Chi-Chun Liu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method to pattern pitch lines
- Patent number 12,148,617
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual color via patterning
- Patent number 12,113,013
- Issue date Oct 8, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner spacer formation for nanosheet transistors
- Patent number 12,046,680
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on scaffold film for forming topvia
- Patent number 11,688,636
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of back-end-of-line interconnects
- Patent number 11,682,558
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive via etch for MIMCAP
- Patent number 11,670,580
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 11,610,780
- Issue date Mar 21, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non volatile resistive memory logic device
- Patent number 11,600,325
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Direct extreme ultraviolet lithography on hard mask with reverse tone
- Patent number 11,501,969
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip identification formed by directed self-assembly
- Patent number 11,329,001
- Issue date May 10, 2022
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Litho-etch-litho-etch with self-aligned blocks
- Patent number 11,239,077
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-priming resist for generic inorganic hardmasks
- Patent number 11,226,561
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Chi-Chun Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method to create multilayer microfluidic chips using spin-on carbon...
- Patent number 11,192,101
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Back-end-of-line compatible processing for forming an array of pillars
- Patent number 11,195,995
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 11,171,002
- Issue date Nov 9, 2021
- Tessera, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-to-metal tip connections in multi-layer chips
- Patent number 11,139,242
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,133,260
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create multilayer microfluidic chips using spin-on carbon...
- Patent number 11,084,032
- Issue date Aug 10, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Large via buffer
- Patent number 11,075,161
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 11,031,248
- Issue date Jun 8, 2021
- Tessera, Inc.
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect device with reduced capacitance and resistance in sour...
- Patent number 11,004,737
- Issue date May 11, 2021
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient metal-insulator-metal capacitor
- Patent number 10,978,550
- Issue date Apr 13, 2021
- Tessera, Inc.
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for vertical FET gate length control
- Patent number 10,978,576
- Issue date Apr 13, 2021
- ELPIS TECHNOLOGIES INC.
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip security fingerprint
- Patent number 10,964,648
- Issue date Mar 30, 2021
- International Business Machines Corporation
- Kangguo Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing chemoepitaxy directed self-assembled defects
- Patent number 10,949,601
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Michael A. Guillorn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanosheet devices with improved electrostatic integrity
- Patent number 10,916,630
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain extension regions and air spacers for nanosheet field-...
- Patent number 10,892,328
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned tunneling field effect transistors
- Patent number 10,833,180
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having spiral conductive structures
- Patent number 10,784,333
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Peng Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Field effect device with reduced capacitance and resistance in sour...
- Patent number 10,755,976
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARTIFICIAL INTELLIGENCE ACCELERATOR USING MANTISSA QUANTIZATION SCHEME
- Publication number 20240419401
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Derrick LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Scalable Switch Capacitor Computation Cores for Accurate and Effici...
- Publication number 20240176584
- Publication date May 30, 2024
- International Business Machines Corporation
- Chia-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20240030036
- Publication date Jan 25, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY
- Publication number 20230170293
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO PATTERN PITCH LINES
- Publication number 20230138978
- Publication date May 4, 2023
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER SPACER FORMATION FOR NANOSHEET TRANSISTORS
- Publication number 20230114163
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF BACK-END-OF-LINE INTERCONNECTS
- Publication number 20230096938
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COLOR VIA PATTERNING
- Publication number 20230100368
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE VIA ETCH FOR MIMCAP
- Publication number 20230063908
- Publication date Mar 2, 2023
- International Business Machines Corporation
- YANN MIGNOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA
- Publication number 20220406657
- Publication date Dec 22, 2022
- International Business Machines Corporation
- SOMNATH GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON VOLATILE RESISTIVE MEMORY LOGIC DEVICE
- Publication number 20220172776
- Publication date Jun 2, 2022
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20210335619
- Publication date Oct 28, 2021
- Tessera, Inc.
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE COMPATIBLE PROCESSING FOR FORMING AN ARRAY OF PILLARS
- Publication number 20210210679
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIA
- Publication number 20210151377
- Publication date May 20, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET DEVICES WITH IMPROVED ELECTROSTATIC INTEGRITY
- Publication number 20210151565
- Publication date May 20, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHO-ETCH-LITHO-ETCH WITH SELF-ALIGNED BLOCKS
- Publication number 20210143013
- Publication date May 13, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE VIA BUFFER
- Publication number 20200395293
- Publication date Dec 17, 2020
- International Business Machines Corporation
- YANN MIGNOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP IDENTIFICATION FORMED BY DIRECTED SELF-ASSEMBLY
- Publication number 20200365519
- Publication date Nov 19, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-TO-METAL TIP CONNECTIONS IN MULTI-LAYER CHIPS
- Publication number 20200343186
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET DEVICES WITH IMPROVED ELECTROSTATIC INTEGRITY
- Publication number 20200343342
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN EXTENSION REGIONS AND AIR SPACERS FOR NANOSHEET FIELD-...
- Publication number 20200286992
- Publication date Sep 10, 2020
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT METAL-INSULATOR-METAL CAPACITOR
- Publication number 20200273947
- Publication date Aug 27, 2020
- Tessera, Inc.
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20200266066
- Publication date Aug 20, 2020
- Tessera, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING ELECTRICALLY NONCONDUCTIVE BLOCKS USING A POLYMER BRUSH...
- Publication number 20200243335
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT EXTREME ULTRAVIOLET LITHOGRAPHY ON HARD MASK WITH REVERSE TONE
- Publication number 20200234957
- Publication date Jul 23, 2020
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Yann MIGNOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED SOURCE AND DRAIN CONTACT EDGE WIDTH IN TWO-DIMENSIONAL MA...
- Publication number 20200144406
- Publication date May 7, 2020
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING CHEMOEPITAXY DIRECTED SELF-ASSEMBLED DEFECTS
- Publication number 20200134251
- Publication date Apr 30, 2020
- International Business Machines Corporation
- Michael A. Guillorn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSBAR REINFORCED SEMICONDUCTOR FINS HAVING REDUCED WIGGLING
- Publication number 20200135539
- Publication date Apr 30, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TUNNELING FIELD EFFECT TRANSISTORS
- Publication number 20200119168
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Yi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ETCH RATE REFERENCE LAYER FOR ENHANCED ETCH TIME PRECISION
- Publication number 20200105628
- Publication date Apr 2, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Chun Liu

