CHENTING LIN

Person

POUGHKEEPSIE, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer electrode and method of forming the same
- Patent number 7,319,270
- Issue date Jan 15, 2008
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal chemical polishing process for minimizing dishing during semi...
- Patent number 6,943,113
- Issue date Sep 13, 2005
- Infineon Technologies AG
- Chenting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...
- Patent number 6,794,705
- Issue date Sep 21, 2004
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP uniformity
- Patent number 6,685,796
- Issue date Feb 3, 2004
- Infineon Technologies AG
- Chenting Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Wavelength-tunable semiconductor laser diode
- Patent number 6,459,709
- Issue date Oct 1, 2002
- Nova Crystals, Inc.
- Yu-Hwa Lo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods for crystallizing metallic oxide dielectric films at low te...
- Patent number 6,432,725
- Issue date Aug 13, 2002
- Infineon Technologies AG
- Jingyu Lian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMP uniformity
- Patent number 6,429,131
- Issue date Aug 6, 2002
- Infineon Technologies AG
- Chenting Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming an integrated barrier/plug for a stacked capacitor
- Patent number 6,420,267
- Issue date Jul 16, 2002
- Infineon Technologies AG
- Chenting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solute-enriched layer in a substrate surface an...
- Patent number 6,413,866
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Horatio S. Wildman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor stack structure and method of fabricating description
- Patent number 6,339,007
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Yun-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization after metal chemical mechanical polishing in semicond...
- Patent number 6,281,114
- Issue date Aug 28, 2001
- Infineon Technologies AG
- Chenting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended trench for preventing interaction between components of st...
- Patent number 6,222,220
- Issue date Apr 24, 2001
- Siemens Aktiengesellschaft
- Chenting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of enhancing semiconductor wafer release
- Patent number 6,132,294
- Issue date Oct 17, 2000
- Siemens Aktiengesellschaft
- Chenting Lin
- B24 - GRINDING POLISHING
Information Patent Grant
CMP process using indicator areas to determine endpoint
- Patent number 5,972,787
- Issue date Oct 26, 1999
- International Business Machines Corp.
- Karl E. Boggs
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Multi-Layer Electrode and Method of Forming the Same
- Publication number 20080108203
- Publication date May 8, 2008
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a (111) oriented BSTO thin film layer for high d...
- Publication number 20050196917
- Publication date Sep 8, 2005
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer electrode and method of forming the same
- Publication number 20050023590
- Publication date Feb 3, 2005
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wavelength-tunable semiconductor laser diode
- Publication number 20020101898
- Publication date Aug 1, 2002
- Nova Crystals, Inc.
- Yu-Hwa Lo
- B82 - NANO-TECHNOLOGY
Information Patent Application
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...
- Publication number 20020084481
- Publication date Jul 4, 2002
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-emitting laser devices with integrated beam-shaping optics...
- Publication number 20020003824
- Publication date Jan 10, 2002
- Yu-Hwa Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP UNIFORMITY
- Publication number 20010034134
- Publication date Oct 25, 2001
- CHENTING LIN
- B24 - GRINDING POLISHING

CHENTING LIN

Person

Patents Grantslast 30 patents

Multi-layer electrode and method of forming the same

Metal chemical polishing process for minimizing dishing during semi...

Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...

CMP uniformity

Wavelength-tunable semiconductor laser diode

Methods for crystallizing metallic oxide dielectric films at low te...

CMP uniformity

Method for forming an integrated barrier/plug for a stacked capacitor

Method of forming a solute-enriched layer in a substrate surface an...

Capacitor stack structure and method of fabricating description

Planarization after metal chemical mechanical polishing in semicond...

Extended trench for preventing interaction between components of st...

Method of enhancing semiconductor wafer release

CMP process using indicator areas to determine endpoint

Patents Applicationslast 30 patents

Multi-Layer Electrode and Method of Forming the Same

Method for forming a (111) oriented BSTO thin film layer for high d...

Multi-layer electrode and method of forming the same

Wavelength-tunable semiconductor laser diode

Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...

Surface-emitting laser devices with integrated beam-shaping optics...

CMP UNIFORMITY