Chi-Cheng Lai

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing semiconductor package
- Patent number 12,243,788
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,230,713
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with uneven gate profile
- Patent number 12,166,096
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna testing device for high frequency antennas
- Patent number 12,105,131
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Memory control system and memory control method
- Patent number 12,074,800
- Issue date Aug 27, 2024
- Realtek Semiconductor Corporation
- Chi-Shao Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package and method
- Patent number 12,074,143
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,062,586
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 12,015,017
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 11,923,349
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput, precise semiconductor slurry blending tool
- Patent number 11,858,086
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Chiu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid supply system and liquid preparation method
- Patent number 11,834,322
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fang-Pin Chiang
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Bonding passive devices on active device dies to form 3D packages
- Patent number 11,837,575
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for probing device-under-test
- Patent number 11,821,942
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuan-Hsiang Sun
- G01 - MEASURING TESTING
Information Patent Grant
Chemical dispensing system
- Patent number 11,817,329
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chieh Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segregated power and ground design for yield improvement
- Patent number 11,804,443
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing semiconductor package
- Patent number 11,769,698
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector used in underwater environments
- Patent number 11,757,228
- Issue date Sep 12, 2023
- Austin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 11,742,254
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding during wafer stage testing
- Patent number 11,726,112
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Nen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna testing device and method for high frequency antennas
- Patent number 11,726,122
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Chang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Method for performing data transmission control of inter field prog...
- Patent number 11,714,777
- Issue date Aug 1, 2023
- Realtek Semiconductor Corp.
- Chi-Shao Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate formation process
- Patent number 11,652,003
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,631,621
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with uneven gate profile
- Patent number 11,631,745
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...
- Publication number 20250015034
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- TSE-WEI LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Structure for Semiconductor Device and Method of Forming...
- Publication number 20240387397
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Gate Profile Optimization
- Publication number 20240379672
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS
- Publication number 20240377446
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang LAI
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240363591
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297163
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240243163
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CONTROL SYSTEM AND MEMORY CONTROL METHOD
- Publication number 20240220104
- Publication date Jul 4, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Chi-Shao LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID SUPPLY SYSTEM AND LIQUID PREPARATION METHOD
- Publication number 20240059549
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FANG-PIN CHIANG
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240047384
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-THROUGHPUT, PRECISE SEMICONDUCTOR SLURRY BLENDING TOOL
- Publication number 20240017372
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Wei CHIU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
APPARATUS FOR PROBING DEVICE-UNDER-TEST
- Publication number 20240012046
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Hsiang Sun
- G01 - MEASURING TESTING
Information Patent Application
MEMORY CONTROL SYSTEM AND MEMORY CONTROL METHOD
- Publication number 20230396552
- Publication date Dec 7, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- CHI-SHAO LAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHEMICAL DISPENSING SYSTEM
- Publication number 20230386867
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chieh HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20230369139
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES
- Publication number 20230352357
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS
- Publication number 20230333150
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang LAI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230253273
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure with Uneven Gate Profile
- Publication number 20230253470
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
- Publication number 20230110420
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROBING DEVICE-UNDER-TEST
- Publication number 20230068552
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Hsiang Sun
- G01 - MEASURING TESTING
Information Patent Application
CONNECTOR USED IN UNDERWATER ENVIRONMENTS
- Publication number 20230067836
- Publication date Mar 2, 2023
- Avertronics Inc.
- Austin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230053190
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE SUPPRESSING REFLOW OVEN
- Publication number 20230035154
- Publication date Feb 2, 2023
- ABLEPRINT TECHNOLOGY CO., LTD.
- Chih-Horng Horng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20230019013
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220367420
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Gate Profile Optimization
- Publication number 20220359511
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Cheng Lai

Person

Patents Grantslast 30 patents

Bonding passive devices on active dies to form 3D packages

Method of testing semiconductor package

Semiconductor device structure and methods of forming the same

Sensor packages

Semiconductor device structure with uneven gate profile

Antenna testing device for high frequency antennas

Memory control system and memory control method

Integrated circuit package and method

Semiconductor device structure with magnetic element

Package structure and manufacturing method of package structure the...

Package structure, package-on-package structure and method of fabri...

Package structure and method of manufacturing the same

Semiconductor structures

High-throughput, precise semiconductor slurry blending tool

Semiconductor device with multiple polarity groups

Liquid supply system and liquid preparation method

Bonding passive devices on active device dies to form 3D packages

Apparatus and method for probing device-under-test

Chemical dispensing system

Segregated power and ground design for yield improvement

Method of testing semiconductor package

Connector used in underwater environments

Sensor package and method

Electromagnetic shielding during wafer stage testing

Antenna testing device and method for high frequency antennas

Method for performing data transmission control of inter field prog...

Gate formation process

Under-bump-metallization structure and redistribution layer design...

Semiconductor device structure with magnetic element

Semiconductor device structure with uneven gate profile

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

Alignment Structure for Semiconductor Device and Method of Forming...

Transistor Gate Profile Optimization

ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS

INTEGRATED CIRCUIT PACKAGE AND METHOD

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

METHOD OF FABRICATING PACKAGE STRUCTURE

INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MEMORY CONTROL SYSTEM AND MEMORY CONTROL METHOD

LIQUID SUPPLY SYSTEM AND LIQUID PREPARATION METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

HIGH-THROUGHPUT, PRECISE SEMICONDUCTOR SLURRY BLENDING TOOL

APPARATUS FOR PROBING DEVICE-UNDER-TEST

MEMORY CONTROL SYSTEM AND MEMORY CONTROL METHOD

CHEMICAL DISPENSING SYSTEM

METHOD OF TESTING SEMICONDUCTOR PACKAGE

SENSOR PACKAGES

ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

Semiconductor Device Structure with Uneven Gate Profile

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...

SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS

APPARATUS AND METHOD FOR PROBING DEVICE-UNDER-TEST

CONNECTOR USED IN UNDERWATER ENVIRONMENTS

Integrated Circuit Package and Method

WARPAGE SUPPRESSING REFLOW OVEN

METHOD OF TESTING SEMICONDUCTOR PACKAGE

Integrated Circuit Package and Method

Transistor Gate Profile Optimization