Person

Patents Grantslast 30 patents

Structure and method to pattern pitch lines

Dual color via patterning

Inner spacer formation for nanosheet transistors

Spin on scaffold film for forming topvia

Fabrication of back-end-of-line interconnects

Subtractive via etch for MIMCAP

Alternating hardmasks for tight-pitch line formation

Non volatile resistive memory logic device

Direct extreme ultraviolet lithography on hard mask with reverse tone

Embedded chip identification formed by directed self-assembly

Litho-etch-litho-etch with self-aligned blocks

Self-priming resist for generic inorganic hardmasks

Method to create multilayer microfluidic chips using spin-on carbon...

Back-end-of-line compatible processing for forming an array of pillars

Alternating hardmasks for tight-pitch line formation

Via-to-metal tip connections in multi-layer chips

Self-aligned top via

Method to create multilayer microfluidic chips using spin-on carbon...

Large via buffer

Alternating hardmasks for tight-pitch line formation

Field effect device with reduced capacitance and resistance in sour...

Efficient metal-insulator-metal capacitor

Techniques for vertical FET gate length control

Chip security fingerprint

Reducing chemoepitaxy directed self-assembled defects

Nanosheet devices with improved electrostatic integrity

Source/drain extension regions and air spacers for nanosheet field-...

Self-aligned tunneling field effect transistors

Electronic devices having spiral conductive structures

Field effect device with reduced capacitance and resistance in sour...

Patents Applicationslast 30 patents

ARTIFICIAL INTELLIGENCE ACCELERATOR USING MANTISSA QUANTIZATION SCHEME

Scalable Switch Capacitor Computation Cores for Accurate and Effici...

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY

STRUCTURE AND METHOD TO PATTERN PITCH LINES

INNER SPACER FORMATION FOR NANOSHEET TRANSISTORS

FABRICATION OF BACK-END-OF-LINE INTERCONNECTS

DUAL COLOR VIA PATTERNING

SUBTRACTIVE VIA ETCH FOR MIMCAP

SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA

NON VOLATILE RESISTIVE MEMORY LOGIC DEVICE

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

BACK-END-OF-LINE COMPATIBLE PROCESSING FOR FORMING AN ARRAY OF PILLARS

SELF-ALIGNED TOP VIA

NANOSHEET DEVICES WITH IMPROVED ELECTROSTATIC INTEGRITY

LITHO-ETCH-LITHO-ETCH WITH SELF-ALIGNED BLOCKS

LARGE VIA BUFFER

EMBEDDED CHIP IDENTIFICATION FORMED BY DIRECTED SELF-ASSEMBLY

VIA-TO-METAL TIP CONNECTIONS IN MULTI-LAYER CHIPS

NANOSHEET DEVICES WITH IMPROVED ELECTROSTATIC INTEGRITY

SOURCE/DRAIN EXTENSION REGIONS AND AIR SPACERS FOR NANOSHEET FIELD-...

EFFICIENT METAL-INSULATOR-METAL CAPACITOR

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

FABRICATING ELECTRICALLY NONCONDUCTIVE BLOCKS USING A POLYMER BRUSH...

DIRECT EXTREME ULTRAVIOLET LITHOGRAPHY ON HARD MASK WITH REVERSE TONE

INCREASED SOURCE AND DRAIN CONTACT EDGE WIDTH IN TWO-DIMENSIONAL MA...

REDUCING CHEMOEPITAXY DIRECTED SELF-ASSEMBLED DEFECTS

CROSSBAR REINFORCED SEMICONDUCTOR FINS HAVING REDUCED WIGGLING

SELF-ALIGNED TUNNELING FIELD EFFECT TRANSISTORS

EMBEDDED ETCH RATE REFERENCE LAYER FOR ENHANCED ETCH TIME PRECISION