of the present invention.
Number | Date | Country | Kind |
---|---|---|---|
202110154928.5 | Feb 2021 | CN | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/CN2021/137466 | 12/13/2021 | WO |