Chi-Chuan Wu

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Adaptive noise suppression for touch screen displays
- Patent number 12,174,682
- Issue date Dec 24, 2024
- Dell Products L.P.
- Chi-Che Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with CPODE and related methods
- Patent number 12,166,034
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-coherent noise reduction for audio enhancement on mobile device
- Patent number 12,120,492
- Issue date Oct 15, 2024
- Mediatek Inc.
- Chi Sheng Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method for selecting a voltage on a barrel adapter inter...
- Patent number 12,107,423
- Issue date Oct 1, 2024
- Dell Products L.P.
- Wei-Cheng Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 12,094,887
- Issue date Sep 17, 2024
- E Ink Holdings Inc.
- Chia-Chi Chang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,783
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,080,638
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,074,070
- Issue date Aug 27, 2024
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,051,652
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a FinFET device
- Patent number 12,033,898
- Issue date Jul 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command transforming system and command transforming method
- Patent number 12,032,505
- Issue date Jul 9, 2024
- Realtek Semiconductor Corp.
- Cheng-Yuan Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for testing an integrated circuit
- Patent number 12,007,438
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Che Wu
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric supporting rod
- Patent number 12,000,193
- Issue date Jun 4, 2024
- HSIN CHONG MACHINERY WORKS CO. LTD.
- Chi-Wang Wu
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Audio processing device capable of dynamically switching comparison...
- Patent number 12,001,756
- Issue date Jun 4, 2024
- Realtek Semiconductor Corp.
- Yu Wei Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ion collector for use in plasma systems
- Patent number 11,996,276
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Otto Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boot control circuit of computer system
- Patent number 11,966,755
- Issue date Apr 23, 2024
- Pegatron Corporation
- Chi-Yu Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,899,166
- Issue date Feb 13, 2024
- Innolux Corporation
- Chi-Fang Wu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,239
- Issue date Feb 13, 2024
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit screening system and circuit screening method
- Patent number 11,852,682
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Che Wu
- G01 - MEASURING TESTING
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,852,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Halogen free flame-retardant materials and method for manufacturing...
- Patent number 11,840,656
- Issue date Dec 12, 2023
- Industrial Technology Research Institute
- Wen-Chung Liang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240429308
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240402541
- Publication date Dec 5, 2024
- E Ink Holdings Inc.
- Ting-Yung Lai
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER
- Publication number 20240395564
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240387198
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240379451
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN INSULATING FEATURE IN SEMICONDUCTOR DEVICE
- Publication number 20240379666
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371703
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363518
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240347467
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A FINFET DEVICE
- Publication number 20240347390
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION COLLECTOR FOR USE IN PLASMA SYSTEMS
- Publication number 20240290588
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Otto Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE NOISE SUPPRESSION FOR TOUCH SCREEN DISPLAYS
- Publication number 20240264654
- Publication date Aug 8, 2024
- Dell Products L.P.
- Chi-Che Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HYBRID BATTERY ELECTRICAL ENERGY OUTPUT DISTRIBUTION CONT...
- Publication number 20240217386
- Publication date Jul 4, 2024
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- DAO-QIN LIN
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADAPTER AND DATA TRANSMISSION METHOD UNDER LIMITED MEMORY
- Publication number 20240211421
- Publication date Jun 27, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHI RUNG WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for manufacturing electronic device
- Publication number 20240142671
- Publication date May 2, 2024
- InnoLux Corporation
- Chi-Fang WU
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128127
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240103220
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Gate Isolation Structures
- Publication number 20240107736
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SCREENING SYSTEM AND CIRCUIT SCREENING METHOD
- Publication number 20240094288
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-CHE WU
- G01 - MEASURING TESTING
Information Patent Application
SWITCHING POWER CONVERTER CIRCUIT AND CONVERSION CONTROL CIRCUIT AN...
- Publication number 20240097567
- Publication date Mar 21, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Hung-Yu Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Chi-Chuan Wu

Person

Patents Grantslast 30 patents

Adaptive noise suppression for touch screen displays

Semiconductor device with CPODE and related methods

Via for component electrode connection

Non-coherent noise reduction for audio enhancement on mobile device

System and method for selecting a voltage on a barrel adapter inter...

Display apparatus

Semiconductor device and method for fabricating the same

Package structure and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Package structure and method of fabricating the same

Method of fabricating a FinFET device

Command transforming system and command transforming method

Fan-out structure and method of fabricating the same

Integrated circuit package and method of forming same

Method and system for testing an integrated circuit

Structure and method of forming a joint assembly

Electric supporting rod

Audio processing device capable of dynamically switching comparison...

Ion collector for use in plasma systems

Encapsulated package including device dies connected via interconne...

Giga interposer integration through Chip-On-Wafer-On-Substrate

Boot control circuit of computer system

3DIC packaging with hot spot thermal management features

Via for semiconductor device connection and methods of forming the...

Method for manufacturing electronic device

Semiconductor device and method for fabricating the same

Circuit screening system and circuit screening method

Photonic semiconductor device and method of manufacture

Halogen free flame-retardant materials and method for manufacturing...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

Via for Component Electrode Connection

Integrated Circuit Package and Method

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS OF FORMING AN INSULATING FEATURE IN SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

METHOD OF FABRICATING A FINFET DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ION COLLECTOR FOR USE IN PLASMA SYSTEMS

Structure and Method of Forming a Joint Assembly

ADAPTIVE NOISE SUPPRESSION FOR TOUCH SCREEN DISPLAYS

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

METHOD OF HYBRID BATTERY ELECTRICAL ENERGY OUTPUT DISTRIBUTION CONT...

ADAPTER AND DATA TRANSMISSION METHOD UNDER LIMITED MEMORY

Method for manufacturing electronic device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Gate Isolation Structures

CIRCUIT SCREENING SYSTEM AND CIRCUIT SCREENING METHOD

SWITCHING POWER CONVERTER CIRCUIT AND CONVERSION CONTROL CIRCUIT AN...