Chew Hwee-Seng Jimmy

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip Interconnection Structure and Semiconductor Pack...
- Publication number 20110049708
- Publication date Mar 3, 2011
- Advanpack Solutions Pte. Ltd.
- Lim Shoa Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264526
- Publication date Oct 21, 2010
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090291530
- Publication date Nov 26, 2009
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20090102043
- Publication date Apr 23, 2009
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for testing semiconductor element, and manufactur...
- Publication number 20080150561
- Publication date Jun 26, 2008
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- G01 - MEASURING TESTING